reliability of solder joints
Board Level Drop Reliability of Epoxy Containing Sn 58 mass% Bi Solder Joints with Various Surface Finishes
... drop reliability testing under JEDEC (Joint Electron Device Engineering Council) drop conditions was conducted for low- temperature Sn-58 mass % Bi solder ...drop reliability of the Sn-58Bi ...
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Reliability Estimation of Solder Joints Under Thermal Fatigue with Varying Parameters by using FORM and MCS
... of solder joints is known as the thermal ...the solder joints under the thermal fatigue loading is influenced by varying boundary conditions such as the material of solder joint, the ...
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Improvement of Board Level Reliability for µBGA Solder Joints Using Underfill
... board-level reliability, 4–6) which is a particularly critical issue in portable electronic products such as PDAs, cellular phones, ...board-level reliability of BGA and CSP has been dramatically improved ...
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Design of experiments of electromigration reliability for solder joints of a wafer level chip scale package
... in solder joints under high current density has become a critical reliability issue for the future high density microelectronic ...of solder joint in a wafer level Chip Scale Package (WL-CSP) ...
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Fatigue Reliability Evaluation for Sn Zn Bi and Sn Zn Lead Free Solder Joints
... The recent development of electric and electronic devices has been remarkable. Electric and electronic devices have spread into society in various forms such as audio-video equipment, household electric appliances, and ...
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Effects of Alloying in Near Eutectic Tin Silver Copper Solder Joints
... To study the aging effects, more quantitative microstruc- tural analysis is needed to characterize the differences in coarsening and diffusion processes that occur, along with some systematic variation of the aging ...
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The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints
... The electronic industry is making substantial progress toward a full transition to Pb-free soldering in the near future. At present, the leading candidate Pb-free solders are near-ternary eutectic Sn-Ag-Cu alloys. The ...
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Comparison of Lead Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating
... The reliability of solder joints, especially lead-free solder joints, in electroless plating is said to be less satisfactory compared to electrolytic ...between solder bulk and ...
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Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
... failed solder joints to that of the total solder ...the solder joints were cross- sectioned and characterized by scanning electron microscopy ...
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Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
... Au-Sn solder, 3) but considered the efficient transmission of optical signal, flip-chip using thermo-compression bonding process is limited because of the alignment of optical ...the solder reflow process that ...
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Thermal Fatigue Properties of Sn 1 2Ag 0 5Cu xNi Flip Chip Interconnects
... Flip chip interconnects with smaller pitches are required to meet a demand for the higher density packages. In the flip chip packaging, the solders must act as both electrical and mechanical interconnections. When flip ...
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Thermal and Mechanical Properties of Flip Chip Package with Au Stud Bump
... thermo-mechanical reliability of the fl ip chip package with Au stud bump was investigated in this ...chip solder joints were fabricated using the Au stud bumps and Sn surface fi ...of ...
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Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn 3 5Ag 0 75Cu Solder
... BGA solder joints during isothermal aging was studied with ...Sn–3.5Ag–0.75Cu solder on three different pads (Cu, electroless Ni–P/Cu, immersion Au/Ni–P/Cu) at temperature between 70 and 170 ◦ C for ...
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Protecting Printed Circuit Boards from Harsh Vibration Environment
... and solder joints of electronic packages, loosening of PCB fastening screws, cracking of PCB itself and finally malfunctioning of electronic ...the reliability of electronic equipment, it is ...
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Built in reliability design of highly integrated solid state power switches with metal bump interconnects
... all solder joints, the maximum von Mises stresses and creep strain accumulations occur in the solder joints between the bumps and IGBTs during the mission profile ...the solder ...
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Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn 8Zn 3Bi Solder and Ni/Au Plating
... After reflow, the soldered specimens were either examined or subjected to an aging treatment. The aging treatment was carried out at 398 K for 1.8 Ms, 3.6 Ms and 5.4 Ms. After the reflow and aging treatment, ...
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Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength
... Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...Sn-Pb solder are the Sn-Ag based ...Sn-Ag solder, a third element such as Cu or Bi must be ...the ...
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Effect of Corrosion on Mechanical Reliability of Sn Ag Flip Chip Solder Joint
... flip-chip solder joints before and after corrosion test were ...Sn-Ag solder bump joints decreased with increasing amount of corrosion, mainly due to the formation of brittle corrosion ...the ...
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Properties of Solder Joints Using Sn Ag Bi In Solder
... lead-free solder to electronic products requires a complete review of all elements involved in electronic circuit manufacturing, ranging from printed circuit boards (PCBs) and electronic components through to the ...
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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
... Copper plates of 1 mm in thickness were joined with a solder layer (60 mm in thickness) of Sn-3.8 mass% Ag-1.2 mass% Cu alloy, and then subjected to the shear fatigue testing. At required numbers of fatigue ...
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