[PDF] Top 20 Metallurgy and Kinetics of Liquid Solid Interfacial Reaction during Lead Free Soldering

... 3 min, 10 min, 30 min, 2 and 16 h). A small amount of Actiec- 2 flux (Class ROL with 0.2% halides) was applied to the inner surface of each sample before the test. After fluxing, each sample was placed on the mounting clip ... See full document

... the soldering tempera- ture at 210C ± 2C(solid state), 220C ± 2C(semi-solid state) and 240 ± 2C(liquid state) by the heating table after filled the solder paste and rosin-based flux at first, ... See full document

... in liquid solder), is very solderable, provides flat board finishes and protects against ...interfacial reaction. This concern of voiding is further magnified with lead-free ... See full document

... first reaction layer and small reaction particles attaching on to the first reaction ...double reaction layers are also observed at the interface for the ...the reaction products ... See full document

... Flash pyrolysis: Flash pyrolysis can be considered as an improved and modified form off as pyrolysis. In fast pyrolysis the temperature required for the degradation of the components of biomass is achieved by heating it ... See full document

... factors may lead to such a difference: structural and/or electro- nic. Structural effects refer to the geometry of atoms forming the (hollow) binding site and to the ability of a given surface to rearrange upon O ... See full document

... to lead-free ...bath during assembly process, can also lead to bad wetting area and even brittle solder ...Therefore, interfacial reaction between SAC305 and SAC405 lead- ... See full document

... chemical reaction rather than a heat reaction, because the temperature rise during plasma irradiation didn’t raise the removal ...selective reaction can be attributed to high boiling points of ... See full document

... the reaction layer. The flaking off and fracture of the reaction layer may be promoted by such thermal ...the soldering iron occurs as follows: at the area without retained solder (position › in ...the ... See full document

... Cu-cored solder balls are expected to control the solder joint height higher and hold the excellent coplanarity. Because the Cu core does not melt in the reflow soldering process, the joint height can be held at ... See full document

... a solid surface such as the walls of the glass Couette cell is known to have an in fl uence on ...overall free energy barrier for heterogeneous nucleation is lower than the corresponding free energy ... See full document

... Sn-9Zn (mass%) solder has the eutectic composition of the Sn-Zn system and a melting temperature (471K) 2,6) relatively close to that of eutectic Sn-Pb(456K). This will allow the industry to continue to use the present ... See full document

... size and orientation. The melting temperature of usedalloys as shown in Table 2 dependent on alloys composition. Also it is less than the tin eutectic based alloys and very closed with commercial lead- tin solder ... See full document

... Figure 1 shows that the layer thickness (d) of the -Ti(Fe) and -Ti(Au) phases as a function of time as examples. Similar growth plots have been obtained for all other systems studied and discussed here. The thickness of ... See full document

... hand, bismuth has similar properties to lead such as melting point, solid solubility to the copper, and density. Bismuth dose not cause side-effect to environment and human health. However, bismuth exists as ... See full document

... by soldering, resulting in the loss of function of the soldering ...the soldering iron and reconditioning time brings about a reduction in ...of soldering Cu/Fe alloy shown in ... See full document

... The 1-D models for solid-liquid-vapor phase change (Huang et al., 2009) are valid only if the laser spot size is much larger than the target thickness. If the above condition is not met, a multi-dimensional ... See full document

... quartz reaction chamber and treated by DBD plasma for 10 min with different input powers, which were denoted as 13X-P-n (P means the plasma treatment for 13X powders; n is the input power, n = 80, 90, 100 W ... See full document

... To obtain a baseline for later measurements, the as-prepared Ag film on the Si substrate was characterized using NR prior to electrolyte exposure. The model for the layering on the as- prepared sample consists of Si as ... See full document

... bcc solid-liquid interfacial free energies γ bcc (HS) are extracted from a combination of simulation results [22] and our perturbation theory, and hence provide the first reliable estimates for ... See full document