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Committed to Reliability & Relationships

Valu Builds for Rigid Flex

Stable, robust builds for cost effective rigid flex

We have gathered a set of low cost standard materials, with

yield friendly design guidelines, to produce a cost effective rigid

flex solution for PWB designers who are new to rigid flex, or

need a value solution to their electronic packaging needs

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Valu For Our Customers

• 

Low cost rigid flex – nominal 35¢, or less, per square inch per layer, versus 45¢

• 

Simple solution

• 

Increased manufacturing yield

• 

“One board” electronic packaging – no connectors to fail

• 

Thinner, less weight, and form fitting electronics

• 

Faster production times

• 

Easy, low risk entry point for those new to rigid flex

• 

“Stepping stone” to more advanced rigid flex design

• 

Comprehensive solution

– RA wrought foil, rather than ED, for maximum endurance life in dynamic flex 

– UL 94V0 approved 

– RoHS compliant 

– Polyimide for lead free assembly 

– One solution – dynamic or flex to install applications

Seven layups Available

• 

4 Layer

• 

6 Layer

• 

6 Layer with quad flex

• 

6 Layer with 2 doublets

• 

8 Layer

• 

8 Layer with quad flex

• 

8 Layer with 2 doublets

• 

10 Layer

• 

10 Layer with quad flex

• 

10 Layer with 2 doublets

Certification

• 

IPC Class I, II and III

• 

MIL-PRF-31032, Mil-P-50884

12 Low Cost Building Blocks

Items may be substituted with similar

IPC certified materials

• 

Adhesiveless flex .002 H/H

• 

Adhesiveless flex .002 1/1

• 

.002 coverlayer – .001 Kapton/.001 adhesive

• 

1080 no flow prepregs

• 

.005” core H/H

• 

.005” core 1/1

• 

½ oz  copper foil

• 

1 oz copper foil

• 

Thickness tolerance:  ± 10%

• 

Line spacing:  0.0035”/0.0035” and  greater

• 

Conventional Vias:  0.0079” drilled  and greater

• 

Pad size:  drilled via + 0.010” 

• 

Copper plate:  0.001” minimum in  hole

• 

Mechanical dimension tolerance:   

• 

Feature to routed profile tolerance:    ± 0.005”

• 

Feature to flex profile laser tolerance:    ± 0.004

• 

All flex arms must terminate in rigid  area (no scribe and break)

• 

No fillets (beading at rigid/flex inter-face)

• 

Hole prep: desmear – no 3 point 

• 

Pad finish:  ENIG or HASL

• 

Soldermask:  Taiyo

• 

Electrically tested and certified

• 

DRC run on your data prior to build

• 

Cost adders:   – Controlled impedance – Laser, blind, buried or filled vias – Button plating – Laser profiling 

Design Rules

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Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H

0.0226 Total Thickness w/ 1/2 oz Copper

0.0014 adder for 1 oz Copper

0.024 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.005 0.0007 0.0012 0.0007 0.0007 0.0012 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.0001 0.001 0.005 0.0007 0.0012 0.0007 0.0007 0.0012 0.0007 0.001 0.005 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H

0.034 Total Thickness w/ 1/2 oz Copper

0.0014 adder for 1 oz Copper

0.0354 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.005 0.0007 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.0012 0.0007 0.0007 0.001 0.005 0.0007 0.0012 0.0007 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Printed Circuits, Incorporated  1200 West 96th Street  Minneapolis, MN 55431-2699 www.PrintedCircuits.com  FTP: ftp://ftp.printedcircuits.com Phone: 952.888.7900  Toll Free: 888.844.8416  Fax: 952.888.2719  Modem: 952.888.4219

4 Layer Valu Build

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Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H Flame Retarded Bondply

0.029 Total Thickness w/ 1/2 oz Copper

0.0028 adder for 1 oz Copper

0.0318 Total Thickness w/ 1 oz Copper 0.0138 Flexible composite thickness x 12 “Rule of thumb” min. bend radius 0.1656 Min. bend radius for 1/2 oz flex area 0.1992 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.005 0.0007 0.0012 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.0012 0.0007 0.001 0.005 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H

0.035 Total Thickness w/ 1/2 oz Copper

0.0028 adder for 1 oz Copper

0.0378 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.0007 0.0012 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.0012 0.0007 0.005 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

6 Layer Quad Flex

Valu Build

6 Layer Two Doublet Flex

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Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H

0.0454 Total Thickness w/ 1/2 oz Copper

0.0014 adder for 1 oz Copper

0.0456 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.005 0.0007 0.0012 0.007 0.005 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

0.0404 Total Thickness w/ 1/2 oz Copper

0.0028 adder for 1 oz Copper

0.0432 Total Thickness w/ 1 oz Copper 0.0138 Flexible composite thickness x 12 “Rule of thumb” min. bend radius 0.1656 Min. bend radius for 1/2 oz flex area 0.1992 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.0012 0.0007 0.0012 0.0007 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H Flame Retarded Bondply

Printed Circuits, Incorporated  1200 West 96th Street  Minneapolis, MN 55431-2699 www.PrintedCircuits.com  FTP: ftp://ftp.printedcircuits.com Phone: 952.888.7900  Toll Free: 888.844.8416  Fax: 952.888.2719  Modem: 952.888.4219

8 Layer Valu Build

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0.0464 Total Thickness w/ 1/2 oz Copper

0.0028 adder for 1 oz Copper

0.0492 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.0012 0.0007 0.0012 0.0007 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H Photoimagable Soldermask Plated Copper 1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H

0.0568 Total Thickness w/ 1/2 oz Copper

0.0014 adder for 1 oz Copper

0.0582 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.005 0.0007 0.005 0.007 0.0012 0.0007 0.0012 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 PC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 PC - 4101/L24 IPC - 4101/L42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

8 Layer Two Doublet Flex

Valu Build

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0.0511 Total Thickness w/ 1/2 oz Copper

0.0028 adder for 1 oz Copper

0.0539 Total Thickness w/ 1 oz Copper 0.0138 Flexible composite thickness x 12 “Rule of thumb” min. bend radius 0.1656 Min. bend radius for 1/2 oz flex area 0.1992 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.0012 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H Flame Retarded Bondply

0.0571 Total Thickness w/ 1/2 oz Copper

0.0014 adder for 1 oz Copper

0.0585 Total Thickness w/ 1 oz Copper 0.0074 Flexible composite thickness

x 6 “Rule of thumb” min. bend radius

0.0444 Min. bend radius for 1/2 oz flex area 0.0528 Min. bend radius for 1 oz flex area

0.0007 0.0012 0.0007 0.005 0.0007 0.005 0.0007 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.001 0.001 0.0007 0.002 0.0007 0.001 0.001 0.005 0.0007 0.005 0.0007 0.0012 0.0007 0.0012 0.0007 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4203/1 IPC - 4203/1 IPC - 4204/11 IPC - 4204/11 IPC - 4203/1 IPC - 4203/1 IPC - 4101/P24 IPC - 4101/P42 IPC - 4101/L24 IPC - 4101/L42 IPC - 4101/P24 IPC - 4101/P42

IPC Material Description IPC Material Designation

FR4 Build Polyimide Build

Photoimageable Soldermask Plated Copper

1/2 oz Copper Foil 0.005 H/H Core

1080 No Flow Prepeg (1 or 2 Plies) Flame Retarded Coverlayer Acrylic Adhesive 1/2 oz RA Copper Foil Adhesiveless Flexible Laminate .002 H/H Printed Circuits, Incorporated  1200 West 96th Street  Minneapolis, MN 55431-2699 www.PrintedCircuits.com  FTP: ftp://ftp.printedcircuits.com Phone: 952.888.7900  Toll Free: 888.844.8416  Fax: 952.888.2719  Modem: 952.888.4219

10 Layer Quad Flex

Valu Build

10 Layer Two Doublet Flex

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PCi Certifications:

Military Performance Spec Mil-PRF-31032 Military Flexible Circuits Certification Mil-P-50884 Registered with US Department of  State for ITAR compliance, Code M13523 US and Canada Joint Certification Number 0040478 ISO 9001:2008 from Det Norske Veritas The most extensive UL Qualification for Rigid Flex in the World - file number E67398 Federal Tax ID: 41-1296498 UL File Number: E67398 Mil Cage Code: 65114 SIC Code: 3672 NAICS Code: 334412 Producer Price Index Product Code: 334412334412 Commodity Code: 1784901 Duns Number: 08-611-5615 Bob Burns  National Sales and Marketing  Email: [email protected]  Tel: 952-886-9307   Matt Tannehill  Sales Engineering Email: [email protected] Tel: 952.886.9334 Printed Circuits, Incorporated  1200 West 96th Street  Minneapolis, MN 55431-2699 Phone: 952.888.7900  Toll Free: 888.844.8416  Fax: 952.888.2719  Modem: 952.888.4219 www.PrintedCircuits.com 

PCi Sales and Engineering Contacts:

References

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