Technical University of Košice
Faculty of Electrical Engineering and Informatics
DEPARTMENT OF TECHNOLOGIES IN ELECTRONICS
ANNUAL REPORT
2008
1 DEPARTMENT'S PROFILE
The Department of Technologies in Electronics (Katedra technológií v elektronike - KTE) is responsible for education of electrical engineers in the branch "Material Engineering" and also provides full education for Ph.D. students in the branch “Electrotechnology and Materials” for scientific division No. 26-35-9. Within the transition to new three step educational system is the department responsible for MSc. level degree course in Electronics (study program “Production Technologies in Electronics”) as well as for degree courses in “Electrotechnology and Materials” at PhD. level. The research and scientific works are focused on:
Standard and polymer thick film technology,
Surface mounting technology,
Complete technology for multichip modules,
2 STAFF
Professors: prof. Ing. Juraj Banský, PhD. prof. Ing. Alena Pietriková, PhD. prof. Ing. Stanislav Slosarčík, PhD. Dr.h.c. prof. Ing. Miloš Somora, PhD.
Assistant Professors: Ing. Pavol Cabúk
Ing. Slavomír Kardoš, PhD. Ing. Ľubomír Livovský, PhD.
Research staff: Ing. Ján Urbančík, PhD.
Ing. Igor Vehec, PhD. Igor Vehec
Secretary: Etela Tóthová
Internal Ph.D. Student: Ing. Juraj Ďurišin
External Ph.D. Student: Ing. Pavol Cabúk
3 EQUIPMENT
3.1. Teaching and Research Laboratories
Photolithographic Laboratory – laboratory for preparation and fabrication of photo-masks is appointed for thick film technology support including FODEL processing and/or for PCB production/cure. This laboratory also gives possibility for full screens treatment processes from design to final and production.
Laboratory of Thick film technology – laboratory includes complete line for production of thick film based Hybrid Integrated Circuits . It enables and supports general research, development and realization of prototypes and production of demonstrators from research in the fields of sensors production technology, High and Low Temperature Cofired Ceramics , and Polymer based Thick Film Technology.
Laboratory for Assembly and Surface Mounting Technology – laboratory enables piece- production and/or low-batch production of electronic devices. It includes equipment for components assembly, reflow soldering including precise lead-free soldering, reparations, and quality control of electronic devices in general.
Multi Chip Modules Laboratory - laboratory gives possibilities for all necessary processes from the design to manufacturing of Multi Chip Modules (MCMs-C) based on the Low Temperature Co-fired Ceramics.
Laboratory for general Measurements – laboratory is equipped with precise measurements system for general applications with support of LabWin software tools. Laboratory supports general research and quality and reliability parameters measurements.
3.2. Special Equipment and Measuring Instruments
The Department of Technologies in Electronics is equipped with complete technology line for the research, measurement and basic production in the fields of hybrid integrated circuits, surface mounting technology and multi chip modules technology. This line consists principally from:
CNC, milling/drilling machine TECHNODRILL C11 000 – basic tool for precise prototyping of Printed Circuit Board is equipped with well compatible software tool GLAAD 3. This machine supports general formats lik e HPGL, EXCELLON, GERBER, GCODE and DXF.
Quality inspection system ZoomTech 360 for check ing of Printed Circuit Boards and all other three dimensional electronics structures lik e for example MCMs.
M570 series of dual channel digital storage USB oscilloscope - allows user to measure waveforms using two independent channels with resolution of 8 bits and sensitivity from 10mV/div to 5V/div (80mVfs to 40Vfs) in 9 steps. ,
SDP Series Power Supplier with remote programming switching mode DC regulation
AGILENT 34420A – nano Volt / micro Ohm Meter, built in math operations including thermistor, thermocouple and RTD temperature measurements
Viscosity-meter HAAKE - viscosity measurement of specific and/or standard rheology properties of thick film pastes and soldering dopes for SMT
Batch Furnace with Programmable Profile - furnace for thermal processing of thick film structures which offers programmable thermal profiles,
Four Zones Conveyer Oven - standard furnace for thermal processing of thick film based technology,
Ultrasonic Wire Bonder - the basic equipment for assembly of chips to substrates, for wire bonding of active chips to the passive conductive layout on substrates,
Reflow Infrared Oven - for Surface Mounted Technology,
Unique device for vapor phase soldering (VPS) – own unique construction of high precise and reliable soldering of SMDs,
Cutting Plotter FC-2200-50M - for realization both of the conventional and substandard shapes of LTCC based substrates,
ATC Isostatic Lamination System - high-pressure isostatic lamination on hydraulics system for processing of the standard and MCM structures based on LTCC,
Programmable Furnaces PEO-602 and PEO-604 - furnaces for thermal processing of thick film structures which offers programmable thermal profiles,
MICROTRONIC-M2 – Screen-print equipment,
4 TEACHING
4.1. Undergraduate Study (Bc.) 4.2. Graduate Study (Ing.)
The bilingual lectures/exercises were opened during the academic year 2006/2007.
Subject Semester Lectures/exercises
(hours per week)
Name of Lecturer Fundamentals of Material Engineering 1 st 2/2 Banský Pietriková Vehec Materials and Technologies 3rd 3/2 Pietriková Electronic Engineering Materials 4 th 3/2 Pietriková Engineering Processes in Microelectronics I 7 th 3/3 Pietriková Engineering Processes in Microelectronics II 8 th 2/4 Slosarčík Integrated Circuits Technology 8th 2/2 Slosarčík CAD of Electronic Systems 8th 2/4 Livovský Semestral Project 8th 0/2 Pietriková Sensor Production
Technologies 9
th
2/3 Banský Assembly and Interconnection
Techniques 9
th
3/2 Somora
Control of Quality and
Reliability 9
th
3/2 Urbančík Testers and Measurements
Automation 9
th
2/3 Livovský Specific Chapters from
Electronic Technologies 10
th
4/0 Pietriková Diploma Project 10th 0/5 Pietriková
4.3. Undergraduate and Graduate Study for Foreign S tudents (In English Language)
Subject Lectures/exercises
(hours per week) Name of Lecturer Fundamentals of Material
5 PROJECTS
5.1. Research Projects
The LTCC potential in the 3D formed modules and their application in
Microsystems and hybrid sensors, Project VEGA no. 1/3138/06, coordinator:
Stanislav Slosarčík, members: all staff members, goals: The project solves several questions regarding the forming technology and progressive assembly techniques for 3D formed electronics modules based on LTCC and FODEL® materials. Consequently, it solves their reliability and quality problems, duration: 2006 - 2008.
Research and optimization of properties of unconventional thick films for
sensor and environmental applications, Project VEGA no. 1/3167/06,
coordinator: Alena Pietriková, members: all staff members, goals: The project solves several questions associated with design, development, preparation, and study of new materials, optimization of technology for new quality of interconnections in the electronics based on environmental materials, duration: 2006 - 2008.
Diagnostic and Optimization of Use of Environmental Materials for
Conductive Joints in Electronics (Diagnostika a optimalizácia použitia
ekologických materiálov pre vodivé spájanie v elektronike) – ENVIJOINT, Projekt no. SK-CZ-0065-07, coordinator: Alena Pietriková. The project solves several questions associated with design, development, preparation, and study of environmental materials aimed for joint in electronics, duration: 2008 – 2009
Innovation transfer and diversification of University education into the
assembly Technologies in Electronics (Transfer inovácií a diverzifikácia
vysokoškolského vzdelávania do montážnych technológií v elektronike), Project KEGA no. 1/6465/08. coordinator: Alena Pietriková, The project is aimed to operate the modular educational system for mounting technology as well as to producing university monograph, duration: 2006 – 2008
5.2. Educational Projects
E-Learning Education and Continuing Training to Electronics Assembling
Technology (ELECT2EAT) - Lifelong Learning Programme 2007-2013,
LEONARDO DA VINCI Multilateral projects for transfer of innovation No.: LPP-LdV-TOI-2007-HU-016. Project is oriented to update, transfer, integrate and adapt innovative training content into the e-learning system, including virtual factory, meeting the identified national and regional requirements with socio-cultural and linguistic context, duration: 2007 – 2009
Development of competences of educational staff by integrating
operational exploration tasks in measures of vocational training and further education (ComEd). LEONARDO DA VINCI DE/08/LLP-LdV/TOI/147
174. Project is oriented to Adapting and transferring the model for integration operational exploration tasks into vocational training and further education in the context of advancement of abilities and competences of education personnel for and in SME of micro- and nanotechnologies, duration: 2008 - 2010
6 CO-OPERATION
6.1. Co-operation in Slovakia
The Department of Technologies in Electronics has entered into the long-term based co-operation with:
6.1.1. Industrial partners
Molex Slovakia, a.s., Kechnec research, development, education
SENZOR, s.r.o., Košice development
Magneti Marelli Slovakia, s.r.o., Kechnec research, development, education
ELCOM, s.r.o., Prešov, research, development
PreDops, s.r.o., Prešov research, development, education
MICRONIC s.r.o., Kysak research, development, education
ELPRO, s.r.o., Košice development, education
6.1.2. Academic partners
All academic partners intensively co-operate on all of above fields – research, development and education, too:
Department of Electrotechnology, FEI STU Bratislava,
Department of Electronics and Electrotechnology, EF ŽU in Žilina,
Slovak Academy of Science, Košice,
6.2. International Co-operation
The Department of Technologies in Electronics has entered into long-term international co-operation with:
Zaklad Ukladow Elektronicznych, Politechnika Rzeszow, Poland
bilateral co-operation
Department of Electrotechnology,
FEL ČVUT Prague, Czech Republic bilateral SK Cz project HTW Dresden, Germany bilateral co-operation National Institute for R&D in Microtechnologies
(IMT-Bucharest), Romania
Leonardo
Romanian Association for Electronic and Software Industry (ARIES), Romania
Leonardo
University POLITEHNICA of Bucharest (UPB), Romania Leonardo Budapest University of Technology and Economics
(BME), Hungary
Leonardo
BWAW Thuringen gGmbH, Germany Leonardo Lust Hybrid-Technik GmbH, Hermsdorf, Germany Leonardo
6.2.1. Foreign Visitors to the Department
Mach, P.
FEL ČVUT Praha, CZ,
25.10. - 01.11.2008, working deal APVV Bušek, D.
FEL ČVUT Praha, CZ, 03. - 07.11.2008, working deal APVV Bušek, D.
FEL ČVUT Praha, CZ, 14. - 20.11.2008, working deal APVV Illyefalvi-Vitéz Zs.
BME Budapest, Hungary
02. - 04.12.2008, Leonardo,
Codreanu, N.
University Polytehnica of Bucharest, Romania
02. - 04.12.2008, Leonardo,
Svasta, P.
University Polytehnica of Bucharest, Romania
02. - 04.12.2008, Leonardo,
Stoichescu, D.A.
University Polytehnica of Bucharest, Romania
02. - 04.12.2008, Leonardo,
Protog, I.
University Polytehnica of Bucharest, Romania
02. - 04.12.2008, COST, 7FP
6.2.2. Visits of Staff Members to Foreign Institutions
Pietriková, A., Italy (Milano) 23.01 - 25.01.2008 Ďurišin, J., Germany (Hamburg), 03.03 - 07.03.2008 Slosarčík, S., Poland (Rzeszow) 14.3.2008
Vehec, I., Poland (Rzeszow) 14.3.2008
Slosarčík, S., CZ (Prague), 19.05. - 21.05.2008 Pietriková, A., Hungary (Budapest) 07.05. - 11.05.2008 Urbančík, J., Hungary (Budapest) 07.05. - 11.05.2008 Ďurišin, J., Hungary (Budapest) 07.05. - 11.05.2008 Pietriková, A., Greece (Athens), 09.09. - 12.09.2008 Pietriková, A., Romania (Brasov) 17.09. - 21.09.2008 Urbančík, J., Romania (Brasov) 17.09. - 21.09.2008 Slosarčík, S., CZ (Brno) 09.09. - 11.09.2008 Slosarčík, S., Poland (Rzeszow) 10.10.2008
Vehec, I., Poland (Rzeszow) 10.10.2008
Ďurišin, J., CZ (Prague) 23.10. - 02.11.2008 Pietriková, A., CZ (Prague) 26.10. - 27.10.2008 Pietriková, A., CZ (Prague) 14.11. - 23.11.2008 Urbančík, J., Germany (Erfurt) 11.12. - 13.12.2008 Pietriková, A., Germany (Erfurt) 11.12. - 13.12.2008
6.3. Membership in International Organizations and Societies Banský, J.
Pietriková, A.
Member of the International Steering Committee for International Spring Seminar on Electronics Technology – ISSE
Slosarčík, S.
Member of the International Steering Committee for IMAP S – Czech and Slovak
Pietriková, A.
Member of the European Steering Committee for ESTC (Electronic system-integration Technology Conference)
Banský, J.
Member of evaluation committee of Norway Financial Mechanism – EHP
Banský, J.
Member of RETRACK consortium
6.4. Membership in Slovak Organizations and Societies Banský, J.
Professor in Chair of the Slovak Commission for Ph.D. Study in the Branch 26-35-9 Electrotechnology and Materials
Banský, J.
Professor in Chair of the Departmental Commission in the Branch 5-2-12 Electrotechnology and Materials at FEI TU Košice
Banský, J.
Member of the Departmental Commission in the Branch 5-2-12 Electrotechnology and Materials at FEI STU Bratislava
Pietriková, A.
Member of Editorial Board „ACTA ELECTROTECHNICA ET INFORMATICA“
Slosarčík, S.
Member of the Slovak Metrology Society
Slosarčík, S.
Registrar of the Slovak Commission for Ph.D. Study in the Branch 26 - 35 - 9 Electrotechnology and Materials
Pietriková, A.
Member of Cultural and Educational Commission KEGA No.3
Pietriková, A.
Member of working team of the Accreditation Commission at Ministry of Education SR
7 THESES
7.1. Masters Theses
1. SZOMBATHY, T.: Technologické aspekty pre bezolovnaté spájkovanie metódou reflow (Technological Aspects for Lead-free Reflow Soldering, in Slovak, instructor: Vystavěl, R.)
hrubovrstvových technológií (Polymer Thick Film based Coils and their properties, in Slovak, instructor: Kardoš, S.)
8 OTHER ACTIVITIES 8.1. Inventions, patents
1. PIETRIKOVA, A., BÚGEL, M., NEUBAUER, M.: Spôsob výroby silikagélu s hladkým povrchom stien sférických častíc zo serpentinitu (Production technology of silica gel with smooth surface of spherical particles from serpentinit), Druh dokumentu - B6, Int. Cl. (2006): C01B 33/00. Banská Bystrica: Úrad priemyselného vlastníctva Slovenskej republiky, 2008. 6.
9 PUBLICATIONS 9.1. Journals
1. GABANI, S., FLACHBART K., PAVLIK V., PIETRIKOVA, A., GABANIOVA, M.: Microstructural analysis and transport properties of RuO2-based thick film
resistors ACTA PHYSICA POLONICA A, Volume: 113 Issue: 1, PL ISSN 0587-4246 (printed version), PL ISSN 1898-794X (electronic version), Pages: 625-628, Published: JAN 2008 (CC)
2. KAŤUCH, P., DOVICA, M., SLOSARČÍK, S., CABÚK, P.: Walking minirobots with compliant body, Elektrorevue: Informačný spravodaj. - ISSN 1336-8559. - Roč. 10, mimoriadne č. (2008), s. 34-36.
3. GMITERKO, A., KORDIAK, M., JEZNÝ, J., SLOSARČÍK, S.: Vplyv parazitnej dynamiky vibroizolácie na kvalitu riadenia polohového systému mechatronickej sústavy (Influence of parasitic dynamics of vibrate-insulation to quality control of mechatronic positional systems), Acta Mechanica Slovaca, roč.12, 3-B / 2008, s.237- 239.
4. PIETRIKOVÁ, A., KARDOŠ, S., DEMKO, D.: Nízkofrekvenčné vlastnosti plošných cievok na báze rôznych hrubovrstvových technológií (Low-frequency characteristics of thick film based surface planar coils), Informačný spravodaj. - ISSN 1336-8559. Roč. 10, mimoriadne č. (2008), s. 31-33
5. PIETRIKOVÁ,A., ĎURIŠIN, J.: Mechanické skúšky spájkovaných spojov (Mechanical tests of soldered joints), In: on line Journal ElectroScope, http:/electroscope.zcu.cz, roč. 2008, č. IV, ISSN 1802-4564
9.2. Abroad reviewed Conferences
1. PIETRIKOVÁ, A., ĎURIŠIN, J., LIVOVSKÝ, Ľ., URBANČÍK, J.: Microstructure analysis and measurement of nonlinearity of vapor phase reflowed solder joints, 31st International Spring Seminar on Electronics Technology. P. 365-368. Budapest: Budapest University of Technology and Economics, Department of Electronics Technology, 2008. ISBN 978-963-06-4915-5
2. LIVOVSKÝ, Ľ., PIETRIKOVÁ, A., ĎURIŠIN, J.: Monitoring of the temperature profile of vapor phase reflow soldering, 31st International Spring Seminar on
Technology and Economics, Department of Electronics Technology, 2008. ISBN 978-963-06-4915-5
3. MACH, P., RICHTER, L., PIETRIKOVÁ, A.: Modification of electrically
conductive adhesives for better mechanical and electrical properties. In: ISSE 2008: 31th International Spring Seminar on Electronics Technology. P. 230-235. Budapest: Budapest University of Technology and Economics, Department of Electronics Technology, 2008. ISBN 978-963-06-4915-5
4. PIETRIKOVÁ, A., ĎURIŠIN, J., URBANČÍK, J.: Reliability of Pb-free solder joint under different Test conditions, In: SIITME 2008: Conference proceedings. P. 85-88. Brasov: Transilvania University of Brasov, 2008. ISSN 1843-5122. 5. URBANČÍK, J., PIETRIKOVÁ, A.: Reliability aspect of polymer thick film
interconnections in hybrid circuits: In: SIITME 2008: Conference proceedings. P. 111-114. Brasov: Transilvania University of Brasov, 2008.ISBN 1843-5122 6. ILLYEFALVI-VITÉZ, Zs., SVASTA, P., CODREANU, N., PIETRIKOVÁ, A.:
E-learning training system for electronics assembling technology In: SIITME 2008: Conference proceedings. P. 356-360. Brasov: Transilvania University of Brasov, 2008. ISSN 1843-5122.
7. PIETRIKOVÁ, A., ĎURIŠIN, J.: Microstructure evolution of vapor phase reflowed tin-silver-copper solder alloy, In: AEI '2008: International Conference on Applied Electrical Engineering and Informatics. P. 83-86. Košice: FEI TU, 2008.
ISBN 978-80-553-0066-5
8. URBANČÍK, J., PIETRIKOVÁ, A.: Technological approach to design and reliability of interconnections in LTCC multilayer modules, In: AEI '2008: International Conference on Applied Electrical Engineering and Informatics. P. 149-152. Košice: FEI TU, 2008. ISBN 978-80-553-0066-5
9. MACH, P., RICHTER, L., PIETRIKOVÁ, A.: Testing of techniques for improvement of conductivity of electrically conductive adhesives, In: ESTC 2008: 2nd Electronics System-Integration Technology Conference. P. 305-308. London: University of Greenwich, 2008. ISBN 978-1-4244-2814-4
10. MACH, P., RADEV, R., PIETRIKOVÁ, A.: Electrically conductive adhesive filled with mixture of silver nano and microparticles, In: ESTC 2008: 2nd Electronics System-Integration Technology Conference. P. 1141-1146. London: University of Greenwich, 2008. ISBN 978-1-4244-2814-4
9.3. Domestic International reviewed Conferences
1. PIETRIKOVÁ, A., ĎURIŠIN, J.: Microstructure of vapor phase reflowed SAC solder alloy. In: Materiál v inžinierskej praxi 2008: Zborník 7. medzinárodnej vedecko-technickej konferencie. S. 23-26. Košice: TU, 2008.