Sn-Ag-Cu-In solder
Pb-Free Sn-Ag-Cu-Mn Solder
... A solder alloy comprises Sn, Ag, Cu, and Mn and has a melting temperature of about 211 degrees ...A solder joint and solder process embody the solder alloy as well as ...
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Effect of Addition of Small Amount of Zinc on Microstructural Evolution and Thermal Shock Behavior in Low Ag Sn Ag Cu Solder Joints during Thermal Cycling
... SnAg Cu solders such as ...Pb-free solder worldwide, which is used in numerous electronic ...the solder contains 3 mass% Ag (a precious metal), and hence, its market price is much higher ...
10
Reliability of Solder Joint with Sn Ag Cu Ni Ge Lead Free Alloy under Heat Exposure Conditions
... SACNG solder, the formation phases in the solder grow up to several-micron meters after heat exposure ...the solder ball joint with the SACNG solder and the Cu pad after heat exposure ...
8
The Microstructure, Thermal Fatigue, and Failure Analysis of Near Ternary Eutectic Sn Ag Cu Solder Joints
... eutectic Sn-Ag-Cu ...eutectic Sn-Ag-Cu alloys has been reported in terms of the formation of large Ag 3 Sn plates and their effects on mechanical properties of ...
8
Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
... the solder material should be testified with small size specimens comparable to the solder joints because their mechanical properties are largely influenced by micro- structures, which are dependent on the ...
8
Improvement of Joint Reliability of Sn Ag Cu Solder Bumps on Cu by a Laser Process
... the Sn-Ag-Cu solder and Cu pads after laser soldering and ...the Cu pad and the first layer, and the total thickness of the IMC layer ...
5
Impact Properties of Lead Free Sn Ag Cu Ni Ge Solder Joint with Cu Electrode
... types Sn-Ag-Cu-Ni-Ge solder balls were prepared and ...and Sn-3.5 mass%Ag-0.5 mass%Cu solder balls were also prepared for ...of solder balls used in this ...
5
Study on Sn Ag Oxidation and Feasibility of Room Temperature Bonding of Sn Ag Cu Solder
... of Sn–Ag alloy on the bonding characteristics, the surface oxides were removed by argon fast atom beam (Ar-FAB) irradiation and then the growth of the oxides on the alloy surfaces in air was investigated by ...
6
Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn Ag Cu Solder Joint
... The drop test board was fixed to the drop table of the drop tester (SD-10, LAB, USA) at the four corners with the mounted packages facing downward, following JESD22- B111. 4) The drop table was then released at a certain ...
7
Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*
... a solder joint of Sn–Ag–Cu–Bi/ Ni–P, at a low magnification, and concentration profiles of P, Ni, Cu, Ag, Bi and Sn, obtained at points 1–16 by EDX analysis, across the ...
10
Effect of Crystal Orientation on Sn Whisker Free Sn Ag Cu Plating
... induced Sn whiskers are a serious problem in the electronics industry because they can cause electrical short circuits in narrow gaps between electrodes such as fi ne pitch connector ...Pb-free solder ...
7
Recovery of Sn, Ag and Cu from Waste Pb Free Solder Using Nitric Acid Leaching
... of solder paste using organic solvents such as toluene, even though such organic solvents are harmful to the ...for solder is gradually decreasing in Korea because most of the manufacturing facilities are ...
6
Isothermal Fatigue Properties of Sn Ag Cu Alloy Evaluated by Micro Size Specimen
... of solder alloys is important to evaluate reliability of solder joints, since cyclic mechanical deformation can occur at solder joints due to thermomechanical fatigue ...the solder joint can ...
7
Interfacial Reaction between Sn Ag Co Solder and Metals
... lead-free solder such as the microstructure, mechanical properties and interfacial reactions are in ...on Sn–Ag and Sn–Ag–Cu system solders has been carried out, and interfacial ...
6
Effect of Cu Addition to Sn Ag Lead Free Solder on Interfacial Stability with Fe 42Ni
... the Sn-Ag-Cu alloy also influences the formation of interfacial reaction layer with Ni ...a solder can affect the interfacial reaction and interface ...lead-free solder with a substrate ...
7
Wettability of Sn Zn, Sn Ag Cu and Sn Bi Cu Alloys on Copper Substrates
... eutectic Sn Pb solder alloys are gradually being replaced by lead-free solder alloys because of the toxicity of ...lead-free solder alloys with a stable microstructure and mechanical ...
6
Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn 3 5Ag 0 75Cu Solder
... Sn intermetallics caused embrittlement in BGA joints. How- ever, Au was not found remaining at the interface of the BGA pad and solder ball due to the limited spatial resolution of the SEM. A possible ...
6
Sn Ag Based Solders Bonded to Ni P/Au Plating: Effects of Interfacial Structure on Joint Strength
... the Sn-Ag-Cu solder joints was found to be higher than that of the Sn-Ag solder joints after both the reflow-soldering and aging ...of Cu in the samples without Au ...
9
Melting and Joining Behavior of Sn/Ag and Sn Ag/Sn Bi Plating on Cu Core Ball
... fabricated Cu-core Sn–Ag solder balls by plating pure Sn and Ag onto Cu ...fabricated Cu- core, multicomponent Sn–Ag–Bi balls by sequentially coat- ...
7
Metallurgy and Kinetics of Liquid Solid Interfacial Reaction during Lead Free Soldering
... solders, Sn–Ag eutectic (96.5%Sn–3.5%Ag), Sn–Cu eutectic ...and Sn–Ag–Cu eutectic ...immersion Sn, and Ni/Au, in addition to mechanically polished ...
9