In/Sn
Effect of Sn Addition on the Mechanical and Electrical Properties of Cu 15%Cr In Situ Composites
... of Sn addition to Cu–15%Cr in-situ composite As was expected from the conventional Cu–Sn alloys (bronze), the addition of Sn in Cu–15Cr in-situ composites is effective to increase the strength of cold ...
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Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
... Abstract: Miniaturization of electronic devices has led to the development of 3D IC packages which require ultra-small-scale interconnections. Such small interconnects can be completely converted into Cu-Sn based ...
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The role of intestinal UDP-glucuronosyltransferases in 7-ethyl-10-hydroxy-camptothecin (SN-38) conjugation and toxicity
... MRP2), SN-38 carboxylate biliary clearance was reduced whereas for the lactone form it was unchanged, suggesting a role of mrp2 in the hepatic transport of only the carboxylate (Chu et ...1997). SN-38 ...
213
The Glycoprotein and the Matrix Protein of Rabies Virus Affect Pathogenicity by Regulating Viral Replication and Facilitating Cell-to-Cell Spread
... in SN-BG-infected cells was significantly lower than that in SN-infected cells, suggesting that RV G regulates viral growth at the RNA level; this result was consistent with our previous finding that the ...
9
Mechanism and Prevention of Spontaneous Tin Whisker Growth
... the Sn–2 to 5 mass%Cu directly on Cu leadframe without the Ni diffusion ...the Sn is supersaturated with Cu, it will not take more Cu from the ...the Sn–2 to 7 mass%Cu finish on the ...the Sn 2 ...
9
Fatigue Damage Evaluation by Surface Feature for Sn 3 5Ag and Sn 0 7Cu Solders
... in Sn–3.5Ag and Sn–37Pb ...of Sn–3.5Ag, Sn–0.7Cu and Sn–37Pb solders decreased with the increasing number of cycles, and it became smaller in a small strain range and its rate were ...
9
Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
... The average contact resistance of the eutectic In/Sn solder joints with and without NCA before thermal cycling are shown in Table 1. The average contact resistance values of all solder joints were measured between ...
7
sn metrizable spaces and related matters
... cs-networks. sn-metrizable spaces [6] (i.e., spaces with σ-locally finite sn-networks) are one class of generalized metric spaces, and they play an important role in metrization theory, see [6, ...on ...
9
Accuracy Improvement of PLIC VOF Volume Tracking Method Using the Equation of Surface Normal Vector
... bines the Equation (4) directly with the PLIC reconstruc- tion and DDR advection algorithm [14], and found that the method allows us to track subgrid particles [15]. The capability of the PLIC/SN method was ...
7
Investigation of SnO2-modified LiMn2O4 Composite as Cathode Material for Lithium-ion Batteries
... Mn 4+ ions were partially replaced by Sn 4+ after doping in an attempt to increase the concentration of Mn 3+ on the surface, and at the same time, induce more Mn 2+ dissolution into electrolyte. In present work, ...
14
Synthesis of Germanium Tin Alloys by Ion Implantation and Pulsed Laser Melting: Towards a Group IV Direct Band Gap Semiconductor
... of Sn in ...between Sn and Ge under equilibrium conditions are: (1) the liquid phase at a temperature beyond ...of Sn in Ge is ...of Sn in Ge reduces as the temperature is lowered, such as ...
150
Metallurgy and Kinetics of Liquid Solid Interfacial Reaction during Lead Free Soldering
... solders, Sn–Ag eutectic (96.5%Sn–3.5%Ag), Sn–Cu eutectic ...and Sn–Ag–Cu eutectic ...immersion Sn, and Ni/Au, in addition to mechanically polished pure copper ...
9
Exceptionally efficient and recyclable heterogeneous metal organic framework catalyst for glucose isomerization in water
... Tailor-made MOFs with desired functionalities have made it possible to achieve exceptionally efficient catalysts for glucose isomerization in water. UiO-66-MSBDC catalysts containing dual acidity, Lewis and Brønsted, ...
6
Experimental Observation on Solid State Reactive Diffusion between Sn Ag Alloys and Ni
... molten Sn-base sol- der during soldering, and then the Ni layer is contacted with the ...the Sn/Ni system was experi- mentally examined using sandwich Sn/Ni/Sn diffusion cou- ples prepared by ...
6
Phytochemical analysis and growth inhibiting effects of Cinnamomum cassia bark on some pathogenic fungal isolates
... parapsilosis SN 1980, Candida guilliermondii SN 2006 and Candida glabrata SN 2266 ...parapsilosis SN 1980 and Candida guilliermondii SN 2006 respectively It would appear that Candida ...
8
Reactive Diffusion between Ag–5Pt Alloy and Sn at Solid State Temperatures
... of Sn and the Ag–Pt alloy. As can be seen, the open circles for Sn and the Ag–Pt alloy coincide well with the open ...using Sn/Ag/Sn diffusion couples in a previous ...3 Sn and the phase ...
8
Capacity Improvement of Tin-Deposited on Carbon-Coated Graphite Anode for Rechargeable Lithium Ion Batteries
... of Sn NPs on the graphite substrate. Sn-deposited materials were electrochemically characterized by charge-discharge ...cycling. Sn-deposited graphite (Sn/G) showed higher capacity than ...
12
<p>Evaluation of pharmacokinetics and pharmacodynamics of sinomenine-hyaluronic acid conjugate after intra-articular administration for osteoarthritis treatment</p>
... of SN after intra- articular administration of SN-HA and ...the SN concentration of SN-HA conju- gate group was higher than that of the SN ...of SN are listed in Table 6. When ...
9
Organizational Accessibility and Community Connections: Examining Changes in the Spatial Proximity of Pubic Housing Residents to Social Service Providers and Providers' Responses to Redevelopment
... Disposition to trust Second-order Benevolence formative Integrity factor Competence Trusting stance Institution-based Second-order SN –General trust formative SN –Benevolence factor SN –[r] ...
202
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu cored Lead free Solder Balls
... Cu-cored solder balls were prepared with electroplating of 20 mm thick Sn-5 mass%Ag solder coating on Cu balls with a diameter of 70 mm. For Cu-cored solder balls with Ni coating over the Cu core, Ni-10 mass%P ...
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