Gold Dot™
Connection Systems Connection Systems
Gold Dot
™
speed, density
and reliability
Delphi Connection Systems has the solution for emerging interconnect requirements of speed and high reliability. If your design goals include an interconnection application requiring up to 200 contacts per linear inch at speeds of 2.5 GHz or higher, or board stacking height restrictions down to 0.8 mm, Delphi’s Gold Dot can help meet your needs. The Gold Dot flexible printed circuit is the principle building block for a superior connection system. Two unique features of this interconnect system are:
1) precisely controlled additive circuit traces for signal integrity 2) shaped planar contacts for high contact integrity.
Delphi’s Gold Dot has millions of circuits in the field supporting high performance environments. With more than 25 years of demonstrated experience as a major supplier of flex-based connection systems, we provide value through our technology, product performance, quality, reliability and services.
Gold Dot technology is used to simplify interconnects between printed circuit boards (PCBs). Four different board-to-board interconnect configurations are available.
Gold Dot
Interconnect Families
Jumper
Flexible interconnect between two PCBs
The Gold Dot
Connection System
Connection Systems
Product Features
High Speed
Superior impedance control leads to excellent signal integrity at 2.5 GHz speeds
High Density
Hundreds of signals per square inch save PCB space
Solderless
Simple compression contacts require no soldering for high reliability
Durability
High strength contacts can survive up to thousands of matings and dematings
Versatility
Directly intermates with plated through-hole on printed circuit boards
Achieved Telcordia Compliance
Telcordia (Bellcore GR-1217-CORE) compliant for telecom and harsh environment applications
Mezzanine
Connects PCBs that are stacked
Backplane
Right angle interconnects between two PCBs
The Flex
Extreme signal speed and affordable customization are made possible by Delphi Connection Systems’ bumped flex manufacturing process. Precise, additively-plated flex circuit traces carry signals to the shaped Gold Dot contacts with exceptional fidelity.
Mini Mezzanine
Low profile, compression-based, z-axis connector
Shaped Contacts
The Gold Dot contact is a shaped copper bump, created in 3D with signal traces for robustness and precision. The bump is then plated with gold or other precious metals. The gold dots are aligned and compressed against simple contact pads on the PCB to create the interconnect.
Typical Performance Characteristics†
Rated Current per Dot 1 amp max.* Dielectric Strength 500 - 700 VAC Insulation Resistance 500 VDS Contact Resistance < 10 mΩ
Characteristic Impedance 50Ω ±10% (single ended) 100Ω ±10% (differential) Operating Frequency Up to 10 Gbits/sec.
Cross Talk < 5% @ 62.5 ps Tr, within differential pair < .5% @ 62.5 ps Tr, pair to pair
Capacitance < 3 pF/in
Contact Force 40 to 50 grams per contact Vibration 10 G max. peak, 10 to 500 Hz Mechanical Shock 30 G, 294 m/s2peak acceleration,
11 ms duration
Operating Temperature -40°C to +125°C (or higher) continuous Mating Surface Immersion gold, hard gold, solder
The Clamp
Alignment and compression are provided by the clamping hardware. Reliable electrical connections are made by pressuring the Gold Dot flex with compliant, heat-resistant elastomer that conforms to irregularities and maintains contact forces for thousands of hours. Delphi Connection Systems uses only highly stable elastomers with low compression set to help ensure that the force applied stays on the dots.
Cross-sectional view of a typical Gold Dot
FLEX CIRCUIT CLAMP DEVICE ELASTOMER GOLD DOTS PWB DIELECTRIC LAYER GROUND LAYER DIELECTRIC LAYER GOLD DOT DIE PAD SHAPED CONTACT
IC
† Please see Gold Dot data sheets on Delphi’s website for specific product performance characteristics at www.delphi.com/connect.
Custom Designs
Delphi Connection Systems offers a wide range of Gold Dot based custom flexible interconnect solutions. These customized solutions provide rugged connector and circuit construction, compliant pressure contacts, high reliability in harsh environments, high signal density and a solderless, pressure interconnection. For high-speed solutions, Delphi employs SPICE, AnSoft and other numerical solvers. Mechanical systems are verified using linear and non-linear structural/thermal FEA. We support the popular standard file formats such as IGES, DXF, STEP, Parasolid, and most versions of Gerber for easy technical communication with customers and suppliers. For more information on custom designs, please visit our website at
www.delphi.com/connect to use our on-line Design Configurator or
contact a Delphi Connection Systems application engineer at (949) 660-5701.
High Speed, High Density,
Wide Range of Applications
Computers and Peripherals
Desktops and workstations Mainframes
High speed modems
Printers, fax machines, copiers and scanners
Telecommunications
Cellular phones
Network switches and routers Communication devices Other portable electronics
Instrumentation-Emulation-Testing
Up to 10,000 board-to-board controlled impedance lines
Backplane interconnection MCM, PCB testing
MR head processing, disk drive test interface Flexible and rugged for portable applications
Satellites
Power generation and signal distribution Satellite antennas and solar arrays
Semiconductors
Known Good Die test substrate BGA/LGA/IC interconnect socket Burn-in test substrates
Interposer between die and test socket
Military
Avionics Weapon systems
Missile umbilical connections Military communication equipment
Automotive
Engine control computers Instrumentation Emulation
Printed on Recycled Paper. © 1999-2003, Delphi. All rights reserved. Printed in U.S.A.
DP-03-E-004 Conv702/3W • 1002/6mGBS • 303/5mGBS
www.delphi.com/connect
Delphi Connection Systems reserves the right to improve, enhance and modify the design specifications and construction of Delphi products without prior notification. For additional product and engineering information, contact us at [1] 949.660.5701 or visit our website at www.delphi.com/connect.
Connection Systems
Automotive and Transportation Products
Mail Code 483.400.301 5725 Delphi Drive Troy, MI 48098-2815 U.S.A. Tel: [1] 248.813.2334 Fax: [1] 248.813.2333
Commercial and Military Products
17150 Von Karman Avenue Irvine, California 92614 U.S.A.
Tel: [1] 949.660.5701 Fax: [1] 949.660.5825
Commercial and Medical Products
19200 Asheville Highway P.O. Box 519 Landrum, SC 29356 U.S.A. Tel: [1] 864.457.3824 Fax: [1] 864.457.2535
Asia Pacific Regional Headquarters
514 Chai Chee Lane #02-05/06 Bedok Industrial Estate Singapore 469029 Tel: [65] 6243.5461 Fax: [65] 6243.5462
European Regional Headquarters
Reinshagenstrasse 1 42369 Wuppertal Germany
Tel: [49] 202.291.2000 Fax: [49] 202.291.2777
South American Regional Headquarters
Av. Goiás, 1860 São Caetano do Sul São Paulo 09550-050 Brazil
Tel: [55] 11.4234.9491 Fax: [55] 11.4234.9462
