PROTECTION PRODUCTS
PROTECTION PRODUCTS
LC03-3.3
Low Capacitance 3.3 Volt TVS
for High Speed Interfaces
1800 watts peak pulse power (tp = 8/20µs)
Transient protection for high-speed data lines to Bellcore 1089 (Intra-Building) 100A (2/10µs) ITU K.20 IPP=40A (5/310µs)IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 100A (8/20µs)
Protects two lines in common and differential mode
Low capacitance for high-speed interfaces
Low operating voltage (3.3V)
Low clamping voltage
Integrated structure saves board space and increases reliability
Solid-state EPD technologyDescription
Features
Circuit Diagram
Schematic & PIN Configuration
Applications
Mechanical Characteristics
The LC03-3.3 transient voltage suppressor is designed to protect components which are connected to high speed data and telecommunication lines from voltage surges caused by lightning, electrostatic discharge (ESD), and electrical fast transients (EFT).
TVS diodes are ideal for use as board level protection of sensitive semiconductor components. The LC03-3.3 combines a TVS diode with a rectifier bridge to provide transient protection in both common and differential mode with a single device. The LC03-3.3 utilizes Semtech’s EPD technology for superior electri-cal characteristics at 3.3 volts. The capacitance of the device is minimized to ensure correct signal transmis-sion on high speed lines.
The LC03-3.3 meets the short-haul (intra-building) transient immunity requirements of Bellcore 1089 for telecommunications applications.
JEDEC SO-8 package
RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code
Packaging : Tube or Tape and Reel per EIA 481
Low Voltage Interfaces
T3/E3
10/100 Ethernet
Set-Top Box
ISDN Interfaces 1 2 7 8 Pin 1 and 8PRELIMINARY
PROTECTION PRODUCTS
LC03-3.3
Absolute Maximum Rating
Electrical Characteristics
g n i t a R Symbol Value Units t ( r e w o P e s l u P k a e P p=8/20µs) Ppk 1800 Watts t ( t n e r r u C e s l u P k a e P p=8/20µs) IPP 100 A e r u t a r e p m e T g n ir e d l o S d a e L TL 260(10sec). °C e r u t a r e p m e T g n it a r e p O TJ -55to+125 °C e r u t a r e p m e T e g a r o t S TSTG -55to+150 °C 3 . 3 -3 0 C L r e t e m a r a P Symbol Conditions Minimum Typical Maximum Units e g a tl o V f f O -d n a t S e s r e v e R VRWM 3.3 V e g a tl o V h g u o r h T -h c n u P VPT IPT=2µA 3.5 V e g a tl o V k c a B -p a n S VSB ISB=50mA 2.8 V t n e r r u C e g a k a e L e s r e v e R IR VRWM=3.3V,T=25°C 1 µA e g a tl o V g n i p m a l C VC IPP=50A,tp=8/20µs d n u o r G -o t-e n i L 11.5 V e g a tl o V g n i p m a l C VC IPP=50A,tp=8/20µs e n i L -o t-e n i L 13.5 V e g a tl o V g n i p m a l C VC IPP=100A,tp=8/20µs d n u o r G -o t-e n i L 15 V e g a tl o V g n i p m a l C VC IPP=100A,tp=8/20µs e n i L -o t-e n i L 18 V e c n a ti c a p a C n o it c n u J Cj BetweenI/Opinsand d n u o r G VR=0V,f=1MHz 6 1 25 pF s n i p O / I n e e w t e B VR=0V,f=1MHz 8 12 pFPROTECTION PRODUCTS
PROTECTION PRODUCTS
LC03-3.3
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 Time (µs) Pe rcen t o f IPP e-t td = IPP/2 Waveform Parameters: tr = 8µs td = 20µs Pulse Waveform
Normalized Capacitance vs. Reverse Voltage
0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 175 Ambient Temperature - TA (oC) % of Ra te d P o w er or I PP 0 5 10 15 20 0 20 40 60 80 100
Peak Pulse Current - IPP (A)
C la m ping V o lt ag e VC (V) Waveform Parameters: tr = 8µs td = 20µs Line-To-Ground Line-To-Line 0.1 1 10 100 0.1 1 10 100 1000 Pulse Duration - tp (µs) Pe ak Pu ls e Po w er - P pk (k W ) Insertion Loss S21 (Line to Ground) CH1 S21 LOG 3 dB/ REF 0 dB 0.4 0.6 0.8 1 1.2 1.4 CJ (VR ) / CJ (VR =0 )
PRELIMINARY
PROTECTION PRODUCTS
LC03-3.3
Connection for Differential (Line-to-Line) and Com-mon Mode Protection (Line-to-Ground) Device Connection Options for Protection of Two High-Speed Data Lines
The LC03-3.3 is designed to protect two high-speed data lines (one differential pair) from transient over-voltages which result from lightning and ESD. The device can be configured to protect in differential (Line-to-Line) and common (Line-to-Ground) mode. Data line inputs/outputs are connected at pins 1 to 8, and 4 to 5 as shown. Pins 2, 3, 6, and 7 are connected to ground. These pins should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. In applications where high common mode voltages are present, differential protection is achieved by leaving pins 2, 3, 6, and 7 not connected.
Connection for Differential Protection (Line-to-Line)
Applications Information
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com-pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
PROTECTION PRODUCTS
PROTECTION PRODUCTS
LC03-3.3
Applications Information - SPICE Model
LC03-3.3 Spice Model s r e t e m a r a P e c i p S 3 . 3 -3 0 C L r e t e m a r a P Unit D1(TVS) D2(LCRD) S I Amp 1.0E-20 3.98E-13 V B Votl 3.5 240 J V Votl 13.8 0.64 S R Ohm 0.0257 0.048 V B I Amp 1E-3 1E-3 O J C Farad 3.4e-9 8.0E-12 T T sec 2.541E-9 2.541E-9 0.7 nH
D2
D2
D1
D2
D2
PRELIMINARY
PROTECTION PRODUCTS
LC03-3.3
Land Pattern -SO-8
Outline Drawing - SO-8
bxN 2X N/2 TIPS SEATING aaa C E/2 2X 1 2 N A D A1 E1 bbb C A-B D ccc C e/2 A2 SEE DETAILA SIDE VIEW A B C D e DETAILA c L (L1) 01 0.25 GAGE PLANE h h H PLANE
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
-B-CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). DATUMS AND TO BE DETERMINED AT DATUM PLANE NOTES:
1.
2. -A-
-H-REFERENCE JEDEC STD MS-012, VARIATION AA. 4. .050 BSC .236 BSC 8 .010 .150 .189 .154 .193 .012 -8 0.25 1.27 BSC 6.00 BSC 3.90 4.90 -.157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 (.041) .004 .008 -.028 -0° .016 .007 .049 .004 .053 8° 0° 0.20 0.10 - 8° 0.40 0.17 1.25 0.10 .041 .010 .069 .065 .010 1.35 (1.04)0.72 -1.04 0.25 -- 1.75 1.65 0.25 0.25 -.010 .020 - 0.50 L1 N 01 bbb aaa ccc A b A2 A1 D E E1 L h e c
DIM NOM MINMILLIMETERS DIMENSIONS
INCHES
MIN MAX NOMMAX
E (.205) (5.20) Z G Y P (C) .118 3.00 1.27 .050 0.60 .024 2.20 .087 7.40 .291 X INCHES DIMENSIONS Z P Y X DIM C G MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A. 2.
