• No results found

flip chip electronic packaging

Comparison of Flip Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I  Flip Chip Bonding on Rigid Substrates

Comparison of Flip Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I Flip Chip Bonding on Rigid Substrates

... the chip bump and substrate pad and their deformation during flip-chip ...a flip-chip joint, the for- mer is mainly fixed by the volumetric content and distribu- tion of conductive ...

5

Finite Element Analysis of Mechanical Stress in Flip Chip Ball Grid Array using 
              ABAQUS

Finite Element Analysis of Mechanical Stress in Flip Chip Ball Grid Array using ABAQUS

... in electronic packaging recently has given greater importance to the manufacturers of predicting the thermal distribution of area-array solder ...for flip chip package is getting finer and ...

10

Carbon nanotube bumps for the flip chip packaging system

Carbon nanotube bumps for the flip chip packaging system

... Flip chip technology is one of the off-chip interconnect methodologies used in electronic ...for flip chip bump pitches will be shrinking them beyond 150 μm ...future flip ...

8

Dynamics Modeling and Optimization of Beam in Flip Chip of LED Based on Rayleigh Method

Dynamics Modeling and Optimization of Beam in Flip Chip of LED Based on Rayleigh Method

... LED chip manufacturing has been important position in the national production, its domestic and international technology development has got widespread ...the chip packaging technology is toward high ...

6

Experiment and analysis on stress of flip chip bonding process

Experiment and analysis on stress of flip chip bonding process

... in chip level is one of the core technology of the ...bonding, flip chip bonding[2]and wafer bonding. At present, the packaging I/O ports are becoming more and more, and the performance ...

7

Micro electronic systems via multifunctional additive manufacturing

Micro electronic systems via multifunctional additive manufacturing

... of electronic packaging is contingent on the integration of smaller packaging technology with this multifuctional additive manufacturing process, facilitating the demonstration of chip scale ...

30

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

... The exploitation of PCB embedding has started on a bilateral base beside the technology development in HERMES. HERMES is the European spear head to drive the development of the customer base and the business by ...

40

Automatic Visual Inspection of Bump in Flip Chip using Edge Detection with Genetic Algorithm

Automatic Visual Inspection of Bump in Flip Chip using Edge Detection with Genetic Algorithm

... Thailand is one of the largest exporter countries hard disk products with an export value of more than 400 million baht by the year. In our country, HDD industry has a relatively short but fascinating history. In the ...

6

Applications of multi walled carbon nanotube in electronic packaging

Applications of multi walled carbon nanotube in electronic packaging

... Electronic packaging is to protect and cool the micro- electronic chips as well as to provide electrical and mechanical connections between the chip and the out- side ...

7

[I995.Ebook] Free PDF Thermal Management Handbook For Electronic Assemblies Electronic Packaging And Interconnection Series By Jerry Sergent Al Krum.pdf

[I995.Ebook] Free PDF Thermal Management Handbook For Electronic Assemblies Electronic Packaging And Interconnection Series By Jerry Sergent Al Krum.pdf

... heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design ...

9

Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint

... The shear strength and failure behaviors of the Sn-2.3 mass%Ag flip-chip solder joints before and after corrosion test were investigated. The relationships between the shear strength, corrosion amount, and ...

6

Co design/simulation of flip chip assembly for high voltage IGBT packages

Co design/simulation of flip chip assembly for high voltage IGBT packages

... At present, most LED driver systems are based on vertical MOSFET devices. The vertical design of the Power MOSFET, where high voltage terminal is at the back of the die and low voltage terminals are at the front, imposes ...

5

Thermoelectric Thin Film Device of Cross Plane Configuration Processed by Electrodeposition and Flip Chip Bonding

Thermoelectric Thin Film Device of Cross Plane Configuration Processed by Electrodeposition and Flip Chip Bonding

... difficult to control the coplanarity of the electrodeposited Bi­ Te and Sb­Te leg heights. Also, the surface roughness as well as the flatness of the electrodeposited thin film legs was very critical for flip-chip ...

6

WRL 89 10 pdf

WRL 89 10 pdf

... of chip crossings likely for each level of ...adder chip and go through a chip containing result forwarding ...VLSI chip is ...two chip crossings would be required per floating-point ...

21

The Electronics Packaging & Flexible Electronics Centers at Binghamton University

The Electronics Packaging & Flexible Electronics Centers at Binghamton University

... The IEEC will conduct transformational research in the area of electronic systems integration and packaging that will have a broad impact on society and our partners and will contribu[r] ...

27

Implications of phosphor coating on the thermal characteristics of phosphor-converted white LEDs

Implications of phosphor coating on the thermal characteristics of phosphor-converted white LEDs

... Although flip-chip bonding offers a more effective heat dissipating capability as compared to conventional bonded LEDs, the flip-chip bonded LEDs exhibit a slightly lower optical efficiency ...

7

A Survey of VLSI Techniques for Power Optimization and Estimation of Optimization

A Survey of VLSI Techniques for Power Optimization and Estimation of Optimization

... Abstract-With the advancement in compact, portable and high-density micro-electronic devices and systems, the power dissipated in very large scale integrated (VLSI) design circuits has become a critical concern. ...

5

ERSASCOPE 2 plus - The Lead Free Generation of BGA and Optical Inspection Systems. Complete Lead Free Soldering & Inspection Solutions.

ERSASCOPE 2 plus - The Lead Free Generation of BGA and Optical Inspection Systems. Complete Lead Free Soldering & Inspection Solutions.

... The new ERSASCOPE 2 plus optical system comes standard with three specially designed robust optical heads to meet specific inspection needs. The standard 90° optical head provides the award winning ERSASCOPE quality ...

6

Research on Green Express Packaging Design under the Electronic Commerce

Research on Green Express Packaging Design under the Electronic Commerce

... original packaging. We call the secondary packaging express packaging ...Express packaging mainly plays the role of transport ...express packaging is composed of three parts consisting ...

9

Analysis of Characteristics of the Forecast Jump in the NCEP Ensemble Forecast Products

Analysis of Characteristics of the Forecast Jump in the NCEP Ensemble Forecast Products

... “the flip-flop”, for a future in the same moment of forecast, forecasting the continuous found many times forecast of different starting moment occurred on the forecast of two adjacent to the starting time of ...

10

Show all 10000 documents...

Related subjects