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Investigation of Precision Grinding Process for Production of Silicon Diaphragms

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Figure

Fig. 1 Schematic cross section of the precision grinding system forsilicon.
Fig. 2 Fabrication flow process for thin-diaphragm test structures.
Table 1 Range of bending magnitudes within a wafer for each thickness of 6 mm diam diaphragms.
Fig. 4 Illustration of the mechanism of diaphragm bending forma-tion during grinding.
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