Lead-free solders
Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni Bearing SAC305 Lead Free Solders by the Strain Rate Change Tensile Test
... of lead-free solders, ...The solders were re- melted at about 317 C in a graphite crucible and then cast into a dumbbell-shaped steel ...
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Estimation of Thermal Fatigue Resistances of Sn Ag and Sn Ag Cu Lead Free Solders Using Strain Rate Sensitivity Index
... Sn–Ag–Cu lead-free solders by the strain rate change test and also aimed to estimate their thermal fatigue resistances by the strain rate ...the lead-free ...
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Effect of Specimen Size and Aging on Tensile Properties of Sn Ag Cu Lead Free Solders
... Five Sn-Ag-Cu lead-free solders and a Sn-37 mass%Pb solder were prepared in this study. Table 1 shows the solder type and the solidus and liquidus temperatures for each solder. Micro size specimens ...
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Some Fundamental Issues in the Use of Zn Containing Lead Free Solders for Electronic Packaging
... zinc-containing lead-free solders due to some drawbacks, such as oxidation, poor wetting, lack of mechanical properties and reliability data- ...
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Comparison between SAC405 lead free solders and EN(P)EPIG and EN(B)EPIG surface finishes
... leaded solders into lead-free solders due to the environmental concerns and follow the legislation of Restriction of use Hazardous Substances ...
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Effect of substrate surface condition on thermal cycling behavior of lead-free solders
... of lead, and thus the elimination of lead has become a focused goal in recent ...years. Lead-free solders typically with more alloying constituents, have melting temperatures 20-35°C ...
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Microstructures and Shear Strength of Interfaces between Sn Zn Lead free Solders and Au/Ni/Cu UBM
... Microstructure and shear strength of Sn-Zn lead-free solders and Au/Ni/Cu UBM joint under thermal aging conditions were investigated. The samples were aged isothermally at 373 K and 423 K for 300, ...
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Interfacial reaction between SAC305 and SAC405 lead free solders and electroless nickel/immersion silver (ENImAg) surface finish
... to lead-free ...also lead to bad wetting area and even brittle solder ...SAC405 lead- free solders and electroless nickel-immersion (ENImAg) surface finish need to be ...
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Wettability of Lead Free Solders on Gold Plated Copper Substrates
... As can be seen in Fig. 8, temperature had different effects on contact angles of lead-free solders. Increase in temper- ature resulted in a decrease of contact angles in case of Sn- 3Ag-0.5Cu and ...
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The Recrystallization of Microelectronic Lead Free Solders
... of lead free solders, have shown that the mechanical properties of SAC 15–17) and SZ 18–20) are closely related to the cooling rate, aging treatment, element addition, ...Ag solders (< 3:5 ...
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Novel Ultrasonic Soldering Technique for Lead Free Solders
... Sn-Bi alloy is one of the representative low temperature type lead-free solders. However, the bonding properties of the Sn-Bi solder are not good. The reason for such properties is related to Bi ...
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Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes
... In this research, we will try to obtain more knowledge on a new kind of surface finish, the immersion silver (ImAg) with lead free solders, i.e., Sn-4Ag- 0.5Cu and Sn-3Ag-0.5Cu. Other parameters will ...
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Mechanical Strength and Microstructure of BGA Joints Using Lead Free Solders
... no more than 0.75 mass% of Cu, the addition of Cu to the solder was effective in changing the reaction layer from a Ni– Sn-based intermetallic compound to a Cu–Sn-based version. The Cu in Sn–Pb solder also behaves in the ...
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Role Of Intermetallic Compound On Thermal Crack Propagation Of Lead Free Solders
... of lead free solder particularly on the IMC layer morphology and the role of the IMC formation and growth rate on the thermal crack propagation of lead-free ...
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Acetic acid mediated leaching of metals from lead-free solders
... waste acid solution generated during the process is harm- ful to the environment. For the sustainable management of natural resources and to reduce environmental pollu- tion, it is important to develop a simple recycling ...
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Reliability analysis of lead free solder
... into the joint by capillary action and to bond to the materials to be joined by wetting action (Zahn Bret, 2002). After the metal cools, the resulting joints are not as strong as the base metal, but have adequate ...
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Influence of an Immersion Gold Plating Layer on Reliability of a Lead Free Solder Joint
... Electroless Ni/Au plating is often performed on a surface of a Cu pad to improve the wettability of lead-free solders on such a pad. Generally, electroless Au plating is performed by an immersion ...
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... some lead-free solders with unique prop- erties like non-toxicity, high ductility, high im- pact strength ...following lead- free solders have already been produced: 81Sn– ...
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Metallurgy and Kinetics of Liquid Solid Interfacial Reaction during Lead Free Soldering
... Unlike extensive study on intermetallic growth of lead-free solders on Cu substrate, there is relatively littlie study on other substrates. SEM images of the intermetallic layers for the Nickel and ...
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Wetting Properties of and Interfacial Reactions in Lead free Sn Zn Based Solders on Cu and Cu Plated with an Electroless Ni P/Au Layer
... (mass%) lead-free solders on Cu and Cu/Ni-P/Au substrates have been ...the solders investigated was 0–3 ...Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag ...
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