[PDF] Top 20 Soldering Characteristics and Mechanical Properties of Sn 1 0Ag 0 5Cu Solder with Minor Aluminum Addition

... As-received solder was prepared for micro-examination by standard metallographic technique which included, cutting, mounting, grinding (up to 3000 grit paper) and polishing (diamond paste with size 9 µ m, 6 µ m, 3 ... See full document

... and mechanical properties of the electrical inter- connections used in electronic ...The mechanical reliability of such joints is determined principally by the choice of solder ...a ... See full document

... SAC solder paste to enhance its interconnection reliability (Billah et ...composite solder paste, especially on the interfacial IMCs, solidification process and mechanical properties (Kotadia ... See full document

... eutectic Sn-Bi solder. To evaluate the interfacial IMC between Sn-Bi-Zn and the Cu substrate, ele- mental-mapping analysis was performed using EPMA and the results are shown in ...the Sn-Bi-Zn ... See full document

... of Sn-Zn based solder alloys when the solder joints are ...several Sn-based solder alloys under resonant conditions. The eutectic Sn-Zn alloy has been found to exhibit inferior ... See full document

... each solder composition as a function of the aging ...the Sn-Ag-Ni or Co solders was clearly different from that for the binary Sn-Ag ...the Sn-Ag solder joint, the fracture propagated ... See full document

... SZA solder joint of both interface between the SAC solder ball/SZA solder joint reflowed at ...the solder and the Cu ...SAC solder ball and SZA solder alloy during 240°C reflowing ... See full document

... Figures 1 and 2 shows the intermetallic evolution between ...Sn-4Ag-0.5Cu solder and Ni/Au surface finish with 3 micrometer nickel ...6 Sn 5 → (Ni, Cu) 3 Sn 4 → Ni 3 Sn 4 ... See full document

... a further hour. Next, the dross was removed from the surface of the melt and two samples of the alloy were collected concurrently in boron nitride coated tapered stainless steel moulds using the method outlined in ... See full document

... the Sn–0.7Cu solder and immersion Au/electroless Ni–P/Cu UBM. Figure 1 shows the cross-sectional SEM images of the solder joints before and after isothermal aging at 423 K for 72, 144, 720, ... See full document

... Thereafter, I wish to express my warm and sincere thanks to Dean, Prof. Dr. Zainal Alimuddin Zainal Alauddin, Professor Dr. Mohd Zaidi Mohd Ripin and all the staff of the School of Mechanical Engineering, for ... See full document

... the Sn-0.7Cu-0.05Ni- xZn solder ball on solder coating were investigated by using Gen3 wetting balance test ...of solder ball was determined by the maximum force and wetting ...in Sn- ... See full document

... a solder layer uniformly, Mo wires of 200 mm in thickness were placed as a ...the solder and interface layers were carried out with scanning electron microscopy (SEM), electron probe microanalysis (EPMA), ... See full document

... l Pb-free BGA bumps / Sn/Pb Paste l Metals in the solder joint:. Sn (bulk) Ag Cu Pb Ni Au[r] ... See full document

... Aluminum based metal matrix composites (MMCs) can be obtained by diffusing reinforcement particles in metal Al using solid or liquid phase methods. Over the past decade, carbon nanotubes (CNTs) have been ... See full document

... To cope with this trend, bismuth or silicon-containing lead- free copper-based alloys have been developed and are being used as substitute materials for JIS CAC406, a kind of bronze for casting, which has been used ... See full document

... as-prepared Sn-xAg- 0.5%Cu (x = 1, 2, 3 and 4%) solders and for those after annealing for ...creep properties in ...creep properties of the ...as-prepared Sn-xAg-0.5%Cu (x = 1, ... See full document

... of aluminum dross has been carried out. The amount of aluminum dross used varied between 50 and 90 wt %, while bentonite added to the dross varied from 10- 50 wt % with a fixed amount of ...bricks ... See full document

... during soldering. It is clear that both (3 and 6 wt% Sb) additions into the Sn-Bi eutectic alloy are not still far away from the binary eutectic composition as shown in Figure ...these solder alloys ... See full document

... electrical properties of the alloy of composition Sn-9Zn-1Ag solder alloy as example of metallic materials that is used in electronic ...tetragonal Sn as a solid solution and Zn phase and AgZn ... See full document