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A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching

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Figure

Figure 10 A few examples of the microstructures in silicon wafer where undercutting at convex corners is absolutely undesirable.
Figure 11 Etching characteristics of KOH solutions at 80°C without and with different alcohol additives [133]
Figure 12 Etching characteristics of pure and surfactant (Triton X-100) added 25 wt% TMAH: (a)-(c) 3D distribution and 2D plot of theetch rates [38]; (d) etched profiles of the convex corners (e) undercutting ratio (l/d) at different temperatures (f) Micromachining ofalphabet letters in Si{100} using (i) pure TMAH and (ii) TMAH + Triton.
Figure 14 Schematic representation of the surfactant adsorption at the silicon atoms of the convex corners, which belong to {110}planes, in surfactant-added TMAH solution during etching process
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