5–4 LOGIQ  700 CIRCUIT CARDS

These boards contain CMOS. Being in circuit does not protect them. Wear a tested ESD strap whenever your hand comes near the parts that contain electronic components. Remove power if you will be disconnecting parts.

Practice good ESD prevention when you disconnect or attach items to the bulkhead. A ground strap around your wrist, clipped to the ground stud on the back, should prevent large electrical potential discharges into the BE backplane which could damage circuit boards and therefore system performance. An alternate method would be to touch the frame behind the air filter before and while making video, audio, SCSI, ethernet, and serial connections.

ATTENTION Never remove the RF shielding that covers the analog portion of each TD board.

ATTENTION Replace all covers and screws before the machine is returned to use. This assures system EMC, cooling and image quality.

5–4–1 Front End (FE) Cards

The portion of the system called the FE is basically the beamformer subsystem. The beamformer creates and transmits sonographic waves and then receives the echoes. Most of the circuit boards that comprise the beamformer subsystem are housed in the FE card cage. These circuit cards use multi layer boards that are 340 mm high and 400 mm deep and are accessed from the left side of the unit as you face it. See Illustrations 5–5 or 5–6 and Table 5–5 for more details about individual card cards.

The FE backplane (FEBP) and the diode board as well as the HV Cap Assembly and HV filter board are accessed from the right side of unit as you face it. The remainder of the FE consists of the Transducer Interface Board (XDIF) and probes which are mounted on the front of the unit. See Table 5–6 for more details about these individual card cards.

WARNING

CAUTION

!

!

5–4–1 Front End (FE) Cards (Continued)

TD13 TD14

TD12

J2 J1

J3

TD15 Equalization

A2 A3 A4 A5 A6 A7 A8 A9 A10 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22

TD00 TD01 TD02 TD03 TD04 TD06 TD07 Front End Control TD08System Timing

TD05 TD09 TD10 TD11

A11 A1

CIRCUIT CARDS IN FE CARD CAGE (V2/V3 UNITS) ILLUSTRATION 5–5

TD5 TD6

TD4

J2 J1

J3

TD7 Equalization VEQ

A2 A3 A4 A5 A6 A7 A8 A9 A10 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22

Front End Control TD0System Timing TD1 TD2 TD3

A11 A1

CIRCUIT CARDS IN FE CARD CAGE (V3 UNITS) ILLUSTRATION 5–6

5–4–1 Front End (FE) Cards (Continued)

TABLE 5–5

FUNCTIONS OF FE CIRCUIT CARDS IN FE CARD CAGE

Acro-nym

Full Card Name Card Function

FECB Front End Control

Board

S

With the MC and SS in the kernel, transfers CPU control signals and scan control vector parameters to the FE cards

S

Coordinates I&Q data movement

S

Generates TD addresses

S

Stores data for/from the TDs

SYTM System Timing Board

S

Generates the system clocks and sync pulses needed for beamforming, vector processing, and power

TD Time Delay Board

S

Generates and amplifies the excitation waveform for each channel

S

Receives, preamplifies and digitizes the RF signals from the active probe

S

Applies the pulser current and analog Time Gain Compensation that the EQ determines

S

Applies complex filter to digitized RF signal

S

Provides dynamic apodization and dynamic receive delays

S

Automatically adapts receive beams for speed or resolution depending on scan

S

Sums detected echo channel to channel, then board to board (boards must be contiguous). The last TD forwards total output to the EQ.

EQ Equalization Board

S

Compensates for the attenuation of the transmitted signal in tissue by depth; performs TGC based on focal zones

S

Compensates for frequency shift (TFC) in tissue, needed in B and M modes

S

Filters out harmonics and optimizes signal to noise ratio

S

Delivers amplified and corrected I&Q data to the SS in the Back End

S

Detects and activates lifted probe

S

Controls signal distribution when probe elements exceed TD channels

S

Monitors unit and active probe temperature, FE voltages, and FE configuration using four IIC serial buses connected to the MC via the FECB

S

Turns off HVN (or PHVP if V3) on PS3 (LNP) if a TD pulls too much power or is not functioning properly

5–4–1 Front End (FE) Cards (Continued)

TABLE 5–6

FUNCTIONS OF OTHER FE CIRCUIT CARDS

Acro-nym

Full Card Name Card

Location

Card Function

FEBP Front End Backplane Rear of

FE card cage

S

Distributes power and all FE signals except for RF signals and oscillator clocks

HV Cap HV Capacitor Assembly

V2/V3 V1

Air deflec-tor panel i n s i d e right side of unit

S

Works with the HV Filter board to manage the HVN (if V1 or V2) or PHVP (if V2) signal, the programmable power available to the TD pulsers.

HV Filter (See HV Cap above.) The HV Filter is on the FEBP in a V1 unit or in the HV Cap assembly in a V2/V3 unit.

XDIF Transducer Interface Board D1–A1

S

Switches, connects, grounds, buffers, and isolates signals between the probes and the EQ (control) or the TD’s (RF)

Transducer (Probe) XD01

XD02 XD03 XD04

S

Every probe has a circuit board with an EEPROM that was programmed at the factory with model information

Diode Board FEBP

S

Protects FE boards from 5VPA, 5VNA, and 5V

reverse bias

5–4–2 Back End (BE) Cards

The BE includes three subsystems: Scan Converter, Mid Processor, and Kernel. The circuit cards that make up these subsystems are housed in the BE card cage.

The BE circuit cards also use multi–layer circuit boards. These circuit boards are about 340 mm square in size. The BE circuit cards, including the MC and its on–board Single–Board Computer that controls all data transfers, are accessed from the front of the unit.

Note

Top and bottom center screws on the cage’s filler panel must be installed to keep the cage square and the boards well connected.

Video Processor X–Y Memory Time Line Memory

CINE CALM/CT ALM/CT Doppler Processor Color Flow Processor B/M Processor Peripheral I/O & Audio

Scan Sequencer Master Controller

J2 J1

J3

A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14

Scan Converter and Display Controller

Mid Processor Kernel (CPU)

ABCD 1

32 P1

P2

P3

JP215

BACK END BACKPLANE B1A0

CIRCUIT CARDS AND SUBSYSTEMS IN BE CARD CAGE ILLUSTRATION 5–7

5–4–2 Back End (BE) Cards (Continued)

TABLE 5–7

FUNCTIONS OF KERNEL CIRCUIT CARDS

Acro-nym

Full Card Name Card Function

BEBP Back End Backplane

S

Provides the VMEbus, all BE, SCSI and control panel power and all BE signals to the BE boards except for the I & Q data from the EQ

MC Master Controller

(Host)

S

Contains EPROMs that test and boot the system when power is applied

S

Controls all circuit boards, using a VMEbus standard

S

Distributes system clocks to the Back End

S

Provides SCSI, serial, and ethernet I/O

S

Queries all boards for the data stored on them; sends appropriate action commands

S

Is the only master processor; the other boards and DSPs act as slaves PIA Peripheral I/O and

Audio

S

Interfaces the control panel with the host

S

Interfaces and isolates the serial RS–232 ports that communicate with the VCR, camera, printer, laptop, modem

S

Handles the audio output

SS Scan Sequencer

S

Controls acoustic vector firing, its configuration and timely delivery to the FE and MP

S

Interfaces the Back End and Front End cages: sends CPU control and Scan control (vector parameters) signals to the Front End,

receives equalized echo data and FE interrupts, forwards the received and processed echoes to the Mid Processor boards in the BE with the instructions on how to process them (vector parameters again)

S

Can sync the ultrasound data to the video rate, a physio trigger, or a operator update request

S

Can simulate I & Q (echo) data for diagnostics

5–4–2 Back End (BE) Cards (Continued)

TABLE 5–8

FUNCTIONS OF MID PROCESSOR CIRCUIT CARDS

Acro-nym

Full Card Name Card Function

BMP B / M Processor

S

Processes the I & Q data for gray B and M imaging

S

its Synthetic Aperture improves averages vectors

S

Calculates the echo signal’s amplitude

S

Converts the sample rate to a display rate

S

Implements Dynamic Range and Edge Enhancement

S

Splices multiple focal zones into one image

S

Sends processed B data to the ALM

S

Sends peak signal M data to the TLM

CFP Color Flow Processor

S

Calculates blood flow velocity, variance, and power from the I & Q data

S

Transfers 2D color vectors to the CALM

S

Can enable Power Doppler Imaging

DP Doppler Processor

S

Extracts and processes the phase shift information from the I & Q data

S

Generates spectral vector data for the TLM board and Doppler audio for the PIA board in real time

5–4–2 Back End (BE) Cards (Continued)

TABLE 5–9

FUNCTIONS OF SCAN CONVERTER CIRCUIT CARDS

Acro-nym

Full Card Name

Card Function A L M /

CT

Acoustic Line Memory / C o o r d i n a t e Transform

S

Receives/holds 2D acoustic vector data from the BMP

S

Converts live gray B mode data from R–q format to X–Y

S

Implements Dual Imaging, acoustic Zoom, Spatial Compounding, Rotate, Invert Image

CALM/

CT

Color Acous-tic Line Memory / C o o r d i n a t e Transform

S

Receives/holds acoustic vector data from the CFP

S

Converts live color B vector data from R–q to X–Y format

S

Enables Pan/Zoom, Spatial Averaging, Topography

CINE Cine Memory

S

Enables the capture and replay of recent sonographic images by storing X–Y or RGB data

S

On replay, injects the stored images at different points depending on data type.

S

Uses resources on the MC, VP, and TLM TLM Time Line

Memory

S

Scan converts timeline (M and PW Doppler) data

S

Manages updates, interrupts, black bar, sweep speed, timeline freeze & replay

S

Provides alphanumeric and graphic objects to monitor VP Video

Pro-cessor

S

Manages gray and color maps, baseline shift, velocity scale, blanking, single, dual, and quad image windows

S

Generates all the video timing signals

S

Receives image data (12–bit color and 8–bit gray scale) from the TLM, XY, and CINE and converts it to RGB format using LUT’s

S

Receives Graphics, Doppler, and Physio overlay data from the TLM and converts it to RGB pixel values, and if low contrast to image, inverts it too

S

Generates digital RGB values from VHS or S–VHS video

S

Supports multiple video interfaces

S

Ha IIC controller for BE system configuration log, BE power levels calculation, and VCR decode

XY X–Y Memory

S

Controls scan conversion at the pipeline rate

S

Can control SS phasing with a video frame trigger

S

Processes raster (X–Y) format data into image frames

S

Does Frame Averaging, nonacoustic Zoom, B Compounding, Dual Images, Peak Capture, Smoothing

S

Outputs video data at the pixel clock rate

5–4–3 Control Panel Cards

There are six circuit cards in the Control Panel. These circuit cards are used to mount the keyboard, control switches, and rotary encoders and to interconnect these devices plus the microphone and trackball to the kernel subsystem.

The circuit cards and their components thus act as the command interface between the operator and the rest of the system. Lights within switches as well as a VFD (softkey) display provide feedback from the kernel to the operator.

Locations of the circuit cards within the control panel are shown in Illustration 5–8. The full names and functions of the circuit cards are listed in Table 5–10.

ÅÅÅÅÅÅÅÅÅÅÅ

CIRCUIT CARDS AND INTERCONNECTIONS WITHIN OPERATOR CONTROL PANEL ILLUSTRATION 5–8

In document ULTRASONIDO G.E LOGIQ 700 (Page 94-102)