Déclaration de conformité à la norme NMB-003
FIGURE E-1: M2M DEVELOPMENT BOARD (TOP VIEW)
ochip Technology Inc.DS00001529A-page 37
AN1 529
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age 38 2013 Microchip Technology Inc.
XFORMERTO WALL
PACKTO BATT
1MHz SWITCHING
OUTPUT = 4.99V OUTPUT = 3.34V OUTPUT = 3.82V
test loops
P0WERpage 2
VIN
V3.3 V3.3
VIN
SCHEMATIC DIAGRAM
TT Proacive T I T L E:
C U S T O M E R:
SCHEMATIC DIAGRAM
TT Proacive T I T L E:
C U S T O M E R:
SCHEMATIC DIAGRAM
TT Proacive
RW REPLACES TTS0034-02
01 REPLACES TTS0034-02 RW2/1/13
01 REPLACES TTS0034-02 RW2/1/13
01 2/1/13
UNLESS OTHERWISE SPECIFIED ALL RESISTORS ARE .0625 WATT COMPONENTS AND RESISTANCE VALUES ARE +/- 5%
UNLESS OTHERWISE SPECIFIED ALL RESISTORS ARE .0625 WATT COMPONENTS AND RESISTANCE VALUES ARE +/- 5%
UNLESS OTHERWISE SPECIFIED ALL RESISTORS ARE .0625 WATT COMPONENTS AND RESISTANCE VALUES ARE +/- 5%
UNLESS OTHERWISE SPECIFIED:
ALL CAPACITORS ARE RATED AT 50 VOLTS.
CAPACITOR TOLERANCES ARE AS FOLLOWS:
.5pF - 5.0pF 5.1pF - 9.1pF 10pF - 820pF 1000pF - 1000uF
+/- .5pF
+/- 10%
+/- .25pF
+/- 5%
UNLESS OTHERWISE SPECIFIED:
ALL CAPACITORS ARE RATED AT 50 VOLTS.
CAPACITOR TOLERANCES ARE AS FOLLOWS:
.5pF - 5.0pF 5.1pF - 9.1pF 10pF - 820pF 1000pF - 1000uF
+/- .5pF
+/- 10%
+/- .25pF
+/- 5%
UNLESS OTHERWISE SPECIFIED:
ALL CAPACITORS ARE RATED AT 50 VOLTS.
CAPACITOR TOLERANCES ARE AS FOLLOWS:
.5pF - 5.0pF 5.1pF - 9.1pF 10pF - 820pF 1000pF - 1000uF
+/- .5pF
600 ohm @ 100MHz +/- 25%
PGND1 1 VIN(1)
11 GND1 12 GND2
PG 13 SW1 14 SW2 15
PGND2 16
GND VIA117GND VIA218GND VIA319GND VIA420GND VIA521
C65 600 ohm @ 100MHz
+/- 25%
CELLS 13 IN2 4
TS 12 CE 16 20 OUT2
PGND2 18 NC 19 IN1 3
ISET1 8
VTSB 11 PGND1 17 STAT1 2
GND PAD121
14 BAT
GND PAD222 GND PAD323 GND PAD424 GND PAD525 GND PAD626 GND PAD727
C91
CTR_PAD19 CTR_PAD210
TP48
600 ohm @ 100MHz +/- 25%
CTR_PAD9
L11
ochip Technology Inc.DS00001529A-page 39
AN1 529
2/1/13CELL
ICSP PROGRAMMING CONNECTOR
DIP SWITCHES FOR DEVELOPMENT ONLY.
USE RESISTORS IN PRODUCTION.
DIGITAL I/O
ANALOG IN
PROTECTION P0WERpage 1
LIGHT SNSR
page 5
EXTERNAL GERNERAL I/O
VOUT RESET
RS232GERNERAL I/O
DEBUG
pages 4,7
page 4 page 4 page 4
page 4 IO_PWR
LIGHT_SENSOR
V3.3 V_5.0 V3.3
V3.3 V3.3
VIN
V3.3
V3.3 V3.3
V3.3 V3.3 V3.3 V3.3
V3.3
V3.3 V3.3
V3.3
TP19 U24B
MCP6232 6 5 7
TP56
D18 LXES2SBBB4-026 CH1 1
CH2 3
D1NZL6V8AXV3T1G 6.8V R98 R67 300
TP66
C46 1000pF D6 TP37
MBR0520LT1G J9
12
AC2TX/RC2 7 15 VSS1
37 VDD3
RF0/ETXD1 87
VDD5 62
RB9/AN9 33 17 RA0 97 RG13
RE4 100
RG1/ETXERR 89 90 RG0
RD4/CN13/OC5 81
CN14/RD5 82
VDD6 86
VCAP 85
RF1/ETXD0 88 91 RA6 13 MCLR
RG9/SS2/ERXCLK
U4RX/RD14 47 VDD4 46 PGEC1/RB1
24 PGED1/RB0 25
AN6/RB6 26
U2TX/RF5 50
RG3/D- 56 SDA2/RA3
VUSB 55 RB14/ERSD2
43
VBUS 54 34 RB10
AVSS 31
RB15/ERSD3 44
VSS3 45
U5TX/RF13 39
AVDD 30
RD13/ETXD3 80
VSS5 75
AC2RX/RC3 8
RE1 94
93 RE0 36 VSS2
RA10 29 U1TX/RF8 42 RB12/ERXD0 41
AN2/CN4/RB2 23
RB11/ERXERR 35
RC12 63 RC15 64 VSS4 65
SCL1/RA14 66
SDA1/RA15 67
51 RF3
SS1/RD9 69 SCK1/RD10
RD3/OC4 78
RD12/ETXD2
RG2/D+ 57 92 RA7
95 RG14 2 VDD1 16 VDD2
RB8/AN8 32 U1RX/RF2
RG12 96 99 RE3
SDI1/RC4
9 RG7/SDI2/ECRSRG6/SCK2 1110 RC1 6
RG8/SDO2 12
3 RE5
D3 VESD05A1B-HD1 6.8V C55
D20 LXES2SBBB4-026
CH11 CH23 CH34 CH46
VCC5 VCC(2) 14 VL(1) 20.00 MHz
TP29
D19 LXES2SBBB4-026 CH1 1
CH2 3
MICRO USB
1 TJA1042T/3NP
1 TXD
R62 300
C111
529
V3.3 V3.3
EMDIO
25.00 MHz
C95
25MHz_OUT 21
LED_LINK/ANO 22 TD+ 15
TD- 14
AGND1 13 RD+ 12
RD- 11
COL/PHYAD0 35
PFBIN1 16
AGND2 17 AVDD33
18
PFBOUT 19
RBIAS 20 24 MDIO
RESET_N 23
TX_EN 3 TX_CLK 2
TXD_3 7 TXD_2 6 32 RX_CLK 31
RX_ER/MDIX_EN 34
CRS/CRS_DV/LED_CFG 33
PFBIN2 30
DGND 29 X1 28
IOGND 40
CTR_PAD 41 R42 33 R191.5k
R18 47
R40 33 R38 33
ochip Technology Inc.DS00001529A-page 41
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ACCELEROMETER TEMP SENSOR
EEPROM I2C2page 2
SPI1page 2
CARD SLOT
FLASH
page 2
TEMP/SD
page 2
FLASH (8Mbit) ACCEL
page 2
MICRO-SD (INTERNAL)
DIP SWITCHES FOR DEVELOPMENT ONLY.
USE RESISTORS IN PRODUCTION.
FRONT VIEW
CANpage 2
DIP SWITCHES FOR DEVELOPMENT ONLY.
USE RESISTORS IN PRODUCTION.
V3.3 V3.3
TEMP_ALERT
03-TTS0034-03
01
03-TTS0034-03
01
03-TTS0034-03 13 SCL/SCLK 14
8 INT1
VS 6 SDO/ALT ADD 12
VDD I/O 1
GND12
RSVD1 3 RSVD2 11 10 NC 9 INT2 7 CS
GND35 GND24
SW5
C2-11 DIN1 ROUT1
12 RIN1 13
DOUT1 14 V+ 2
V- 6 16 VCC
10 DIN2
DOUT2 7 ROUT2
529
U.FL TO SMA CABLE ASSEMBLY
SLOT ANTENNA
GROUNDED SHIELD GROUNDED SHIELD
GROUNDED SHIELD
VDD
VDD VDD VDD
03 TTS0034 03
0
03 TTS0034 03
0
03 TTS0034 03
MRF24J40T
U2
GND636
5 VDD3
VDD4 21
GND322
15 WAKE
GND214
RESET 13
GPIO3 12 GPIO2 11 VDD7 35
16 INT
17 SDO
18 SDI 19 SCK 20 CS
GND424
NC1 23 RFN 3 RFP 2
GPIO0 7
GND16
GPIO4 10 GPIO5 9 GPIO1 8 1 VDD1
4 VDD2
VDD6 32 VDD5 31
34 OSC1 33 OSC2
NC4 30 NC3 29 LPOSC1 28 LPOSC2 27
NC2 26
GND525
VDD8 37
NC5 38 VDD9 39
40 LCAP
GND_VIA1 41 GND_VIA2 42 GND_VIA3 43 GND_VIA4 44 GND_VIA5 45 GND_VIA6 46 GND_VIA7 47 GND_VIA8 48 GND_VIA9 49
1.2k C22
20pF EMI SHIELD NP
10pF R118
51
IDI 100445
Y1 20.00 MHz
R114 10 GND2 11 GND3 12 GND4
ANT2 13
14 GND5
ANT1 15
ANT_SEL 16 17 DNC5
18 GND6 19 VCC2
20 CSD 21 CPS 22 VCC1
23 BOUT
24 CTX
GND_PAD1 25 GND_PAD2 26 GND_PAD3 27 GND_PAD4 28 GND_PAD5 29 GND_PAD6 30 GND_PAD7 31 GND_PAD8 32 GND_PAD9 33 GND_PAD10 34 GND_PAD11 35 GND_PAD12 36 GND_PAD13 37 GND_PAD14 38 GND_PAD15 39
TP18 IDI 100445
TP6
ochip Technology Inc.DS00001529A-page 43
AN1 529
INTERNAL
CELL INTERFACE
U.FL TO SMA CABLE ASSEMBLY TO:OFF
BOARD ANTENNA
ONBOARD CHIPANTENNA
page 2 .0625W51
TP32 IDI 100445 U19
I/O VCC4 9 I/O VCC3 10
GND11
I/O VCC2 12 I/O VCC1
.0625W TP54
C105 HS 3001
1
MICRO USB 1
529
age 44 2013 Microchip Technology Inc.
GPS traces less than 3/4 inch should be micro stripline.
Longer traces should be stripline
I2C2page 2
GPSpage 2 1575.42 MHz INPUT 4
GND12GND23GND35
OUTPUT TP15 15pF
U5 MAX2674 A1 VCC
RFIN B1
GNDDC C1
ANT C2 GNDAC B2 RFOUTSHDN
1500 ohm @ 100MHz +/- 25%
16 SDA2 3 RXD1
GND11
VCC_IO 7
17 SCL2
RESERVED2 18 2 TXD1
GND312
ANTON 13 VCC_RF 14
RESERVED1 15
GND210
EXTINT0 5
TIMEPULSE 4
V_BCKP6
RF_IN 11 8 VCC
1500 ohm @ 100MHz +/- 25%
500mA NP
E1 ANTENNA
2013 Microchip Technology Inc. DS00001529A-page 45 Information contained in this publication regarding device
applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620773932 intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC®MCUs and dsPIC® DSCs, KEELOQ®code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.