[PDF] Top 20 Microstructure and Mechanical Properties of Sn 8 55Zn 1Ag XAl Solder Alloys

... the Sn-9Zn, Sn-8.55Zn-1Ag and Sn-8.55Zn-1Ag-XAl alloys with ...The Sn-8.55Zn-1Ag alloy has the lowest average value of the hardness of ...containing ... See full document

... compressive mechanical properties of these alloys are listed in Table ...3. Alloys A and B with obvious coarse eutectic structures exhibit high yield strengths of 1442–1515 MPa and also ... See full document

... 100 nm were more densely distributed across the resulting microstructure than in the initial material (Fig. 9), while the density of the A2017 IMCs increased, and their sizes were bigger than those in the initial ... See full document

... very slowly because the LPSO phase controlled the grain growth. It is striking that the LPSO phase changed from a block-type to a plate-type structure as the annealing temper- ature increased, as shown in Fig. 5. This is ... See full document

... the mechanical properties and microstructure of Sn–Ag–Bi Pb-free ...the mechanical properties of Sn–Ag–Bi solder such as tensile strength, elongation and ... See full document

... the microstructure within the ...the Sn matrix at different aging ...mere solder at the fracture ...the solder bump-shear test, a fracture occurs at the interface or in the solder region ... See full document

... on microstructure and mechanical properties in tin alloys were investigated in this ...and Sn-4%Bi alloys were fabricated by permanent mold gravity ... See full document

... cleavage planes with cleavage steps of different sizes and river patterns indicated the action of brittle failure. With Yb addition, more and larger cleavage surfaces were observed in Fig. 7(b)–(d), which was attributed ... See full document

... of grains is not obviously at the rim of the deformed specimen, but the grains in the central region are deformed and fragmented seriously. This phenomenon of severe deformation of grains in the central region is similar ... See full document

... the microstructure by decreasing the IMCs particle ...overall microstructure of the alloy and hence reduces the Ag3Sn and Cu6Sn5 IMCs particle size and enhanced mechanical ...as Sn, Cu, or Ag ... See full document

... the microstructure was coarse and the grain was wide and quite enlarged after forging test, lead- ing to some positive degree of plasticity at room temperature (Figures ... See full document

... paper alloys are referred as Sn-9Zn, Sn-8Zn-1Bi, Sn-7Zn-2Bi and Sn-6Zn-3Bi according to Table ...liquid solder alloys and the preheating temperature of the metal mold are ... See full document

... mm alloys (except 60mm-SPS) had a relative density ...Phase, microstructure and mechanical properties evolution of Ni-50%Fe alloy during SPS and HSPS were ...mm alloys varied from the ... See full document

... lead-free solder such as the microstructure, mechanical properties and interfacial reactions are in ...on Sn–Ag and Sn–Ag–Cu system solders has been carried out, and interfacial ... See full document

... microstructure and properties of Sn-Bi-based solder alloy," Journal of Electronic Materials, vol. Jin, "Significantly improved mechanical properties of 271[r] ... See full document

... 95Pt-5Ru-based alloys is described in detail in (23, ...dense microstructure under ideal ...the microstructure taken following HIP that are essentially free of ... See full document

... The microstructure of a solder joint using ...8In solder was then ...the Sn-3.5Ag-0.5Bi-8In solder under the same conditions is shown in ...Fig. 8. In all types of solder, ... See full document

... in Fig. 1. After soldering, rectangular specimens with dimensions of 1 mm 3 mm 30 mm were cut from each sandwich specimen for tensile testing. The interfacial micro- structure of the joints was observed by scanning ... See full document

... Copper plates of 1 mm in thickness were joined with a solder layer (60 mm in thickness) of Sn-3.8 mass% Ag-1.2 mass% Cu alloy, and then subjected to the shear fatigue testing. At required numbers of fatigue ... See full document

... A Sn-Pb solder, which has a low melting temperature and excellent wettability, has been used as the most effective solder material for ...for solder materials. 1) Much effort to find a ... See full document