BGA solder joint reliability
Analysis of BGA Solder Joint Reliability for Selected Solder Alloy and Surface Finish Configurations
... specifications. Solder alloys and surface finishes for package substrates (and PWBs) must meet the Pb-free requirements without resulting in reduced solder joint ...and solder joints continue ...
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Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint
... mass%) BGA balls with a diameter of 450 mm and a rigid PCB (FR-4), which is an SMD (Solder Mask Defined) type board with a thickness of ...of reliability with or without Pd in the process of applying ...
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Improvement of Board Level Reliability for µBGA Solder Joints Using Underfill
... underfilling BGA as an alternative to direct chip attachment for high density packaging technologies have been ...level reliability for underfilled BGA ...the solder joints during thermal ...
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Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
... Au-Sn solder, 3) but considered the efficient transmission of optical signal, flip-chip using thermo-compression bonding process is limited because of the alignment of optical ...the solder reflow process that ...
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Probability of Failure for the Thermal Fatigue Life of Solder Joints in BGA Packaging using FORM and MCS Methods
... for solder joints as known as thermal ...critical solder joint under thermal cycle ...critical solder joint of the microelectronic packaging is defined using two methods of numerical ...
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Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
... In/Sn solder joints with and without NCA before thermal cycling are shown in Table ...all solder joints were measured between 10 and 14 m and no solder joints failed ...the solder joint ...
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A Reliability Study of Nanoparticles Reinforced Composite Lead Free Solder
... composite solder with low melting point. The composite solder was prepared by adding ...composite solder paste by using conventional surface mount ...composite solder joint after ...
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Electromigration Effects upon Interfacial Reactions in Flip Chip Solder Joints
... The solder is the conventional Pb-Sn eutectic solder, and the dark phase is the Pb ...two-phase solder microstructure is quite uniform before the current stressing, apparently the Pb phase tends to ...
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Effects of Solder Paste Volume on PCBA Assembly Yield and Reliability
... the solder paste after printing is a potential way to eliminate or reduce most of the ...term reliability is ...after solder paste printing by deploying in-line SPI ...
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Properties of Solder Joints Using Sn Ag Bi In Solder
... a solder joint using Sn-3.5Ag-0.5Bi- 8In solder was then ...Sn-3.5Ag-0.5Bi-8In solder under the same conditions is shown in ...of solder, indium was dispersed over the entire Sn area of ...
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Effect of substrate surface condition on thermal cycling behavior of lead-free solders
... as solder with a relatively low melting point compared with the printed circuit board and electronic components, typically a melting point below 315°C ...Pb-free solder replacement results in finding of ...
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Reliability of Solder Joint with Sn Ag Cu Ni Ge Lead Free Alloy under Heat Exposure Conditions
... the solder ball joints shown in ...the joint interface are refined, those located at some distance from the joint interface are dendritic in the all ...the joint interface, the electrode ...
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Mechanical Strength and Microstructure of BGA Joints Using Lead Free Solders
... as-reflowed solder joints using middle P-type Ni plating and various ...different joint mor- phologies of each solder, these fracture loads do not always correspond to the joint strengths, but ...
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Effect of Zn Addition on Interfacial Reactions Between Sn Bi Solder and Cu Substrate
... Sn-58Bi solder used in this study was a com- mercially available Sn-Bi solder ...Sn-Bi-Zn solder alloy was prepared in-house by dissolving a Zn wire ...molten solder was stirred me- chanically ...
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Bi-Xenon Retrofit DIY Instructions
... 3. Cut the cap off the fuse holder. Insert a 5 amp blade fuse. Epoxy the fuse-holder to the side of the relay with the part number on it (see photo #4). Cut one of the fuse holder leads to length of 4in. Slide heat ...
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Improvement on Thermal Fatigue Properties of Sn 1 2Ag 0 5Cu Flip Chip Interconnects by Nickel Addition
... Even though both size and silver content are different, it can be also expected for solder bumps in several hundred diameters that an addition of a small amount of nickel into Sn-xAg-0.5Cu (x: 1 to 2) solders ...
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Built in reliability design of highly integrated solid state power switches with metal bump interconnects
... the reliability of the design cases CHC25 and CMB13 subjected to thermal cycling between -55 ºC and +150 ºC as shown in ...The reliability of the assembled samples during the thermal cycling test was ...
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Protecting Printed Circuit Boards from Harsh Vibration Environment
... and solder joints of electronic packages, loosening of PCB fastening screws, cracking of PCB itself and finally malfunctioning of electronic ...the reliability of electronic equipment, it is necessary to ...
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Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
... of BGA 225 with SZB solder joint and SAC solder ball on an OSP ...SAC solder ball, as shown in ...SZB solder joint and SAC solder ball on an OSP PCB were smaller ...
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Microstructure and Strength of Sn Bi Coated Sn 3 5 mass%Ag Solder Alloy
... coated solder ball The Sn-Bi layer was electroplated on the ...mass%Ag solder ball to evaluate the possibility of applying the Sn-Bi coated ...mass%Ag solder at a real soldering ...mass%Ag ...
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