#5 TO FULL CRIMP INCL BELLMOUTHS, NOT JUST MIDDLE
8.1 Soldered Splices
8.1.4.1 Soldered Splices - Lap – Two or More Conductors
Acceptable - Class1, 2, 3
Wires overlap at least 3 wire conductor diameters.
If required, splice is overwrapped with smaller diameter wire.
Conductor strands form a smooth joined section.
Solder is wetted forming a visible solder fillet joining the conductors for the length of the splice contact area.
Individual wire conductor strands are discernible.
Conductor strands form a smooth joined section.
Conductor strands are covered with sleeving.
Sleeving is snug to the splice and wire insulation.
No conductor strands piercing the sleeving.
Sleeving is not split or damaged.
Sleeve or wire insulation is slightly discolored but not burned or charred.
Sleeving overlaps the wire insulation on both ends of the spliced area by a minimum of 1 wire group (largest group) diameter.
The sleeving or insulation may be discolored but not burned or charred.
Figure 8-14 620A Fig 08-14
Figure 8-15 620A Fig 08-15
Figure 8-16 620A Fig 08-16
A-620B Final Draft for Industry Review – February 2012
8- 6 Process Indicator - Class 2,3
Wire bulges the sleeving but does not pierce it.<Sep2010>
Process Indicator – Class 2 Defect – Class 3
Conductors are not in full contact or are not parallel.
Defect – Class 1
No evidence of solder wetting.
Defect – Class 2
Solder fillet less than 75% of the length of the overlap interface.
Defect – Class 3
Solder fillet less than 100% of the length of the overlap interface.
Defect - Class 1,2, 3
Wires do not overlap a minimum of 3 conductor diameters of the largest wire.
Conductor overlaps insulation of the other wire.
Bulges in the sleeving.
Sharp points or projections.
Conductor strands pierce the sleeving.
Sleeving is burned/charred, split or damaged (not shown).
Conductor overlaps insulation of the other wire.
Insufficient solder fillet.
Wire splice area is exposed.
Sleeving is loose (not shown).
There are sharp points or projections covered by sleeving.
Conductor strands pierce the sleeving.
Sleeving is split or damaged (not shown).
Sleeving does not overlap the insulation on both ends of the spliced area by a minimum of 1 wire group (largest group) diameter.
Sleeve or wire insulation is burned/charred.
Sleeving is split or damaged.
Figure 8-17 620A Fig 08-19
Figure 8-18 620A Fig 08-17
Figure 8-19 620A Fig 08-18
Figure 8-20 620A Fig 08-20
Figure 8-21 620A Fig 08-21
A-620B Final Draft for Industry Review – February 2012
8- 7 8.1.4.2 Soldered Splices - Lap - Insulation Opening (Window)
This splice is accomplished by removing a section of wire insulation creating an opening (window) in the insulation. When a shrink-sleeve is used, the solder preform (ring) and pickoff wire should be centered in the wire insulation opening (window) then shrunk in place. Self sealing heat shrinkable solder devices are exempt from cleaning requirements.<Sep2010>
Acceptable – Class 1,2,3<Sep2010>
The wire opening (window) is slightly larger than the stripped portion of the pickoff wire.
Conductor is not damaged beyond the limits of 3.2.
Insulation is not damaged beyond the limits of 3.5.
Solder preform (ring) is fully melted with a visible fillet between the wire and pickoff wire.
Conductor contour is discernible.
Meltable sealing rings, if present, have flowed.
No wire strands are exposed.
Sleeve is not split or damaged.
Sleeve or wire insulation may show slight discoloration.
Defect – Class 1,2,3
The wire opening (window) is shorter in length than the stripped portion of the pickoff wire.
Conductor is damaged beyond the limits of 3.2.
Insulation is damaged beyond the limits of 3.5.
Defect – Class 1,2,3
Conductor overlaps insulation of the other wire (Figures 8-25, 26).
The solder preform (ring) is not fully melted (Figures 8-25, 26).
No visible fillet between the wire and pickoff lead (not shown).
Conductor contour is not discernible(not shown).
Meltable sealing rings, if present, have not flowed (not shown).
Wire stands are exposed (not shown).
Sleeve or wire insulation burnt or charred (not shown).
The sleeve does not meet minimum overlap requirements (not shown).
Figure 8-22 620A Fig 08-22
Figure 8-23
1. Meltable Sealing Ring(s) 2. Pickoff Wire
3. Solder Preform (solder ring) Figure 8-24
Figure 8-25
Figure 8-26
A-620B Final Draft for Industry Review – February 2012
8- 8 8.1.5 Soldered Splices – Heat Shrinkable Solder Devices
When heat shrinkable soldering devices are used the solder preform (ring) shall [D1D2D3]be completely melted and a solder fillet shall [D1D2D3]wet to the wires in the connection. Wire contour should be visible in the solder fillet.
Terminations made using heat shrinkable solder devices are exempt from the cleaning requirements.
When heat shrinkable soldering devices are used, the solder preform (ring) and pickoff wire should be centered in the wire insulation opening (window) then shrunk in place. Self sealing heat shrinkable solder devices are exempt from cleaning requirements.
A thermal indicator (if provided) is an aid for deciding when to stop heating. Its presence or absence in the installed part is not reason for rejection of the installation.<Jan2011>
Acceptable – Class 1,2,3
Wires overlap for at least 3 conductor diameters and are approximately parallel.
The solder preform (ring) is centered over the splice.
Solder preform has fully melted and forms a fillet joining both wires.
Conductor contour is discernible.
Sleeving covers wire insulation on both ends of the spliced area by a minimum of 1 wire diameter.
No conductor strands piercing the sleeving.
Sleeve is discolored but not burned or charred.
Meltable sealing ring does not interfere with formation of required solder connection.
Meltable sealing ring provides 360º of seal at both ends.
Solder preform (ring) is fully melted with a visible fillet between the wire and pickoff wire.
No wire strands are exposed.
Sleeve is not split or damaged.
Sleeve conforms to the contour of the lead and the cable.
Process Indicator – Class 2,3
Wire bulges the sleeving but does not pierce it.
Figure 8-23 620A Fig 08-23
1. Meltable Sealing Ring(s) 2. Pickoff Wire
3. Solder Preform (solder ring)
Figure 8-24 620A Fig 08-27
Figure 8-25 620A Fig 08-24
A-620B Final Draft for Industry Review – February 2012
8- 9 Defect – Class 1,2,3
Solder fillet not wetted to both wires.
The solder preform ring is not fully melted,.
(Figures 8-25, 26).
There are sharp points or projections.
Conductor strands pierce the sleeving.
Wires do not overlap at least 3 conductor diameters.
Sleeving does not cover wire insulation on both ends at least 1 wire diameter (not shown).
Meltable sealing ring interferes with formation of required solder connection.
Meltable sealing ring does not provide 360º of seal at either end.
Sleeving or wire insulation is burned or charred.
(not shown).
Conductor overlaps insulation of the other wire (Figures 8-25, 26).
No visible fillet between the wire and pickoff lead (not shown).
Conductor contour is not discernible(not shown).
Wire stands are exposed (not shown).
Solder has flowed beyond the meltable sealing rings or has extruded beyond the end of the heat shrinkable sleeving.
Sleeve does not conform to the contour of the lead and the cable.
Figure 8-26 620A Fig 08-25
Figure 8-27 620A Fig 08-26
Figure 8-28 620A Fig 08-28
Figure 8-29 620A Fig 08-29
Figure 8-30 620A Fig 08-30
A-620B Final Draft for Industry Review – February 2012
8- 10 8.2 Crimped Splices
When attaching multiple wires to a single terminal, each wire shall [D1D2D3]meet the same acceptability criteria as a single wire termination. When attaching single or multiple wires to a terminal, the combined circular mil area of the wires shall [D1D2D3]comply with the circular mil area range for the terminal.