A study on the fabrication of multi material 3D patterns using inkjet printing technology

(1)

(2)

PERPUSTAKAA~l UTHM

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A STUDY ON THE FABRICATION OF MULTI MATERIAL

3D PATTERNS USING INKJET PRINTING

TECHNOLOGY

by

MUSTAFFA BIN IBRAHIM

A thesis submitted in partial

fulfillment of the requirements

for the degree of

Doctor of Engineering

In the

GRADUATE SCHOOL OF COMPUTER SCIENCE AND

SYSTEM ENGINEERING

KYUSHU INSTITUTE OF TECHNOLOGY

JAPAN

(4)

KYUSHU INSTITUTE OF TECHNOLOGY

:\13STIv\CT

A Study On The Fabrication Of Multi Material 3d Patterns Using

Inkjet Printing Technology

By MUSTAFFA BIN IBRAHIM

I n addition to its application in media printing, inkiet printing IS becotning an increasingly attractive option for the distribution and patterning of materials for a wide variety of applications such as the fabrication of prototype for the manufacturing sectors. Recently' a rapid protol)'ping method for building parts layer-by-layer has led to interest in fabrication of protol)'pes with extra functionalil)' by inkjet printing. ;\ new system is expected which can produce assemblies composed of parts with more than one color or with more than one material. This study intends to utilize Java program to manipulate CAD design data and interface them \vith a modified commercial 357 -nozzle piezoelectric printer with experiments focusing on the drop positioning and arrangement required to fabricate a multi material 3D patterns. Functional fluid materials such as silver nanoparticle conducti\T ink was successfully printed using inkjet printing technology to directly write an electronic circuit. In order to study the parameters affecting drop formation of an inkjet printer, a single nozzle piezoelectric inkjet system was also dC\'eloped to study basic parameters such as \'oltage amplitude, firing frequency and fluid viscosity. The understanding of these parameters reactions gi\'es a broader \·iew on work in the fabrication of multi material 3D patters using inkjet printing technology.

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List of Figures

Number _Page

1.0

2.0

1.1 l'vIobile-Phone Evolution ... 1

1.2 Stereolithography Process ... 3

1.3 A I'vIoulded Interconnect Device (MID) ... 6

1.4 Research Placement ... 7

1.5 Structure 0 f The Thesis ... 10

2.1 2.2 2.3 2.4 ') " _.J 2.6 2.7 2.8 Pattern Depositions Using Hopper Nozzles ... 12

The rVIicro Stereolithography Process ... 12

Data Exchange Formats For Rapid Prototyping J\hchines ... 13

Continuous Inkjet Technology ... 15

Drop-on-Demand Printing Technology ... 16

Ink-Jet Technologies Map ... 17

3D Printer From Z Corp ... 18

ThetIDojet Printer From 3D Systems ... 18

2.9 Poly jet From Objet Geometries ... 19

2.10 The Inkjet Device ... 20

2.11 Droplet Generator Using Piezoelectric Disc ... 21

2.12 Single Nozzle Piezoelectric Inkjet Device Configuration ... 22

2.13 Pasteur Pipette Glass Body Drop Ejector ... 22

2.14 Ink-Jet Nozzle Ejecting 1\ Series Of Drops ... 23

2.15 Nozzle Geometry And A Typical Jet Configuration \'i/ith Symbolic Representation Of The Computational Grid ... 23

2.16 Piezoelectric Printhead By J\·Iicrofab Technologies Inc. ... 24

2.17 \'ilaveform For Piezoelectric Printhead By J\·Iicrofab Technologies Inc ... 24

2.18 Voltage Pattern For 1\ Single Pulse ... 25

2.19 Schematic Illustrations Of\"\1ave Propagation 1\nd Reflection Under A Single Voltage With tdwell X topt In An Open-Closed Squeeze Tube ... 26

2.20 The Comparison Of Simulated Ejection Sequences And Corresponding Experimental Observations ... 27

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3.0 4.0 5.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 3.16 3.17 3.18

The Inkjet Printing System ... 28

IVIanipulation Of CAD Data In Java Program ... 29

Epson Printer ... 30

Sigma Koki I"vIotorized Stages ... 31

Sigma Koki l'vIotorized Stage Controller ... 33

Object Solid Graphic ... 34

Object STL Graphic ... 34

Object Slicing ... 35

Jm"a Program Conversion Result... ... 35

Single Nozzle Piezoelectric Inkjet System ... 37

l'vIicrofab Piezoelectric Inkjet Dev1ce ... 38

Piezoelectric Disc \,(!ith Alligator Clip ... 39

A Simple And Low Cost Setup To Produce A Conical Closed End On Glass Pipette ... 40

The Use Of Tungsten \\fire In Fabricating Aperture Nozzle .. 40

The Use Of Printer Nozzle Plate In Fabricating Aperture Nozzle ... 41

The Kenwood AG-203A Oscillator ... 42

The l'vIanometer Tube Pressure Control.. ... 43

Phantom V5.0 High Speed Digital Camera ... 44

4.1 The Silver Conductive Ink ... 47

4.2 IvIechanism of Low Temperature Sintering ... 47

4.3 Printer Ink Cartridge Replacement ... 48

4.4 The Ink Cartridge Chip ... 48

4.5 Portable Viscometer ... 49

4.6 Surface Tensiometer ... 50

4.7 Principle Of .Adhesion Test ],vIethod ... 51

4.8 Surface Tension l\Ieasurement.. ... 53

4.9 Temperature Effect On Viscosity ... 53

4.10 Curing Temperature Effect On Adhesion ... 54

4.11 Temperature Effect On Volume Resistivity ... 55

4.12 Temperature Variation Effect On Silver Conductive Ink ... 55

4.13 Printed Silver Conductive Ink ... 56

4.14 Line Before Curing ... 57

4.15 Line After Curing ... 57

5.1 - ? J._ Piezoelectric Printhead Configuration ... 59

The Inkjet Printing System ... 60

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5.3 Complement Printing In-Between Nozzles ... 62

5.4 Integration Of JvIechanicalAnd Electrical Elements In A Part ... 63

5.5 Description of A Single Drop Coverage Area ... 63

5.6 The Overlaying of Drops In The X And Y Axis ... 63

5.7 Description of .'\ Rectangular Pattern ... 64

5.8 Description of 1"\ Pyramid Pattern ... 64

5.9 Drying Time ... 65

5.10 Ink Spreading ... 65

5.11 Ink Printed On Slide Glass ... 66

5.12 Ink Printed On Inkjet Film. ... 66

5.13 Complement Printing ... 66

5.14 Printing Resolution ... 67

5.15 Complements Printing ... 67

5.16 Complements Printing Surface Roughness ... 67

5.17 Layer Thickness ... 68

5.18 Layer Surface Roughness ... 68

5.19 Inkjet Printing Of Capacitor JvIodel.. ... 69

5.20 3d Profile Of Capacitor 1Iodel ... 69

5.21 Inkjet Printing Of Part \,\lith Capacitor Model ... 70

5.22 Surface Flatness On X Axis ... 70

5.23 Surface Flatness On Y 1"\xis ... 71

5.24 Surface Profile Of Rectangular Pattern ... 71

5.25 Surface Profile Of Pyramid Pattern ... 71

5.26 Countering The Ink Sinking Problems ... 72

5.27 Profiles On Countering The Ink Sinking Problems ... 72

5.28 Contact ,\ngle ... 73

5.29 Contact Angle Effect on Wetting ... 74

6.0 6.1 Piezoelectric Inkjet Device ... 76

6.2 Single Nozzle Piezoelectric Inkjet System ... 77

6.3 Internal,\ir Pressure ControL ... 77

6.4 Cavity Length ... 78

6.5 Dimension BST 768 (Breakaway Support Technology ... 79

6.6 Ca\1.ty Length Effect For The 30 ]'vIicron Diameter Nozzle ... 80

6.7 Ca\1.t)' Length Effect For The 100 1Iicron Diameter Nozzle. 81 6.8 Pulse Width Applied For Ca\-ity Length 60mm ... 82

6.9 Frequency Effect On Drop Velocity ... 83

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6.11 Variable Viscosity Disposition For 30 I'vIicron Diameter

Nozzle ... 84

6.12 Variable Viscosity Disposition For 100 ]'vIicron Diameter Nozzle ... 85

6.13 Electrical Resistance of Silver Ink ... 86

6.14 Surface Of .ABS Part That \'/as Built Flat ... 86

6.15 Surface Of ABS Part That \'hs Built Standing ... 87

6.16 Silver Ink on ABS Part That \'/as Built Standing ... 87

6.17 Silver I nk on Polished l\BS Part ... 88

6.18 r-Iydrophilic Design ... 88

6.19 Silver Ink on I-I ydrophilic Design ... 88

6.20 Two Sample of Conductive Tracks on ABS Part ... 89

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List of Tables

Number Page

1.0

2.0 3.0

4.0

5.0

6.0

1.1 Step By Step Demonstration Of Rapid Prototyping

l'vlanufacture Process ... 4

3.1 Specification Of The Printer ... 31

3.2 Specification for motorized stages SGSP 26-50 ... 32

3.3 Specification For l'vlotorized Stages SGSP 20-85 ... 32

3.4 Specification For Stage Controller ... 33

4.1 SilYer Conductive Ink Specification ... 46

4.2 SLA Resin Specification ... 56

5.1

-

') J._ Experimental conditions ... 61

Overlaying distance ... 64

6.1 Frequency effect on drop yelocity ... 82

6.2 Fluid l\Iaterial Properties ... 84

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Acknowledgments

I would like to thank my advisor, Dr. Hiroyuki Narahara for the continuous challenges and dynamic work environment he provided during my pursuit of this work. He fostered a creative freedom in the pursuit of this investigation, but also provided insight when necessary. Iv1y sincere appreciation also goes to Dr. Hiroshi Suzuki for his advices and financial support throughout my study. I would also like to show my appreciation of Dr. Hiroshi Koresawa for his professional support of my work.

This work would not have been possible without the assistance of other students in our research group; Suzuki Narahara Research Laboratory. rv10st importandy, I would like to offer my deep appreciation to Iv1r. Takayuki Otsubo for his contribution in the programming work for the printer and CAD data manipulation and I also appreciate the conversations and companionship of l',lr. Kojima lvIichio who is always there by my side throughout my study.

Finally, I would like to thanked my wife \'I/ahida for her unwavering support and constant encouragement all along my PhD journey. The prayers of my mother have also contributed to the success of my work. And of course to my sons ...

Fauzul Azim, Faruq Hanif and Fakhrull"\Iuaz ...

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CHAPT

E

R 1

1.0 INTROD

U

CTION

Th

market

i

changing

rapidly

.

The

"VUl!ler

ill

today's

competitive

mark tplac

ar

thos

comparu

that

can

bring innovative high

valu

product and ervice to the custom

r before their

competitor

do

s. L

t u

recall what a mobil

-

phone look d like twenty

year

ago? 5 y

ar ago? La

t 6

months

?

Yesterday?

ot to mention its shape, weight and

functionality

a

hown in igure 1

.1.

ow and in th

future

it

will

be even smaller, lighter and

can do much mor than a

pri

r m

bil

-

phone uch

a

the incorporation

of

camera audio video play r,

internet

acc s ,

location pin

-

p inters,

cheduler

and ev n a a ca h cr

dit

device

that

yo

u

can

pay

whatever you

bu

in a

convenient

sto

re

just

b

canning

yo

ur mobile

-

phone

which

is

kn

wn a

electronic-wall

ts.

DynaT~-\ ceU phone, 1983

• lotorola, Inc.)

-

'

-l ell _ .

~

Sony Eocsson V800 3 phone, 2005

(A.rnazon.com)

Figur

1.1 :

M

bil

-

Phone

volution

Rapid advancements in computer technology

hav

given

life

to

th

udden

increa e

f

computer

-

aided design

(C

AD

)

related technologie

, which

b

y

their

speed

and aut mati

0,

ar used to manufactur prototyp

s quickl

and at low

(16)

-cost. The advancement of manufacturing technologies is being driven by the need for automation, miniaturization, cost reduction and environmentally friendly manufacturing. In recent years, the competition to send manufactured products to the market has been the prime concern for manufacturers. They cannot afford to make mistakes and once the product is released, the incorporated technology and design must work. The route of the development project must be fast, efficient and one important criteria is that all possible errors in the project are revealed as early as possible such as in the design and testing stage. It is common sense that the sooner an error is revealed the cheaper it is to correct because the further we are in the project the more costs have already been paid - such as costs if the design must be changed.

l\Ianufacturing organizations use Rapid Prototyping which refers to the physical modeling of a design using a special class of machine technology to produce models and prototypes of injection-molded parts and metal castings products. Rapid prototyping acts as a lubricant that helps to smooth and streamline the product development process mostly to help improve time to market and as a visualization tool [1]. The Rapid prototyping industry has achieved much since its first commercial process which was presented at the A UTOFACT show in Detroit in November 1987, by a company called 3D Systems, Inc. During that time, the process was not very accurate and there are not many choices in terms of materials. Therefore, the parts obtained were considered prototypes; which is sometlling to look at and serves as a basis for discussion. Nowadays, there are more than 30 processes some of wllich are already commercialized willie others are scill under development in research laboratories. The accuracy of the parts produced has improved significantly, and the choice of materials is relatively large whereby users can choose suitable macllines and materials which suite their purposes or applications. The tenn "prototyping" is rather misleading since the parts or models being produced nowadays more frequently being used for functional testing or to derive tools for pre-production testing.

Yet, there are scill room for growth and need for further advancement. The next task is to study tllis technology and make it more efficient, develop a methodology to design and optimize components made of multiple materials to enhance their functionality by using an inkjet printing technology which is one of the Rapid Prototyping technologies used to fabricate 3D objects. Multi-material rapid prototyping refers to a process of fabricating a part consisting of more than one component material from Crill models layer by layer. The benefit is to develop lighter, stronger, smarter structural components using multi-material optimization.

(17)

2-1.1 Overview on Fabrication of

3D

object

using Rapid

Prototyping Technology

Rapid

proto typing i a

proc

that i

s

capable of converting a 3D C

D

d

igo into a physical object

b

m

an

f la

ye

r

-

b

y-

la

ye

r powder,

so

lid

or

liquid-ba ed manufacturing m th

d

[2].

he

technologie

have

also

be n called

"la

yered

manufacturing"

r" lid

freeform

fabrication"

.

In

mechanical and manufacturing

ngineering

,

rapid pro to

typing

is th pr ce

f building prototyp

obj

cts to evaluate whether a

prop

ed

d

ign

i

me ting the requirem nt in aspects

uch

as

hape

s, sizes,

fit and

form

functionality

and other

r

qOO

m nt

.

They enhance the ability of

d

e

igoer

and

ngine

r

t

tudy the

£;

a ibility of a

product

and

locat manufacturing

probl m

early

in th d ign pha

.

Thi

g

r

atly reduce costs and the

tim

-to-mark

t f th pr

duct. urrent

rapid

proto

typing

y

tem

are

heavil

y

u

d

by manag r ,

engineer s

ur

g

ons, archit ct arti

t

and

individual

s

from

many

di ciplin

.

The nam

of

p

ecific

proce

e

them elve

ar

al

often

u d

a yn

nym for th

ntire field

of

rapid proto

typing. Among

the

e ar

tere

lithography

(

LA

for t

r

o

lith

graphy apparatu) as

s

hown

in

Figur

1.

2 el cti

e

la

e

r

int ring

(

L

)

,

fu

e

d depo ition modeling

D

1)

lamin

at

d bj

ct

manufacturing

,

three

dim

n ional printing

(

3DP

)

and

many

th rs

.

Each of

the

techn

logi

a

nd the man

y

other

rapid

pro

to

typing process

s

ha it

ow

n

s

tr ngth

and weakn

e

but th ba ic

fabrication c

nc pt ar almost

th

e same

as

h

wn

in

Table

1.1 He dLa er

~O

weep r

~

Blade

I

,

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1-

ZAxi

r

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r;

e

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P

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--u-

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ator

orm

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l

Fortn

d

Object

Figure

1 .

2:

t

r

O

litl1

graphy

Pr c

-

3

(18)

Tabl

1.1 :

t p

B,

rep Demontranon

f

RapId Prororyping \lanufactur

'

Pr ce

tage

1 Detail

D

19n 1

created u mg a 3

modelin

sofp-var

uch a

'

lid

_\\_'

_{rk , Pr}

-<

ngm r,

rugrapruc, adceus and tc

..

Th

3D m dell pre

-

proc

d and

converted lUto tandard triangulational

languag

(

11..

-

11..

fil

c nn ct the

2 urface of th model in an arra, f

triangl

and c nit of the

:x,

Y

and

Z

rdinar

of th

thre v rtic

f

each

urface triangle

)

Th RP pr c

build the part up In

layer of mat nal from th bottOm. Each

layer

i

automaucally b nd d t

th

larer

b low and th pr ce

i

r p ated until

the part

1

built. Thi pr ce

of b ndlng

3 i

und rtaken

10

diff, r nt way [, r th

Yari

u mar

rial

that are being u ed but

4 include the

u

f

U

ltra\'1ol

t

(

C

~

la r, arb n DlOxid

(

02 )

la er , heat

en itive glue and m lung the matenal

it

If

.

Th part are r m \

'

ed from the macrun

and po t proc

ing operati n take

plac ,

dl

.

may b

to add extra trength

to th part

by

filling proc

"Old, firu h

dl

curing

f

a part r t hand fini

-

h th

part

to [he d 'tr

d 1

,

"

e1

(19)

-1.2 Problem Statement

In August 3,J 2006, a \'\1all Street Journal article, "3D Printers Reshape World of Copying," is acknowledging the business value on the innovation of the rapid prototyping technology which can fabricate models quickly [3]. Terry \,\iohlers, president of \,\iohlers .Associates, a market research firm (www.wohlersassociates.com). says that among dle fastest-growing segment of the rapid-prototyping industry which had revenues of S809 million in 2005, up from an estimated S705 million in 2004 is the 3D printing technology which create physical models from computer-aided design (Ci\D) data by using an inkjet printing technology.

E,-cn though inkjet printing technology has been used to fabricate 3D strucrures or models, parts produced by the commercially available rapid proto typing systems are made of a single material. The multi-color 3D printer from Z Corporation only prints colors on surfaces - the material beneath is still the same as dle modeling material. In other rapid prototyping systems, nrious parts are built independendy using different colors and then assembled at a later stage. A new system is expected which can produce assemblies composed of parts with more than one color or widl more than one material. With this capability, some post-processing of rapid prototyping such as assembly, bonding, welding and painting can be eliminated. Figure 1.3 shows a component that was made using 3-D moulded interconnect devices (3-D l\IIDs). A moulded interconnect Device (MID) is defined simply as:

" ... all il!/edioll 1lI0llided plaJ/ic .wuJ/rate JI,hich illcorporales a cOlldllelil'e (i,.mil pallem, alld ilitegrateJ boll; mechallical alld electrical/lllldioIlJ."

Source: l\IIDIA (Molded Interconnection Device International Association)

3D l\IIDs are plastic mouldings that incorporate, or have on their surface, an integrated conductive pattern. As such they represent the fusion of mechanical and electrical functionally into one integrated component. MIDs often utilise three-dimensional circuitry; a circuit pattern widl several planes allows better circuitry spacing, as well as the potential for integrated switches, connectors and buttons. MIDs can also reduce the number of components and cost by embedding fearures such as connectors, wire harnesses or lamp-holders within a single device. In addition they can be designed to be self-supporting thus eliminating any requirement for mechanical parts needed to support the circuit boards. Through reducing part numbers, MIDs save space and shorten assembly time

(20)

-Wire

haroe

e

_harnesse

o WlIe

_s

and no

as embl

required

[image:20.558.1.548.31.809.2]

( http://www.primetechnologywatch.org.uk )

Figure 1.3

:

Moulded Interconn ct Devic

n

D

)

Inkj

t

printing have b n po ition d

as on of

the rapid proto typing

y

t m

that can

produce model relatively quick

and

in

xpen

iv

.

Am

ng th

well

known rapid

prot

t

y

ping machine that u

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chnology

include

s

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orporation which

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and

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who

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1.3 Re

se

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Rec ntl

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a

rapid prot

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to inter t in fabrication of electrical circuit and

ptical device b

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.

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technology is

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lectively layer by lay

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1.4 .

(21)

-Rapid Prototyping Technology

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r to be u d

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(22)

-•

•

fabricate 3D patterns, what kind of infonnation or data is needed to be sent to the printer command language that operate the printer? The manipulation from CAD design data fonnat to a fonnat that

the inkjet printer can understand and function to fabricate multi-material 3D patterns layer by layer.

Study the inkjet printer fluid drops arrangement resolution needed to realize the fabrication of multi-material 3D patterns. The inkjet printer was design to print text or image of 3D patterns on surfaces such as paper or other media but is the resolution enough for the fabrication of 3D patterns? Can the inkjet printer drops arrangement be manipulate so that a required pattern such as flatness and denseness of drops be controlled?

Study the capabilities of drop on demand inkjet to deposit variable material by using a single nozzle drop generator. In order to deposits fluids with various characteristics, the parameters which are affecting the drop generation must be understand. \,\'ith the utilization of a single nozzle piezoelectric inkjet device which function similar to the principal of the inkjet printer, the capabilities of a drop on demand inkjet printer to deposits variable fluid materials can be achieved.

1.5 Structure of This Thesis

This thesis has been organized in 7 chapters whose content are outlined as follows:

Chapter 1 which is this chapter defines the overview of fabricating 3D objects using the Rapid Prototyping Technology, statement of the problem and objecti\Ts of the research to be undertaken.

Chapter 2 provides the literature review and composed of four major sections. Multi material rapid proto typing technology overview, Rapid prototyping CAD data interface, Inkjet printing technology overview and Single nozzle piezoelectric inkjet system. IvIulti material rapid prototyping technology overview details ,vork perfonned to date in the fabrication of multi material structures using the rapid prototyping concept. The Rapid proto typing Ci\D data interface presents some of the work done on manipulation of CAD data fonnat in order to fabricate multi material 3D objects. The Inkjet printing technology overview defines the concept of the inkjet printing systems emphasizing on the drop on demand printing technology and fabricating 3D

(23)

8-objects using the inkjet printing technology. Lasdy a section on generating droplets using a single nozzle piezoelectric systems is included. This section offers an independent study on fluid materials and printing parameters for the piezoelectric inkjet device.

Chapter 3 presents the methodology used in the study which start firsdy with the inkjet printing system developed to print 3D patterns. This section explains the modification of a commercially available desktop inkjet printer, the motorized stages used for the X, Y and the Z axis and the motorized stages controller utilized in the inkjet printing system. The manipulation of CAD data using Java program was included and work on the integration of the inkjet printer and Java Program was also described in the later section.

Chapter 4 shows the experimental work done on the inkjet printing of conductive silver nanoparticle ink. This sections explains the experiments done on measurement of the viscosity, surface tension, adhesion and also the electrical conductivity. The experiment on inkjet printing of the ink on SL\ parts was also explain in this chapter.

Chapter 5 explains the experiment done to study the inkjet printer resolution. This involves the experiment on complement printing in-between the print-head nozzles which is 144 micron apart and also experiment on single drop deposition. This sections also shows the results on the work on the printing of 3D patterns using the inkjet printer.

Chapter 6 describes the experimental work on the fabrication of a single nozzle piezoelectric inkjet system developed to study the piezoelectric inkjet parameters affecting the drop generation of fluid. Some critical parameters such as fluid cavity length, amplitude voltage and fluid material with variable viscositT and surface tensions value were experimented so that the capability of inkjet printer to deposits functional fluid material can be understood. This chapter also explains a case study done on fabricating conductive tracks on ABS parts that was built by a FD1'vI Rapid Prototyping machine using the single nozzle inkjet system by controlling the motorized stages.

The final chapter presents a review of the research goals and provides a summary of the results obtained from the investigation. This chapter also provides recommendations and suggestions for future research to continue this area of research. Figure 1.4 shows the structure of this thesis.

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-TITLE

A STUDY ON THE FABRICATION OF MULTI MATERIAL 3D PATTERNS USING INKJET PRINTING TECHNOLOGY

Chapter 1: Introduction Chapter 2: Literature Review

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Figure 1.5 Structure of The Thesis.