Intel IT Redefines the High Density Data Center: 1,100 Watts/Sq. Ft

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Intel IT Redefines the High Density

Data Center: 1,100 Watts/Sq. Ft

John Musilli- SR Data Center Architect

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Legal Notices

This presentation is for informational purposes only. INTEL MAKES NO WARRANTIES, EXPRESS OR IMPLIED, IN THIS SUMMARY.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries

The information contained in this presentation is based on results from Intel’s data center design. Intel’s design is specific to our environmental needs. Other data

center requirements may differ.

* Other names and brands may be claimed as the property of others.

Copyright © 2014, Intel Corporation. All rights reserved.

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Business Challenge

Increasing Compute is key to getting new product designs Especially SoC (System on a Chip) to

market. Intel IT’s challenge is to deliver more compute to our design engineers, achieving

industry best Cap-X, and industry best Op-X cost models.

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DC 2

DC 3

DC1

HDDC

5MW

5KSF

=

~5MW in

43 KSF

Old Density Model 2005 - 2013

Cost Advantages/Economies of Density roughly works like Moore’s Law –

As you put more kW into each SqFt of computer room the cost per KW

goes down

90nM*

<22nM*

Key Innovation

New Density Model >2014

Key Innovation in HDDC:

High density power design lowers

construction cost inside the room.

* New density model is the

equivalent ratio of space

reduction of a 90nM die as

compared to a 10nM die.

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• 1.1 MW in 40 Rack per Cold Aisle

• 240 Servers and 960 Cores per Rack

• 35% more EDA performance, 46% less power, 60% more

density

• Up to 43 kW/rack

(1.5x previous high density)

• Free air cooling

(a<95F Intake, except 39 hours/yr.)

• 1100 W/sq. ft. Density

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800A- 415/240vac Bus Power

Distribution 575kW per bus

• Ease of use

• Flexibility

• Reliability

3 phase 60amp

branch circuits

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Top of Server rack

_{Inside Hot Aisle}

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Reliability: Power Quality Data From June

2011 – December 2013

22%

19%

59%

Percentage of Power Quality Incidents by

Type

Outside IT

Equipment

Design

Specificati

ons

Within IT

Equipment

Design

Operating

Specificati

ons

Within IT

Equipment

Recommen

ded

Operating

Specificati

ons

Total Power

Quality Incidents

27 Incidents with

Multi Phase

Impact

0 Longest Duration

(Sec)

0.117 Description

SAG Voltage

(VAC)

Actual Number of

Incidents

Outside IT

Equipment Design

Specifications

145 - 180

6 Within IT

Equipment

Designed

Operating

Specifications

180 - 200

5 Within IT

Operating

Specifications

200 - 215

16

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Results/Conclusions

• Key Opportunity: Respond to computing demand with a retrofit of

decommissioned Wafer Fab

• Key Innovation: High density power design lowers construction cost

inside the room.

o

Inside DC Fit Up at $2,832/kw or $3,625/SqFt

o

43 kW/rack is 1.5 X greater than previously delivered

o

1,100 W/SqFt. is 10 times the industry average

• Key Behavior: Designed with a business appropriate level of facility

hardening and redundancy (Tier 1)

o

The design from the start used the local Utility power quality and reliability as a

specific design assumption

o

The utility power quality and reliability met the customer up time requirements for the

intended compute for the data center

• PUE Trends are exceeding the Design Goal of 1.1

o

Ability to rely on cost-effective 100 percent free air cooling for all but 39 hours per