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The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints

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Figure

Table 1Composition, Melting Temperature, Undercooling and Micro-hardness of As-received Sn-Ag-Cu BGA Solder Balls.
Figure 2 exhibits another example of an as-assembledmicrostructure in Sn-2.5Ag-0.9Cu solder joints with a
Fig. 4Comparison of the thermal fatigue life of Sn-Ag-Cu solder joints ofCBGA carriers mounted on an organic PCB tested under the ATCcondition of 0 to 100�C with a 120-min cycle time.
Table 2Average Fatigue Life (N50) Estimated from ATC Failure Data of Sn-Ag-Cu BGA Solder Joints.
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