ANSYS HFSS 3D Layout 侯 明 刚

ANSYS HFSS 3D Layout

Two Design Interfaces

Both Require the Accuracy of 3D

and HFSS

Mechanical CAD (MCAD)

Electrical Layout (ECAD)

HFSS: 3D Parametric Design Entry (MCAD)

Geometry

Toolkits

Script Customization

3D Component Library

Design Flow Integration

Customization

3D Editor

Native

Arbitrary 3D

HFSS: Layout Parametric Design Entry (EDA)

Geometry

Toolkits Script Customization Scripted Footprints 3rd Party Layout Translation

‘3D’ Layout

HFSS v2014: Arbitrary 3D or 3D Layout

•

No change to 3D product,

l

icenses added to enable layout

–

ensemble_gui

–

nexxim_gui

•

Required Installs

–

HFSS v2014

–

Designer v2014

Arbitrary 3D

3D Layout

Additional Capability for HFSS v2014

1. HFSS with Layout Editor

(Included)

•

Automated Interface for Package, PCB, or IC passive design

•

Layout with Integrated 3D HFSS solve

»

DC Solver

»

Passive/Causal Frequency Sweeps

»

Embedded S-Parameters

»

Native HFSS solves from Cadence Allegro, APD, SiP, and

Virtuoso

•

Schematic Capture (Circuit Analysis enabled with optional license)

•

Full-wave SPICE circuit generation

2. PlanarEM

(2.5D Method of Moments, Included)

•

Enabled with the HFSS solve license

•

Features for HFSS from Layout

– Parametric Layout Editor

• Stackup – Etch Factor/Layer Offset • Padstacks • Trace parameters • HFSS Extents • Finite Dielectrics • Sub-region • Hierarchy – Solver • Integrated HFSS solver • DC Solver

• Embedded RLC and/or S-Parameters for HFSS

– Post-Processing

• Network Data Explorer

• Full-Wave SPICE/HSPICE broadband ROM export

– Integration with industry:

• Cadence, Zuken, Mentor and Altium

•

Now included

with HFSS

•

Fast solve

–

2D conductors

–

Infinite GND

–

Early in the

design process

•

Leverage HFSS

and 3D FEM with

adaptive

meshing in the

later stages

Ease of Use: Ports

1. Click on the “Select Elements” button

2. While pressing the Ctrl button, select both lumped ports 3. Right click on Excitations, then

Convert to Differential Waveport in One Click

Easily Size Waveport in a Few Clicks

Port with a Horizontal Extent Factor = 3

Port with a Horizontal Extent Factor = 5 If the newly generated coupled waveport can be

–

Create

and

Solve

HFSS models from

within

•

Allegro® Package Designer

•

Allegro® PCB Designer

•

SiP Digital Layout

•

Virtuoso® Analog Design

Environment

HFSS within Cadence

Set-up and solve HFSS

simulations without

leaving the Cadence

environment

HFSS Meshing Techniques

•

Classic

– Approach: Starts with a 3D surface triangular mesh on all objects and generate a 3D

volume mesh throughout simulation domain

– Availability: HFSS (traditional 3D interface) and HFSS 3D Layout – Pro: Works for any arbitrary 3D geometry

– Con: For complex, many layered geometries can require a long time to generate

•

Phi

– Approach: From a layout, generate layer by layer 2D triangular mesh. Sweep mesh in

stackup (+z) direction to generate tetrahedral mesh elements

– Advantage: Skips heavyweight ACIS and 3D surface mesh generation – Availability: HFSS 3D Layout only

– Pro: Extremely fast relative to classic 3D mesh approach

– Con: Only works for stack-up or ‘swept in Z’ geometries. IC components and packages,

Why Phi?

•

Phi vs Classic

–

Always wins initial mesh generation

•

Including Lambda + Port Adapt

•

Initial mesh size is comparable

–

Can mesh bigger designs

•

When combined with distributed memory solver and hardware can

solve very large and complex designs

Summary: Initial Mesh is orders of magnitudes faster,

Solver is the same

R14.5: 5hrs - Initial Mesh

•

Accurate Solution

– Industry leading meshing capacity

– Causal/Passive s-parameters

– True DC solution

– Embedded RLC or s-parameter components

•

Fast Simulations

– Reduces multi-day long simulations to a few hours or less

•

Ease of use – 3D Layout

– Easy translation, import and setup

– Maintains trace characteristics and nets from layout

– Hierarchical design – Chip/Package/Board

– Embedded dielectric layers

– Parameterized model for Design Optimization

• Trace width, layer thickness, via dimensions etc. • Manufacturing tolerances (etching factor) • Materials

HFSS 3D Classic – 5hrs 15min

HFSS 3D Layout w Classic v15 – 3hrs 41 min

•

HFSS 3D Layout meshing advantages

–

Mesh and solve non-manifold geometry

–

Mesh geometries with large aspect ratios

–

Layer-based geometry is easier to edit,

modify, clean up etc.

Enhanced Meshing in HFSS 3D Layout

¼ of multilayer flip-chip package

20 nets (40 ports)

Is there a difference between

HFSS 3D and HFSS 3D Layout ?

Solve a model in both HFSS 3D and HFSS 3D

Layout and compare

Note easy export from HFSS 3D layout to

HFSS 3D

Multilayer complex package layout

•

HFSS 3D compared to HFSS 3D Layout

HFSS 3D CAD

Initial Meshing Comparison

•

Extremely fast initial Phi meshing. Phi is

20X

faster!

•

4min vs. 1hr 20min

HFSS 3D - Classic

HFSS 3D – Run Time

•

Total: 6hrs 33min

•

Adaptive Part: 4hr 1min

HFSS 3D Layout – Run Time

•

Total: 3hrs 3min

•

Adaptive Part: 1hr 05min

HFSS 3D vs. HFSS 3D Layout

Solid HFSS 3D Dashed - - - HFSS 3D Layout

Virtually identical results

from adaptive meshing

Summary

HFSS 3D CAD HFSS 3D Layout

Initial Mesher Classic Phi

Initial Mesh Size (tets) 763, 953 712, 536

Initial Mesh Time 1hr 20min 4min

Number of Adaptive Passes 6 7

Number of Tets - Final 1, 617, 954 1, 620, 969 Adaptive Passes Run Time 4hrs 1min 1hr 5min (3.7X faster)

Is there a difference between

HFSS 3D and HFSS 3D Layout ?

Example #2: Multi-layer PCB with end to end

SMA connectors

3D components drawn as stacked up

geometry can be modeled in HFSS 3D

Layout

•

HFSS 3D Geometry

–

Include SMA connector body with stands (serve as ground pins)

–

Account for true 3D SMA transition to PCB

HFSS 3D Solid Model Design Creation

Lumped Port dimensions equal to connector pin dimensions

•

Added SMA body geometry to a layout stackup

•

Port properties created automatically

HFSS 3D Layout Design Creation

Layout View

EM Design 3D View Stackup Editor

Results Comparison

•

HFSS 3D compared to HFSS 3D Layout

Solid HFSS 3D

•

Phi meshing是突破性的有限元网格生成技术。

•

为IC、IC封装和PCB设计者提供了电路工程师熟悉的操作界面和快

速初始网格刨分和快速仿真技术。

•

结合ANSYS HPC技术增加求解规模的可扩展性，支持求解更大、

更复杂的层叠结构。

•

分布式直接矩阵求解器(Distributed direct matrix solver)使用多

机分布式内存方式求解及其消耗内存的超大型复杂设计。

•

频域分解算法(Spectral decomposition method) 进行多频点并

行求解，加快扫频速度。