ball solder joint reliability
Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy SAC405
... Pb-free solder in the past years because of emerging environment regulations 1 ...the reliability aspect of the solder joint as no other alternative alloy was able to replace the lead-tin ...
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Design of experiments of electromigration reliability for solder joints of a wafer level chip scale package
... a solder system of a flip chip or a CSP, the failure phenomenon of electromigration has been found inside the solder joint which is adjacent to the under bump metallization (UBM) layer ...the ...
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Modeling and Mode Shape Extraction of Ball Grid Array Package on Printed Circuit Board Soldered using Lead Free Solder Alloy – SAC405
... chip solder joint fatigue life ...the solder joint reliability of BGA packages under random vibration loading, vibration reliability test of PCB assembly was done by using ...
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Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process
... the solder and Cu ...Sn-Ag-Cu solder is much thicker than that for the Sn-Pb eutectic ...drop reliability and long-term reliability of the soldered ...drop reliability, a ball ...
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Influence of an Immersion Gold Plating Layer on Reliability of a Lead Free Solder Joint
... the ball shear ...the joint interface using the 150 nm-thick Au ...the joint interface in ...the solder from deforming uniformly in the shear ...during solder deformation due to ...
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Reliability of Solder Joint with Sn Ag Cu Ni Ge Lead Free Alloy under Heat Exposure Conditions
... SACNG solder, the formation phases in the solder grow up to several-micron meters after heat exposure ...the solder ball joint with the SACNG solder and the Cu pad after heat ...
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Reliability analysis of lead free solder
... eutectic solder and copper ...eutectic solder element thickness must be ...the solder ball and solder mask material elements not be joined in the finite element ...between solder ...
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Pb-Free Solder Ball Robustness Comparison under AC and TC Reliability Test
... the ball shear strength for polymer core solder balls is significant higher than SAC 387, after subjected to the AC reliability ...TC reliability stress test, the ball shear strength ...
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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint
... of reliability with or without Pd in the process of applying the surface finish, ENIG is plated at a thicknesses of Ni-P and Au of 5 mm and ...the solder ball is aligned on the metal pad using an ...
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Reliability Estimation of Solder Joints Under Thermal Fatigue with Varying Parameters by using FORM and MCS
... of solder joint highly depends on the degree of accurate modeling of the stress and strain related to the strength of the solder ...in solder joints is considered to be thermo-mechanical ...
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Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode
... SA joint, although the main fracture mode was IMC fracture, the solder fracture mode was also observed in as-reflow ...SAC joint as shown in ...
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Shear Fracture Behavior on Ball Grid Arrayed Tin Silver Copper Solder/Pure Copper Pad Joint Interface
... 3Ag joint interface and of only reaction layer, ...the solder and brittle deformation area of the intermetallic compound can be seen in ...the solder and the reaction ...the solder [arrows in ...
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Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn 3 5Ag 0 75Cu Solder
... in solder to brittle fracture (i) at the interface between solder and intermetallic compound, (ii) within the intermetallic compound and (iii) between two intermetallic compound ...a solder ...
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Welding Path Planning of welding Robot Based on Improved Ant Colony Algorithm
... next solder joint mainly depends on the concentration of pheromones and the distance between the two solder joints, and pheromone concentration and the length of the distance between the ...
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Mechanical Strength and Microstructure of BGA Joints Using Lead Free Solders
... as-reflowed solder joints using middle P-type Ni plating and various ...different joint mor- phologies of each solder, these fracture loads do not always correspond to the joint strengths, but ...
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Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
... SZA solder joint of both interface between the SAC solder ball/SZA solder joint reflowed at ...the solder and the Cu ...SAC solder ball and SZA solder ...
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Influence of Shear Height on Shear Strength of Tin Lead Solder Ball Bonding
... Each ball was put on each Cu pad on the print board (square 10 × 10 mm 2 ) with a tweezers after the com- mon flux liquid was applied on the Cu ...m. Ball melting appearance was monitored on TV during the ...
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Estimation of Solder Ball Collapse Height in Semiconductor Packaging Using Theoretical and Solid Modeling Techniques
... the solder mask opening diameter at 300 µm and . The required solder ball collapse height was around 100 ...the solder ball height was set at an arbitrary ...
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Electromigration Effects upon Interfacial Reactions in Flip Chip Solder Joints
... 99.99 mass% purities were cut into the 20 mm 10 mm size. The Cu and Ni foils were rinsed in a flux solution and then placed in a graphite mold vertically. Pure Sn was melted in a furnace and then poured into the graphite ...
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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
... Sn-58Bi solder used in this study was a com- mercially available Sn-Bi solder ...Sn-Bi-Zn solder alloy was prepared in-house by dissolving a Zn wire ...molten solder was stirred me- chanically ...
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