18 results with keyword: 'high reliability lead free solder sn sn cu'
By contract that high ductility of SN100C means that it can accommodate substantial strain without embrittlement and cracking and that is apparent in the results of the cyclic
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Currently, the tin-silver-copper (Sn-Ag-Cu) solder alloy is the primary substitute for conventional tin-lead (Sn-Pb) solder material. While Sn-Ag-Cu solder is reliable, its
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Sn-0.7Cu and Sn-0.7Cu-xGe solder alloys were prepared to investigate the influence of trace Ge on liquid Sn-0.7Cu lead-free solder at high temperature. The spreadability and
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The dotted line shows the average results of the mechanical shear fatigue test for the Sn–37Pb solder (using the data from Fig. 6), and the solid line expresses the approximate line
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If you should have a misprinted board, the paste may be cleaned off manually with alcohol (IPA) or Qualitek stencil cleaner, SK-11. If you have a more elaborate board cleaner,
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Ag–Cu lead-free composite solders. Influence of temperature and strain rate on tensile properties of single walled carbon nanotubes reinforced Sn–Ag–Cu lead free solder
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The Reflow Zone- or spike zone is to elevate the temperature of the PCB assembly from the activation temperature to the recommended peak temperature. The activation temperature
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A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three
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A solder joint and solder process embody the solder alloy as well as solder balls and solder paste made therefrom to provide a solidified joint that includes three
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As well as providing adequate strength in the same temperature range at that in which the high-Pb solder has been used, ideally it should be possible to form a joint
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l Pb-free BGA bumps / Sn/Pb Paste l Metals in the solder joint:. Sn (bulk) Ag Cu Pb
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while the Zn–20Sn/Cu joint exhibits an interfacial fracture. The ductile nature of the Zn–40Sn alloy, in which -Sn/-Zn eutectic phase seem to play a key role for deformation,
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In the SACNG solder, the formation phases in the solder grow up to several-micron meters after heat exposure treatment. Figure 6 shows EPMA mapping analysis results for the
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Contact angle for In-Bi-Sn and In-Bi-Zn lead-free solder systems on Cu substrate at different reflow temperatures..
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On the other hand, the Sn-Ag-Cu-Ni-Ge joints have relatively excellent impact properties compared with SA and SAC joints (shown in Figs. For the Sn-Ag-Cu-Ni- Ge joints, the
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Black, gray and white symbols represent Sn–Ag– Cu–Ni composite (solder H), Sn–Ag–Cu composite (sol- der C) and Sn–Ag monolithic (solder A) solders, respective- ly, while
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When an Sn-Pb solder-plated terminal is joined to a Cu-plated substrate using Sn-Zn-Bi solder, a mixed layer of Pb/Bi/Sn is formed by heating at the joint interface, which is
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Based on the results from previously published studies [1-25], the iNEMI Board Assembly Technology Integration Group launched the “Pb-free BGAs in Sn-Pb Assemblies Project” in order
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