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Properties Investigation on Chip on Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)

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Figure

Fig. 1Schematic diagram of (a) TAB and (b) COF bonding.
Fig. 2TS bonding process using ACF. (a) Cleaning of the substrate, (b) pre-heating of ACF, (c) removal of the protecting film, and(d) chip alignment and ACF bonding with heating, pressure and ultrasonic vibration.
Fig. 3SEM-EDS analysis of the COF assembly bonded by the conventional TC bonding process
Fig. 5Shear strengths of the TC and TS COF assemblies.
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