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Smart Highside Power Switch

Features

• Overload protection

Current limitation • Short circuit protection

Thermal shutdown

• Overvoltage protection (including load dump)

Reverse battery protection1)

• Undervoltage and overvoltage shutdown with auto-restart and hysteresis

• Open drain diagnostic output

Open load detection in ON-state • CMOS compatible input

Loss of ground and loss of Vbb protection • Electrostatic discharge (ESD) protection

Application

µC compatible power switch with diagnostic feedback for 12 V DC grounded loads

• Most suitable for resistive and lamp loads

General Description

N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection functions. + Vbb IN ST Signal GND ESD PROFET OUT GND Logic Voltage sensor Voltage source Charge pump

Level shifter Temperature

sensor Rectifier Gate protection Current limit 2 4 1 3 5 Load GND Load VLogic Overvoltage protection GND R O Open load detection Short to Vbb

1) With external current limit (e.g. resistor RGND=150 ) in GND connection, resistor in series with ST connection, reverse load current limited by connected load.

Product Summary

Overvoltage protection

V

bb(AZ)

43

V

Operating voltage

V

bb(on)

5.0 ... 24 V

On-state resistance

R

ON

60 m

Load current (ISO)

I

L(ISO)

7.0

A

Current limitation

I

L(SCr)

17

A

TO-220AB/5

5 Standard 1 5 Straight leads 1 5 SMD

(2)

BTS 425 L1

Pin

Symbol

Function

1

GND

-

Logic ground

2

IN

I

Input, activates the power switch in case of logical high signal

3

Vbb

+

Positive power supply voltage,

the tab is shorted to this pin

4

ST

S

Diagnostic feedback, low on failure

5

OUT

(Load, L)

O

Output to the load

Maximum Ratings at T

j

= 25 °C unless otherwise specified

Parameter

Symbol

Values

Unit

Supply voltage (overvoltage protection see page 3)

V

bb

43

V

Supply voltage for full short circuit protection

T

j Start

=-40 ...+150°C

V

bb

24

V

Load dump protection

2)

V

LoadDump

= U

A

+ V

s

, U

A

= 13.5 V

R

I3)

= 2

, R

L

= 1.7

, t

d

= 200 ms, IN= low or high

V

Load dump4)

60

V

Load current (Short circuit current, see page 4)

I

L

self-limited

A

Operating temperature range

Storage temperature range

T

j

T

stg

-40 ...+150

-55 ...+150

°C

Power dissipation (DC), T

C

25 °C

P

tot

75

W

Electrostatic discharge capability (ESD)

IN:

(Human Body Model)

all other pins:

acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993

V

ESD

1.0

2.0

kV

Input voltage (DC)

V

IN

-10 ... +16

V

Current through input pin (DC)

Current through status pin (DC)

see internal circuit diagrams page 6

I

IN

I

ST

±

2.0

±

5.0

mA

Thermal Characteristics

Parameter and Conditions

Symbol

Values

Unit

min

typ

max

Thermal resistance

chip - case:

junction - ambient (free air):

R

thJC RthJA

--1.67

75

K/W

SMD version, device on PCB

5)

:

--

34

2) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a 150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the protection of the input is integrated.

3) R

I = internal resistance of the load dump test pulse generator 4) V

Load dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839

5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µ

m thick) copper area for Vbb connection. PCB is vertical without blown air.

(3)

Electrical Characteristics

Parameter and Conditions

Symbol

Values

Unit

at Tj = 25 °C, Vbb = 12 V unless otherwise specified

min

typ

max

Load Switching Capabilities and Characteristics

On-state resistance (pin 3 to 5)

I

L

= 2 A

T

j

=25 °C:

T

j

=150 °C:

R

ON

--

50

100

60

120

m

Nominal load current, ISO Norm (pin 3 to 5)

V

ON

= 0.5 V, T

C

= 85 °C

I

L(ISO)

5.8

7.0

--

A

Output current (pin

5

) while GND disconnected or

GND pulled up, V

bb

=30 V, V

IN

= 0, see diagram

page 7

I

L(GNDhigh)

--

--

10

mA

Turn-on time

IN

to 90% V

OUT

:

Turn-off time

IN

to 10% V

OUT

:

R

L

= 12

,

T

j

=-40...+150°C

t

on

t

off

80

80

200

230

400

450

µ

s

Slew rate on

10 to 30% V

OUT,

R

L

= 12

,

T

j

=-40...+150°C

dV /dt

on

0.1

--

1

V/

µ

s

Slew rate off

70 to 40% V

OUT

, R

L

= 12

,

T

j

=-40...+150°C

-dV/dt

off

0.1

--

1

V/

µ

s

Operating Parameters

Operating voltage

6)

T

j

=-40...+150°C:

V

bb(on)

5.0

--

24

V

Undervoltage shutdown

T

j

=-40...+150°C:

V

bb(under)

3.5

--

5.0

V

Undervoltage restart

T

j

=-40...+150°C:

V

bb(u rst)

--

--

5.0

V

Undervoltage restart of charge pump

see diagram page 10

T

j

=-40...+150°C:

V

bb(ucp)

--

5.6

7.0

V

Undervoltage hysteresis

V

bb(under)

= V

bb(u rst)

- V

bb(under)

V

bb(under)

--

0.2

--

V

Overvoltage shutdown

T

j

=-40...+150°C:

V

bb(over)

24

--

34

V

Overvoltage restart

T

j

=-40...+150°C:

V

bb(o rst)

23

--

--

V

Overvoltage hysteresis

T

j

=-40...+150°C:

V

bb(over)

--

0.5

--

V

Overvoltage protection

7)

T

j

=-40...+150°C:

I

bb

=40 mA

V

bb(AZ)

42

47

--

V

Standby current (pin 3)

T

j

=-40...+25°C

:

V

IN

=0

T

j

= 150°C:

I

bb(off)

--10

12

25

28

µ

A

Leakage output current (included in I

bb(off)

)

V

IN

=0

I

L(off)

--

--

12

µ

A

Operating current (Pin 1)

8)

, V

IN

=5 V,

T

j

=-40...+150°C

I

GND

--

1.8

3.5

mA

6) At supply voltage increase up to V

bb= 5.6 V typ without charge pump, VOUT≈Vbb - 2 V 7) See also VON(CL) in table of protection functions and circuit diagram page 7.

(4)

BTS 425 L1

Parameter and Conditions

Symbol

Values

Unit

at Tj = 25 °C, Vbb = 12 V unless otherwise specified

min

typ

max

Protection Functions

Initial peak short circuit current limit (pin 3 to 5)

I

L(SCp)

T

j

=-40°C:

T

j

=25°C:

T

j

=+150°C:

27

20

12

37

30

18

47

40

25

A

Repetitive short circuit shutdown current limit

I

L(SCr)

T

j

= T

jt

(see timing diagrams, page 9)

--

17

--

A

Thermal overload trip temperature

T

jt

150

--

--

°C

Thermal hysteresis

T

jt

--

10

--

K

Reverse battery (pin 3 to 1)

9

)

-V

bb

--

--

32

V

Reverse battery voltage drop

(Vout > Vbb)

I

L

= -2 A

T

j

=150 °C:

-V

ON(rev)

--

610

--

mV

Diagnostic Characteristics

Open load detection current

T

j

=-40 °C

:

(on-condition, )

T

j

=25..150°C:

I

L (OL)

150

150

600

450

950

750

mA

Open load detection voltage

10

) (off-condition)

T

j

=-40..150°C:

V

OUT(OL)

2

3

4

V

Internal output pull down

(pin 5 to 1), V

OUT

=5 V, T

j

=-40..150°C

R

O

4

10

30

k

9) Requires 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7).

(5)

Parameter and Conditions

Symbol

Values

Unit

at Tj = 25 °C, Vbb = 12 V unless otherwise specified

min

typ

max

Input and Status Feedback

11)

Input resistance

T

j

=-40..150°C, see circuit page 6

R

I

2.5

3.5

6

k

Input turn-on threshold voltage

T

j

=-40..+150°C:

V

IN(T+)

1.7

--

3.5

V

Input turn-off threshold voltage

T

j

=-40..+150°C:

V

IN(T-)

1.5

--

--

V

Input threshold hysteresis

V

IN(T)

--

0.5

--

V

Off state input current (pin 2), V

IN

= 0.4 V,

T

j

=-40..+150°C

I

IN(off)

1

--

50

µ

A

On state input current (pin 2), V

IN

= 3.5 V,

T

j

=-40..+150°C

I

IN(on)

20

50

90

µ

A

Delay time for status with open load after switch

off

(see timing diagrams, page 10

), T

j

=-40..+150°C

t

d(ST OL4)

100

520

1000

µ

s

Status invalid after positive input slope

(open load)

Tj=-40 ... +150°C:

t

d(ST)

--

250

600

µ

s

Status output (open drain)

Zener limit voltage

T

j

=-40...+150°C, I

ST

= +1.6 mA:

ST low voltage

T

j

=-40...+25°C, I

ST

= +1.6 mA:

T

j

= +150°C, I

ST

= +1.6 mA:

V

ST(high)

V

ST(low)

5.4

--6.1

--0.4

0.6

V

11) If a ground resistor R

(6)

BTS 425 L1

Truth Table

Input- Output Status

level level 425 L1 426 L1 Normal operation L H L H H H Open load L H 12) H H (L13)) L Short circuit to Vbb L H H H L14) H (L15)) Overtem-perature L H L L H L Under-voltage L H L L H H Overvoltage L H L L H H

L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit H = "High" Level Status signal after the time delay shown in the diagrams (see fig 5. page 10)

12) Power Transistor off, high impedance

13) with external resistor between pin 3 and pin 5 14) An external short of output to V

bb, in the off state, causes an internal current from output to ground. If RGND

is used, an offset voltage at the GND and ST pins will occur and the VST low signal may be errorious.

15) Low resistance to V

bb may be detected in ON-state by the no-load-detection

Terms

PROFET V IN ST OUT GND bb VST V IN I ST I IN V bb Ibb I L VOUT I GND VON 1 2 4 3 5 R GND

Input circuit (ESD protection)

IN GND I R ESD-ZD I I I

ESD zener diodes are not to be used as voltage clamp at DC conditions. Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).

Status output

ST GND ESD-ZD +5V RST(ON)

ESD-Zener diode: 6.1 V typ., max 5 mA;

RST(ON) < 380 Ω at 1.6 mA, ESD zener diodes are not

to be used as voltage clamp at DC conditions.

Operation in this mode may result in a drift of the zener voltage (increase of up to 1 V).

overvoltage output clamp

+ Vbb OUT GND PROFET V Z VON VON clamped to 47 V typ.

(7)

Overvolt. and reverse batt. protection

+ Vbb IN ST ST R IN R GND GND R Signal GND Logic PROFET V Z2 I R VZ1 VZ1 = 6.2 V typ., VZ2 = 47 V typ., RGND = 150 Ω, RST= 15 kΩ, RI= 3.5 kΩ typ.

Open-load detection

ON-state diagnostic condition: VON < RON * IL(OL); IN

high Open load detection Logic unit + Vbb OUT ON VON

OFF-state diagnostic condition: VOUT > 3 V typ.; IN low

Open load detection Logic unit VOUT Signal GND R EXT R O OFF

GND disconnect

PROFET V IN ST OUT GND bb V bb 1 2 4 3 5 V IN VST VGND

In case of Input=high is VOUT ≈ VIN - VIN(T+) . Due to VGND >0, no VST = low signal available.

GND disconnect with GND pull up

PROFET V IN ST OUT GND bb V bb 1 2 4 3 5 V GND V INVST

If VGND > VIN - VIN(T+) device stays off Due to VGND >0, no VST = low signal available.

(8)

BTS 425 L1

Typ. transient thermal impedance chip case

ZthJC = f(tp) ZthJC [K/W] 0.01 0.1 1 10

1E-5 1E-4 1E-3 1E-2 1E-1 1E0 1E1 0 0.01 0.02 0.05 0.1 0.2 0.5 D= tp [s]

Typ. trans. thermal impedance chip to ambient air ZthJA = f(tp), Device on 50mm * 50mm * 1.5mm epoxy

PCB FR4 with 6cm2 (one layer, 70µm thick) copper

area for Vbb connection. PCB is vertical without blown air. ZthJA [K/W] 0.1 1 10 100

1E-5 1E-4 1E-3 1E-2 1E-1 1E0 1E1 1E2 1E3

0 0.01 0.02 0.05 0.1 0.2 0.5 D= tp [s]

(9)

Timing diagrams

Figure 1a: Vbb turn on:

IN V OUT t V bb ST open drain

proper turn on under all conditions

Figure 2a: Switching a lamp,

IN ST OUT L t V I

Figure 3a: Short circuit

shut down by overtempertature, reset by cooling

IN ST L t I L(SCr) I I L(SCp)

Heating up may require several milliseconds, depending on external conditions

Figure 4a: Overtemperature: Reset if Tj <Tjt IN ST OUT J t V T

(10)

BTS 425 L1

Figure 5a: Open load: detection in ON-state, turn

on/off to open load

IN ST OUT L t V I open t d(ST) td(ST OL4)

The status delay time td(ST OL4) allows to ditinguish between

the failure modes "open load" and "overtemperature".

Figure 5b: Open load: detection in ON-state, open load occurs in on-state

IN ST OUT L t V

I normal open normal

t

d(ST OL1) td(ST OL2)

td(ST OL1) = 20 µs typ., td(ST OL2) = 10 µs typ

Figure 5c: Open load: detection in ON- and OFF-state (with REXT), turn on/off to open load

IN ST OUT L t V I open t d(ST)

Figure 6a: Undervoltage:

IN V OUT t V bb ST open drain V V bb(under) bb(u rst) bb(u cp) V

(11)

Figure 6b: Undervoltage restart of charge pump bb(under) V V bb(u rst) V bb(over) V bb(o rst) V bb(u cp) off-state on-state VON(CL) Vbb Von off-state

charge pump starts at Vbb(ucp) =5.6 V typ.

Figure 7a: Overvoltage:

IN V OUT t V bb ST ON(CL) V Vbb(over) Vbb(o rst)

(12)

BTS 425 L1

Package and Ordering Code

All dimensions in mm

Standard TO-220AB/5

Ordering code

BTS425L1 Q67060-S6100-A2

TO-220AB/5, Option E3043

Ordering code

BTS425L1 E3043 Q67060-S6100-A4

SMD TO-220AB/5, Opt. E3062

Ordering code BTS425L1 E3062A T&R: Q67060-S6100-A3

Components used in life-support devices or systems must be expressly authorised for such purpose! Critical components16) of the Semiconductor Group of Siemens AG, may only be used in life supporting devices or systems17) with the express written approval of the Semiconductor Group of Siemens AG.

16) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 17) Life support devices or systems are intended (a) to be

implanted in the human body or (b) support and/or maintain and sustain and/or protect human life. If they fail, it is reasonably to assume that the health of the user or other persons may be endangered.

(13)

This datasheet has been download from:

www.datasheetcatalog.com

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