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UC Davis

and

CDF Run 2b Upgrade

David E. Pellett Grad Student Seminar

January 15, 2003

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Outline

• Background: UC Davis and Run 2a upgrade

• Tevatron luminosity upgrade for Higgs (and other) searches: Run 2b – Tevatron is energy frontier

– Targeted detector upgrades imperative for high mass physics searches

• Run 2b silicon vertex detector (SVX) upgrade – General overview and schedule

– R&D work at UC Davis

– Major task: “burn-in” and debugging of all the SVX hybrids for Run 2b (over 1000) at UC Davis

– Description of UC Davis plans, activities, requirements and schedule

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Background: UC Davis and Run 2a Upgrade

• ISL and Layer 00 at Fermilab: hybrid burn-in, assembly

• ISL cable interconnect

electronic design

• Readout hybrid testing at LBL

• Studies at UC Davis cyclotron

– SVX3 SEU cross section

measurement – Radiation

damage of silicon strip, readout components

LAYER 00

Quadrant of CDF Run 2a tracker (Arrows point to silicon components)

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Vertex ‘99, 6/21-25/1999 p. 12

CDF

CDF Run II Silicon Alan Sill, Texas Tech University

SVX II: 3 Barrels, 5 Layers

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Vertex ‘99, 6/21-25/1999 p. 31

CDF

CDF Run II Silicon Alan Sill, Texas Tech University

Simulation: Run II CDF Si

Open Inventor based ROOT based

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Vertex ‘99, 6/21-25/1999 p. 17

CDF

CDF Run II Silicon Alan Sill, Texas Tech University

SVX II Ladders

SVX II half ladder, consisting of two silicon sensors wirebonded with the readout

electronics mounted on the first sensor.

Si Sensors

Electrical Component Hybrid

SVX3 Chips HDI cable

Rohacell/Carbon Support Wirebonds

Wirebonds Bridge

Connection

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Vertex ‘99, 6/21-25/1999 p. 8

CDF

CDF Run II Silicon Alan Sill, Texas Tech University

SVX3D R/O Chip

SVX3FE SVX3BE

and ramp ADC

To Silicon Detector

I/O

47 Storage cells / channel

Integrators (128 channels) To Readout System

Sparsification FIFO

ADC Comparators

Analog Section Digital Section

Counter Analog Pipeline

128 Channels Pipeline Control Logic

• Rad-hard 0.8 um Honeywell CMOS

• Tested to ~ 4 MRad

• Deadtimeless

• Dynamic pedestal subtraction

• Common to all Run II CDF

silicon projects

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Vertex ‘99, 6/21-25/1999 p. 9

CDF

CDF Run II Silicon Alan Sill, Texas Tech University

SVX3D R/O Chip

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Dave Pellett, UC Davis 2/20/02 1

CDF b UCD Students on Run IIA Silicon

o UCD students on Run IIA silicon (ISL and Layer 00):

– Sasha Barioant

– Paul Gomez (UG, post-graduate researcher)

– Chris Hill (graduated, now at UCSB, co-leader of CDF Silicon) –Tiffany Wilkes

Right:

Chris Hill at work

on his thesis

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25-Jan-01 D.Glenzinski, Collaboration Meeting 2

Last Collab Meeting…

• SVX looked like this:

2 barrels in spacetube

and

working to

finish

Barrel-3

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25-Jan-01 D.Glenzinski, Collaboration Meeting 3

Last Collab Meeting…

• ISL looked like this:

Lots of silicon missing…

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25-Jan-01 D.Glenzinski, Collaboration Meeting 4

Last Collab Meeting…

• Layer 00 was still a cartoon…

2.2 cm

Cooling

Channel

Beryllium Beam pipe

C Fiber supports SVXII

Screen

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25-Jan-01 D.Glenzinski, Collaboration Meeting 5

About 2 wks later…

• SVX looked like this:

3 barrels+portcards in spacetube

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25-Jan-01 D.Glenzinski, Collaboration Meeting 6

About 2 wks later…

• ISL looked like this:

1 meter

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25-Jan-01 D.Glenzinski, Collaboration Meeting 7

By November…

• L00 looked like this :

Carbon fiber support shell

hybrids

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25-Jan-01 D.Glenzinski, Collaboration Meeting 8

By end November…

• L00 installed inside SVX :

350 µm radial

clearance

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25-Jan-01 D.Glenzinski, Collaboration Meeting 9

By end December…

• SVX/L00 installed inside ISL :

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25-Jan-01 D.Glenzinski, Collaboration Meeting 10

16-January-01: The Move

everything went exactly

as planned -

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25-Jan-01 D.Glenzinski, Collaboration Meeting 11

16-January-01: The Installation

The CDF Run2 Silicon Detector

was installed inside the

COT at

around

2200 on

16-Jan-01

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Current CDF SVX and Run 2b

• CDF now collecting data in Run 2a

• More luminosity needed for high mass searches

• Upgrade accelerator and aim for

≥ 15 fb−1: Run 2B

• CDF modifications needed to handle rate and radiation damage

• UC Davis part of SVX upgrade group from inception

• Plan to install upgrades in 2005

CDF Run 2a SVX inside ISL (System designed for 2 f b−1)

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CDF Run 2b SVX Upgrade

• Inner SVX2 layers will begin to fail after 4 fb−1

– Replace sensors with HV single-sided strips

– New SVX4 readout chip in 0.25 µm technology

• Must replace SVX as a complete package

– Minimize accelerator down time

– Minimize risk of breakage

• Modular design with staves – Uniform staves simplify

construction

– Maximum use of space inside ISL

Proposed Run 2b SVX in ISL

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Stave Design

• Stave extends half the length of the barrel to central bulkhead

• All outer layers use this design (180 staves); inner layer on beam pipe

• UC Davis working with SVX4 readout chips and hybrids

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Outer Layer Hybrid

• Run2b SVX has 1080 4-chip hybrids like this one for outer layers

– Chips will be wire bonded to sensors along top edge – Hybrid will connect to bus

cable running underneath on stave

– Hybrid material is BeO with fine-pitch traces to interconnect components – Mounted in aluminum box

for testing and burn-in

• Inner layer (“layer 0”) has 72 similar 2-chip hybrids

4-Chip Hybrid in Test Module

(Green board is fanout for test connector)

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SVX Stave Construction Plan and Schedule

• R&D and prototyping are under way on rapid schedule

• Plan two stave prototype rounds, preproduction before final production

• Each round requires all stave components including hybrids

• UC Davis Task: Hybrids must be operated and monitored for ∼ 72 hours (“burn-in”) prior to use in stave assembly. Failing hybrids must be de- bugged. Need 40 hybrids/week during production.

Run 2b SVX Project Critical Path Summary

Task Name Duration Start Finish

Stave Prototype Round 1 126 days 7/15/02 1/21/03 Stave Prototype Round 2 120 days 1/22/03 7/10/03 Stave Preproduction Round 131 days 7/11/03 1/28/04 Stave Production 245 days 1/29/04 1/21/05

Installation 135 days 8/23/04 3/11/05

Final Assembly 50 days 3/14/05 5/20/05 Assumes Run 2a ends 1/1/05, CDF ready to install SVX 3/14/05

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SVX R&D at UC Davis

• Have set up Linux test stand for SVX4 chip and hybrid at UC Davis

– Designed buffer for Linux computer

– Wrote code for SEU and

60Co tests

• Measured SEU cross section at UC Davis cyclotron

(63 MeV protons) – Based on 4 SEU’s

observed,

σSEU = 6× 10−17 cm2 – Lower than for SVX3 in

same beam

– Conclude SEU-resistant chip design successful

Top: SVX4 chip in UC Davis cyclotron beam Bottom: Analog performance after 11.6 MRad

9

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SVX R&D at UC Davis II

• With LBL, tested SVX4 chips and hybrids with 60Co gammas, wrote code for analysis.

• Irradiated prototype sensors to 1.4 × 1014 n/cm2

(1 MeV-equiv.) at UC Davis MNRC reactor

• Expect to continue

irradiations of sensor samples for quality control during

prototype and production rounds

Sample holder for 1 MeV neutron irradiation

Peering down into MNRC reactor core

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UC Davis Major Task–Hybrid Burn-In: Logistics

• Hybrids fabricated and checked at LBL, sent to UC Davis for burn-in – UC Davis will burn in all hybrids required for the upgrade

∗ 1080 4-chip hybrids and 72 2-chip hybrids plus prototypes and spares

– Burn-in includes performance monitoring and record keeping – Monitor supply current, turn off modules which fail

– UC Davis will diagnose hybrids whch fail, return them to LBL for repair

∗ e.g., chip or other component replacement, wire bond repair,. . .

• Hybrids passing tests sent to Fermilab for module and stave assembly

11

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Burn-In Hardware Requirements

• For Run 2a, burn-in done at LBL

– 40-port burn-in stand connected to SGI computer by CAMAC interface

• Will build on this but need modifications and new hardware due to:

– 2.5 V power supply for SVX4 (instead of 5 V) – Connections are different for the SVX4 hybrids – Move to Linux/PCI rather than SGI/CAMAC

• Requires

– New buffer and interfaces to computer

– New multiplexed hybrid interconnection boards (“MPX scrambler”) – New power supply regulator/monitor boards

– Modified control program (!)

– Mechanical support and cooling (via fans)

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New Burn-In Stand Block Diagram

• Major components: computer, buffer, control and DAQ multiplexer, pattern generator boards, MPX scrambler boards, regulator cards (red means new)

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Current Tasks

• Design and lay out new burn-in stand

• Assemble prototype stand based on former LBL system

– Use as test bed for burn-in software conversion

• Modify hybrid testing

software for use with single test stand

• Fabricate burn-in stand

• Prepare to begin operations for preproduction rounds

Tiffany Wilkes and Wajohn Yao prepare to test control and DAQ MPX

14

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UC Davis Schedule and Milestones

• Milestones for burn-in stand

– January 2003 – Burn-in stand design complete – April 2003 – Burn-in stand complete

• Tasks in 2003

– Complete burn-in stand

– Includes software development – Pre-production practice

• Task in 2004: Production

–UC Davis making key contributions to CDF Run 2b upgrade

15

References

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