Abstract: This paper examines the effectiveness of using IntegratedCircuitDesign interactive CD in the new course EE503 - IC Fabrication and Packaging Technology for the Diploma in Electronic Engineering (Computer) and Diploma in Electronic Engineering (Communication). The objective of this study is to assess the level of understanding of students with the use of interactive CD by lecturers in the teaching and learning process (T&L). The study was conducted on 30 respondents consisting of students taking the course EE503 in June 2012 session of Department of Electrical Engineering, Politeknik Seberang Perai. The survey conducted by distributing questionnaires to two (2) groups of respondents from different classes. Teaching and learning techniques for first responders group is carried out conventionally using powerpoint slides. While the teaching and learning for the second respondents group is a combination of using powerpoint slides and IC Design Interactive CD. The analysis was performed using SPSS 11.5 for descriptive average level of student understanding. The study found that the level of student understanding for the class that using IntegratedCircuitDesign interactive CD is higher than the classes that using power point slides only in the T&L. It shows that the use of IntegratedCircuitDesign interactive CD in T&L can increase the level of student understanding. Keywords: IntegratedCircuitDesign, IC Fabrication, Interactive CD, Teaching and Learning
The CTIA with CDS circuit is designed and implemented in standard TSMC 0.13 μm CMOS process with BSIM3V3 device model. The design rule check (DRC), layout versus schematic (LVS), parasitic extraction (PE), process-voltage- temperature (PVT) analysis and post-layout simulation are performed for all designed circuits. Spectre simulator is used to perform the post-layout simulation in CADENCE ® software. Figure 13 shows the complete layout of the CTIA with CDS circuit. The total chip area is 70μm×108μm. Table 7 summarizes the effect of application of the CDS technique based on the post-layout simulation. Note the RMS input noise is reduced from 31.5pA to 4.9pA and the offset voltage is reduced from 772μV to 145μV for the same power consumption of 6.5μW (5.2μW excluded the bias circuit).
Point-of-care (POC) testing brings the test conveniently and immediately to the patient. Due to increasing demand for POC testing, the research and development of an inexpensive, rapid and small handheld biosensor device is growing rapidly every year. With the available Complementary Metal-Oxide Semiconductor (CMOS) technology, it allows the realization of a complete system that integrates the sensing unit and transducer element in the same device. In particular, realization of an integrated deoxyribonucleic acid (DNA) biosensor is the main interest of scientists due to the completion of human genome project and advances in genetic sequencing of pathogenic species . Label-based DNA detection method such as optical DNA microarray is now a mature technology with applications in health care and biological researches. However, the technology is still far from POC applications and even from its implementation in home-diagnosis due to the expensive and bulky equipment. In contrary, label-free electrochemical DNA detection method can provide significant advantages including high sensitivity, small size, low cost, fast, and compatibility with standard CMOS fabrication for future integration.
Hybrid integration of CMOS chip with silicon photonic devices has emerged as a promising cost-effective solution to meet the ever increasing data transfer bandwidth requirement in the computing system. MZM device is by far the most reliable indirect optical modulator in silicon photonic platform, though its footprint is large and thus requires relatively more power for the drivers. Escalating the amplitude modulation scheme from NRZ (PAM-2) to PAM-4, even to increase the data rate to PAM-8 requires an analytic model to estimate the trade-off among the electrical-to-optical (EO) channel loss over the sacrificed signal-to-noise ratio, the circuitdesign complex- ity, the chip area and the power consumption. It is imperative to find a methodology to evaluate the link topology at the system-level and guide the transistor-level design of the transceiver circuits.
Digital circuits are integral parts of many areas of engineering and technology such as personal computers, digital signal processing, telecommunications, speech analysis and recognition, and control systems. The objective of this course is to equip students with the necessary fundamental knowledge and skill that enable them to understand, analyse and design digital circuits in the real world. The first half of the course will focus on the analysis and design of combinational and sequential logic circuits. Verilog Hardware Description Language, arithmetic circuits, computer design fundamentals and CMOS and TTL technologies will be covered in the second half of the course. At the completion of the course, students should be in a position to be able to design and build reliable and cost- effective digital circuits.
Flexible materials don’t guarantee that the circuit will function reliably when bent or flexed. There are many factors that con- tribute to the reliability of a printed flex circuit and all of these factors must be taken into account during the design process to ensure that the finished circuit will function reliably. When designing a flex circuit, the designer must factor in all of the parameters that will have an impact on the circuit’s ability to bend or flex in the specific application. These include, but are not limited to: whether the application is static or dynamic, bend radii, dielectric thicknesses and type, foil weight, copper plating, overall circuit thickness, number of layers, and number of flexures.
Minco can meet all marking requirements. Etched marking, stamped ink marking, and screen marking are available for flex-circuits. Etched marking does not add to cost, since it is produced in the standard etching process. We recommend against etched marking of revision levels, as a revision change will then require an artwork change. The revision level should either be omitted or ink marked on the outside of the circuit. For ink marking, unless a specific ink is specified, a one-part permanent black epoxy is used to mark the circuits. If desired, Minco can mark stiffeners and covers with component mounting locations.
Abstract—This paper presents microstrip transmission lines for designing a microstrip open loop resonator bandpass ﬁlter and a novel dual band transmitter. Microstrip open loop resonator bandpass ﬁlter with the dumbbell DGS under feed lines enhances the harmonic suppressed at the center frequency of 2.44 GHz. An asymmetric dumbbell DGS-integrated microstrip line is applied to the dual band transmitter which performs as a frequency doubler at 6.8 GHz or a power ampliﬁer at 2.4 GHz. For the proposed bandpass ﬁlter,it has a wide stopband characteristic with attenuation − 25 dB up to 8 GHz and has an − 1.25 dB insertion loss by using two dumbbell DGS. Measurements of the dual band transmitter show that in frequency double mode,fundamental suppression and maximum output are − 41 dBc and 7.8 dBm. And in ampliﬁer mode,second harmonic suppression,P1 dB and gain achieve − 52.6 dBc,13.7 dBm and 16.5 dB, respectively.
The comparison of the adiabatic logic methodologies with CMOS circuit has proved that power consumption with the proposed logic is for less as compared to CMOS. For instance, when the input frequency varies from 10 to 150MHz, the proposed inverter and 1-bit full adder circuits dissipate minimally as only 12% and 21% power of the total power of a static CMOS based logic circuit. These advantages made this logic more convenient for energy efficient digital applications. A comparison of power dissipation between CMOS and adiabatic logic is shown by the histogram.
Next, some storage elements are used to store and accumulated the harvested energy for intermittent use since the average power is too little. The use of capacitors as a way to store energy has been considered due to the past research on the power energy harvesting  as well as can overcome the problem of traditional battery that as limited power. Then, the protection circuit will be used since inconsistent applied voltage. Therefore, the piezoelectric harvesting circuits for circuit application designs were studied.
conventionally-used low-dropout regulators (LDOs). The circuit is capable of supplying high load currents. Besides, its absolute value can typically be chosen smaller, equal, or larger than the silicon bandgap voltage, 1.2V. As another advantage over LDO, the temperature-sensitivity of the proposed reference can be smaller for identical area and power. In this configuration, the negative input terminal of error amplifier is biased via a simple complementary-to- absolute-temperature (CTAT) voltage source. In order to directly compensate for the temperature dependence of the output voltage, a PTAT current source has also been added. Assuming a high DC gain for the amplifier, the reference voltage (V ref ) can be calculated from
circuit designers. The tasks are so frequent that many analytical techniques and approximation methods suited for high-frequency circuits have evolved and strongly influenced the jargon of RF engineering. The single-tuned amplifier has a single resonant circuit and provides a good vehicle for introducing the analysis and design of any coupled tuned amplifier . The voltage-gain function of the coupled tuned amplifiers have several circuit elements, such as resistors, capacitors and inductors  and their analysis requires massive algebra manipulations. The problem is how to convert the models of the power output of the interstage coupled tuned amplifiers into linear or nonlinear optimization problem so that the power output can be optimized through an iterative heuristic method. Simulated annealing (SA) algorithm has been an efficient optimization method for optimizing computer-aided design of very large system integrated (VLSI) circuit problems. Kirkpatrick, et al. , first introduced the SA algorithm, and used it not only as solution to the travelling salesman problem but also as a technique for computer design. Henderson, et al.  provides a comprehensive review of SA and practical guidelines for implementing cooling schedules of SA while other readings can be found in van Laarhoven and Aarts ; Aarts and Korst  and Lenstra, et al.  or in a study by Pirlot .
In current-mode design, the parameter variations of the components and the noise may result in incorrect logic levels may be obtained, if the number of cascaded stages exceeds a certain value. Therefore, it is unavoidable to restore the tabulated levels after a certain number of stages, unless the gates are self-restored type . A new full-current mode CMOS-MVL restoration circuit is presented in .
RF Energy is one of the energy sources where it is essentially inexhaustible. It is time independent and a kind of easily obtained energy source. This essentially free energy source is maintenance- free. Besides, it is more practical in cost, size and lifespan. When RF energy harvester is designed and installed properly, it can be used to convert the RF energy to an amount of electrical energy that is possible to power up an IoT application or low power devices which is more reliable than using batteries. In this project, an RF energy harvesting system will be designed and developed based on off-the-shelf components. The system includes antenna, impedance matching network and rectifier DC load circuit. The system will be designed using the Advanced Design System (ADS) software.
Abstract:This paper provides electronic implementation of electrocardiograph (ECG) circuit by using instrumentation amplifier (IA) as bio-potential amplifier in such a manner which reduces noise, common voltage, DC offset value and RF interference from the existing circuit.Noise and common voltage can be removed from ECG using driven right leg circuit or by using isolator circuit. DC offset can be removed by using integrator as feedback. In the differential amplifier part of IA, we can add single resistance, T-network or inverter circuit with integrator to improve impulse response. By using filters, we can reduce RF interference. In this paper, we have used instrumentation amplifier as a bio-potential amplifier.
The Block diagram as in Figure.5 is designed using Cadence Virtuoso tool and simulated by Synopsys Hspice. Figure.6 shows the operation example with 5 sec as monitoring period, where the circuit is operated at 2 MHz with 1v as supply voltage. Speed level for speed control unit corresponds to 0.1 volt. Measurement purpose Three spice models for slow, fast and nominal speeds, which are available in hspice are used.
With the development of electronic technology, the systems of electronic equipment become more and more complex. The electronic equipment will inevitably work in environment with high electrical level surrounded. However, electronic equipment’s inner system may easily cause some electromagnetic interference problems. If the adaptability of electronic equipment in electromagnetic environment cannot be improved and electromagnetic compatibility of electronic equipment cannot be solved properly, the performance of electronic equipment will not be brought into play. How to improve the compatibility design of electronic equipment has become one of the top issues for electronic equipment designer. As shown in the fig. 1, based on the understanding of electromagnetic interference, this article will clarify the basic concept of electromagnetic compatibility. And according to the system design of shielding design, printed circuit board (PCB) design of signal integrity and power integrity design two aspects, this article will analyze the key points of electromagnetic compatibility (EMC) design. Meanwhile, the EMC test techniques are analyzed. Then the test instruments, test sites and test methods are summarized.
Over the past 40 years, the research on IC interconnect reliability has expe- rienced several large fluctuation and become more attractive. The status and tendency are analyzed by reviewing the academic papers here. In this paper, the statistic data are taken from the related journals or magazines and conferences from 1969 to 2017. The review covers the following journals, like IEEE Transac- tions on Reliability, IEEE Transactions on Device and Material Reliability, Mi- croelectronics reliability, Applied Physics etc, which are the top reliability jour- nals based on the IC reliability. Similarly, the conferences include IEEE Interna- tional Reliability Physics Symposium Proceedings, Integrated Reliability Work- shop Final Report (IRW), IEEE International Physical and Failure Analysis of Integrated Circuits, Reliability and Maintainability Symposium (RAMS) Annual and some other related forums.