Introduction to GR228X Test Systems

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Symbol on equipment signifies that the manual contains information to prevent injury or equipment damage. Refer to page vi and to other manuals in set.

IEC417 !

GR228X Test Systems

NT Version

Introduction to

9007-4008-03

Printed in U.S.A.

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CopyrightGenRad, Inc. 1999. All rights reserved under copyright laws of the United States and other countries. The technical data included herein, excluding computer software documentation, is subject to the LIMITED RIGHTS as set forth in FAR 52.227-15 (JUN 1987) and DFARS 252.227-7015 (JUN 1995). All technical data and computer software documentation contained herein is proprietary and confidential to GenRad, Inc. or its licensor. All computer software documentation contained herein is Commercial Computer Software Documentation, proprietary to GenRad, Inc. or its licensor and furnished under limited license only. For solicitations issued by the United States, its agencies or instrumentalities (the “Government”) on or after December 1, 1995 and the Department of Defense (“DoD”) on or after September 29, 1995, the only rights provided in the Commercial Computer Software Documentation shall be those specified in a license customarily provided to the public by GenRad, Inc. in accordance with FAR 12.212 (a) and (b) (OCT 1995) or DFARS 227.7202-3 (a) (JUN 1995). For solicitations issued before December 1, 1995 by the Government (other than DoD) use, duplication or disclosure of the documentation shall be subject to the RESTRICTED RIGHTS as set forth in subparagraph (c) (1) and (2) of the commercial computer software – restricted rights clause at FAR 52.227-19 (JUN 1987). For solicitations issued before September 29, 1995 by DoD: RESTRICTED RIGHTS LEGEND – The use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (c) (1) (ii) of the Rights in Technical Data and Computer Software clause at DFARS 252.227-7013 (OCT 1988).

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iii

GenRad

We at GenRad strive to achieve the highest possible customer satisfaction through innovative products and services, and continuous improvement of our product quality and support.

To help us achieve our goal, we ask that you:

z Please fill out and return the Reader Comments card, located at the back of this manual, if you have any suggestions for structure or content improvements.

z Please document any product problems or enhancement requests on the GenRad System Performance Report forms, supplied with the equipment documentation, and return them to the GenRad Customer Care Center (CCC). The contact addresses are in the Preface of this manual.

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December, 1999

Total number of pages in this publication is 114.

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vi

WARNINGS

z Do not remove covers. Potentially lethal voltages are present inside the system. Observe all WARNING markings on the equip-ment and WARNING notices in the manual. If servicing is necessary, it should be performed only by a qualified person familiar with the electrical shock hazards present inside the system.

z Grounding circuit continuity is vital for safe operation of the equipment. Never operate equipment with grounding conduc-tor disconnected.

z Safeguard your hands and fingers while handling any fixture or other accessory. Be sure it is securely supported if you reach under it. If it is heavy, you must have another person help to move it.

z The symbol ! IEC417 on equipment signifies that the manual contains information to prevent injury or equipment damage. Observe and heed all WARNING notices in the manuals and the equipment. WARNINGS call attention to personnel safe-ty information.

z Replace any fuse only with the same type and ratings as labeled on the equipment and/or listed in the manual. MISES EN GARDE

z Ne pas enlever les couvercles. Les niveaux de tension se trouvant dans le système sont extrêmement dangereux. Respectez toutes les consignes de sécurité figurant sur l’équipement et les MISES EN GARDE données dan ce manuel. Seule une personne qualifée, connaisant les risques de décharge électrique du système, est autorisée à effecteur les opérations de nettoyage ou de réparation du système.

z Le circuit doit être mis à la terre sans discontinuation pour garantir un fonctionnement sans danger de l’équipement. Ne jamais faire fonctionner l’équipement pendant que le raccord à la terre est déconnecté.

z Protégez–vous les mains et les doigts pendant le maniement de tout dispositif de serrage ou autre accessoire. Assurez–vous que ceux–ci soient bien solidement fixés en place, avant de vous pencher sous eux. Si l’accessoire en question est trop lourd, faites–vous aider pour le déplacer.

z Le symbole ! IEC417 figurant sur l’équipement signifie que le manuel contient des informations permettant d’empêcher les accidents ou l’endommagement de l’équipement. Respectez toutes les consignes de MISES EN GARDE données dans le manuel et figurant sur l’équipement. Les MISES EN GARDE attirent l’attention sur la nécessité de se protéger.

z Ne remplacez les fusibles qu’avec des fusibles du même type et de la même valuer que ceux mentionnés sur l’équipe-ment et figurant dans le manuel.

WARNHINWEISE

z Abdeckungen nicht entfernen. Potentiell lebensgefährliche Spannungsbedingungen innerhalb des Systems vorhanden. Alle auf der Einrichtung befindlichen WARNMARKIERUNGEN und im Handbuch enthaltenen WARNHINWEISE beachten. Wartungsarbeiten dem qualifizierten Personal überlassen, das mit den innerhalb des Systems vorhandenen Gefahren eines elektrischen Schlags vertraut ist.

z Die Erdung des Schaltungsdurchgangs ist eine Grundvoraussetzung für den sicheren Betrieb der Einrichtung. Einrichtung niemals ohne Erdleiter betreiben.

z Hände und Finger bei der Handhabung einer Spannvorrichtung oder eines anderen Zubehörteils schützen. Sich vor der Plazierung der Hände unterhalb der Einrichtung vergewissern, daß die Einrichtung über ausreichenden Halt verfügt. Falls die Einrichtung schwer ist, sich von einer anderen Person beim Tragen helfen lassen.

z Das auf der Einrichtung befindliche Symbol ! IEC417 bedeutet, daß das Handbuch Informationen zur Verhinderung von Körperverletzungen oder Sachschäden enthält. Alle in den Handbüchern enthaltenen und auf der Einrichtung befindlichen WARNHINWEISE beachten und befolgen. WARNHINWEISE sollen auf Informationen zur persönlichen Sicherheit aufmerksam machen.

z Sicherungen nur durch Sicherungen des gleichen Typs und der gleichen Nennleistung ersetzen. Auf der Einrichtung befindliche Etiketten und im Handbuch enthaltene Informationen zu Rate ziehen.

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AVISOS

z Não remova as tampas. Há voltagens potencialmente fatais presentes na parte interna do sistema. Observe todas as marcações de AVISOS no equipamento e discrições de AVISOS no manual. Se for necessário fazer manutenção, esta deve ser feita somente por uma pessoa qualificada familiarizada com os perigos de choques elétricos presentes na parte interna do sistema.

z A continuidade do circuito de aterramento é vital para a operação segura do equipamento. Nunca opere o equipamento com o cabo de aterramento desligado.

z Proteja as suas mãos e dedos ao operar qualquer dispositivo ou outro acessório. Certifique–se que ele esteja suportado com segurança se você tiver que alcançar algo debaixo dele. Se for pesado, você deve ter a ajuda de uma outra pessoa para movê–lo.

z O simbolo ! IEC417 no equipamento significa que o manual contém informações para prevenir ferimentos ou danos ao equipamento. Observe e preste atenção a todos os AVISOS nos manuais e no equipamento. Os AVISOS chamam a atenção a informações sobre a segurança pessoal.

z Substitua qualquer fusivel somente com um do mesmo tipo e da mesma capacidade nominal como marcado no equipamen-to e listado no manual.

ADVERTENCIAS

z No quitar las tapas. En el interno del sistema hay voltajes potencialmente mortales. Obsérvense todos los rótulos de ADVERTENCIA presentes en el equipo, así como la descripción de las notas de ADVERTENCIA presentadas en el man-ual. De ser necesario, el servicio de mantenimiento deberá ser efectuado únicamente por personal calificado que esté familiarizado con los peligros de choque eléctrico presentes en el sistema.

z La continuidad del circuito de puesta a tierra es de vital importancia para el functionamiento seguro del equipo. Nunca se debe usar el equipo con el conductor de puesta a tierra desconectado.

z Protéjanse las manos y los dedos toda vez que sea necesario manipular un dispositivo u accesorio. Cerciorarse de que el mismo esté firmemente sujetado antes de proceder a trabajar debajo de él. Si el aparato u accesorio fuera pesado, pedir la ayuda de otra persona para moverlo.

z El simbolo ! IEC417 que aparece en el equipo significa que el manual contiene informaciones para evitar lesiones per-sonales o daños al equipo. Obsérvense y préstese atención a toda las notas de ADVERTENCIA presentes en los manu-ales y en el equipo. Las ADVERTENCIAS sirven para llamar la atención sobre informaciones de seguridad para el per-sonal.

z Reemplazar los fusibles únicamente con otros del mismo tipo y capacidad, según lo indique el rótulo en el equipo y la descripción en el manual.

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viii

CAUTIONS

z Observe and heed all CAUTION notices in the manuals and on the equipment. CAUTIONS call attention to information about safeguarding equipment from damage.

HANDLING PRECAUTIONS FOR ELECTRONIC DEVICES SUBJECT TO DAMAGE BY STATIC ELECTRICITY Place instrument or module to be serviced, spare parts in

conductive (anti–static) envelopes or carriers, hand tools etc. on a work surface defined as follows. The work surface must be conductive and reliably connected to earth ground through a safety resistance of approximately 250 kilohms. The surface must NOT be metal. (A resistivity of 30 to 300 kilohms per square is suggested.) Avoid placing tools or electrical parts on insulators.

Ground the frame of any line–powered equipment, test in-struments, lamps, soldering irons, etc., directly to earth ground. To avoid shorting out the safety resistance, be sure that grounded equipment has rubber feet or other means of insulation from the work surface. The module being serv-iced should be insulated while grounded through the pow-er–cord ground wire, but must be connected to the work surface before, during and after any disassembly or other procedure in which the line cord is disconnected. Exclude any hand tools (such as non–conductive plunger– type solder suckers) that can generate a static charge.

Ground yourself reliably, through a resistance, to the work surface; use, for example, a conductive strap or cable with a wrist cuff. The cuff must make electrical contact directly with your skin; do NOT wear it over clothing. (Resistance between skin contact and work surface through a commer-cially available personnel grounding device is typically 250 kilohms to 1 megohm.)

If any circuit or IC packages are to be stored or transported, enclose them in conductive envelopes or carriers. Remove them only with the above precautions; handle IC packages without touching the contact pins.

Avoid circumstances that are likely to produce static charges, such as wearing clothes of synthetic material, sitting on a plastic–covered stool (particularly while wearing wool), comb-ing your hair, or makcomb-ing extensive erasures. These

circum-stances are most significant when the air is dry.

When testing static sensitive devices, be sure dc power is on before, during, and after application of test signals. Be sure all pertinent voltages have been switched off while boards or components are removed or inserted.

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Preface

Overview. . . xiii

Audience. . . xiii

About this Manual . . . xiv

Overview

GR228X System Architecture . . . 1-2 Basic System Components . . . 1-3 System Activities . . . 1-4 Testing Methods. . . 1-4 In-Circuit Testing . . . 1-6 Functional Testing . . . 1-7 System Test Devices. . . 1-8 Testing Board Continuity. . . 1-11 Testing Analog Components . . . 1-11 Testing Digital Components . . . 1-12 Testing Hybrid Components. . . 1-13 Testing Boundary Scan Components . . . 1-14 Test Fixtures. . . 1-15 In-Circuit Test Fixture . . . 1-15 Functional Test Fixture . . . 1-15

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x Contents

GR228X Test Systems

GR228X System Configurations . . . 2-1 GR2280 and GR2281 Production Test Systems . . . 2-3 Standard System Hardware. . . 2-4 Optional Hardware. . . 2-4 GR2281A and GR2287A Production Test Systems. . . 2-5 Standard System Hardware. . . 2-6 Optional Hardware. . . 2-6 GR228X i-Series Test Systems . . . 2-7 Standard Hardware . . . 2-8 Optional Hardware. . . 2-9 GR228X e-Series Test Systems . . . 2-10 Standard System Hardware. . . 2-11 Optional Hardware. . . 2-12 GR2283 and GR2284 Test Systems . . . 2-13 Standard System Hardware. . . 2-14 Optional Hardware. . . 2-14 GR228X Test Systems with Windows NT PC Retrofit . . . 2-15 Standard System Hardware. . . 2-16 Optional Hardware. . . 2-17 UUT Power Supplies. . . 2-18 Available UUT Power Supplies . . . 2-19 Optional Programmable Voltage UUT Power Supplies . . . 2-20 Optional Fixed Voltage Power Supplies . . . 2-20

GR228X Test Software

Test Development Process . . . 3-2 Test Preparation Tools . . . 3-3 CB/Test . . . 3-3 Circuit Description Generator . . . 3-4 System Device Libraries. . . 3-4 Model Generation . . . 3-9 Power Supply Editor . . . 3-15 Test Generation Tools . . . 3-16 Automatic Test Generator. . . 3-16 Preprocessor . . . 3-17 Scan Pathfinder . . . 3-17 Nail Assignment . . . 3-19 Translator . . . 3-19 Test Debug Tools . . . 3-20 Program Xplorer. . . 3-20 Autodebug . . . 3-21 Digital Waveform Display . . . 3-22 Measuring Fault Coverage (ALLFAULT) . . . 3-24 Floating Point Array Display. . . 3-25

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Generating a Plot. . . 3-27 Test Execution Tools . . . 3-27 Standard Test Software . . . 3-27 PinPoint Guided Probe . . . 3-29 TEST XPRESS . . . 3-29 Panel Test, Split Fixturing, and Serial Numbering . . . 3-31 Test Analysis Tools . . . 3-31 Real Time Data Collection . . . 3-31 Data Display. . . 3-34 Off-line Programming . . . 3-35 ATG Xpress . . . 3-35 TRACS III . . . 3-35 GRXpert . . . 3-35 Migrating from One Test System to Another . . . 3-36

Windows NT System Environment

Editors . . . 4-1 PFE Editor . . . 4-2 emacs . . . 4-3 vim . . . 4-3 Choosing a User Interface . . . 4-4 TestFlo Program Preparation Manager (PPM) . . . 4-4 GR228X Monitor . . . 4-5 Online Help. . . 4-6 Monitor Page Help. . . 4-6 Online Help Topics. . . 4-6 Online Manuals . . . 4-10

Documentation Quick Reference

Hardware Documentation. . . A-1 Software Documentation . . . A-2 Third Party Documentation . . . A-3

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xiii Introduction to GR228X Test Systems

Preface

Overview

This manual introduces you to the GR228X Test Systems by providing you with a brief description of the:

z GR228X Test System architecture.

z Standard and optional hardware available for each GR228X Test System.

z Software that is available to help you develop test programs, and which manual in the GR228X Documentation Set provides detailed information.

z Windows NT-based system environment.

Audience

This manual will benefit:

z Network Manager or Administrator

z System Manager or Administrator

z Test Engineer

z Field Service Personnel

z Site Manager

z Test Programmer

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About this Manual

This section identifies the knowledge or tasks described in the chapters or appendices of this manual.

For information about Read this Chapter or Appendix

The general GR228X System’s architecture, testing strategies, devices tested, and test fixtures

Overview

The standard and optional hardware that is available on your GR228X System and some basic information about power supplies

GR228X Test Systems

The test development process and the software tools available for the GR228X Systems

GR228X Test Software

The Windows NT system environment, test editors, user interfaces, and how to get help

Windows NT System Environment

Where to find information about a task in the documentation set; where to find 3rd Party (non–GenRad) documentation information

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xv Introduction to GR228X Test Systems

Document Conventions

The following document conventions are used throughout the documentation set.

Convention Indicates

Bold monospace

text command text that you enter

Bold text commands, keys, buttons, prompts, menu options, icons, and literals within text

Couriertext command, syntax, or error message

Italicmonospace

text replace the term with a valid entry

Italic text manual title, chapter title, or section title P/N or PN part number

[text, text] field within the brackets is optional

{text, text} select one or more choices within the braces

CAUTION potential harm to the system or equipment as a result of this

action

Example

End Example

the beginning of an example

the end of an example

NOTE specialized information that may benefit you

NEXT informational options that direct you to the next chapter or step

WARNING

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xvii Introduction to GR228X Test Systems

GenRad Customer Care Center

GenRad offers customer support through the GenRad Customer Care Center (CCC). You can contact the Customer Care Center for assistance at any time if you are unable to solve a problem through the use of on-line help or product documentation. If the Customer Care Center is closed when you call, you can leave a voice mail message by phone.

Before contacting the Customer Care Center, please have the following information available:

z Your site number

z Hardware system type

z System serial number

z Software version number

You can contact the Customer Care Center by:

Phone (978) 589-7000

USA only: 1–800–4–GENRAD (1-800-443-6723)

Select the number 1 to connect to the Customer Care Center.

Fax (978) 589-2080 (Customer Care Center) (978) 589-7007 (GenRad Main)

E–mail [email protected]

Mail GenRad, Inc.

7 Technology Park Drive, MS 6 Westford, MA 01886-0033

World Wide Web http://www.genrad.com

FTP ftp.genrad.com

login: anonymous

password: your e-mail address

cd pub/pub (public, for directory use ls) or

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Overview

The GR228X Test Systems, hereafter referred to as the GR228X systems, are a family of PC-controlled combinational test systems. The systems are designed to perform rapid electrical testing of printed circuit boards with high diagnostic accuracy. The GR228X systems run on a Windows NT-based software platform and are configurable to meet the hardware and software requirements of the target application.

Your GR228X system’s primary purpose is to execute in-circuit tests on electrically-isolated

components of a unit–under–test (UUT). Such components include analog IC, digital IC, hybrid IC, and memory components.

NOTE The GR2281A and GR2287A Test Systems do not have digital test vector capabilities, but can detect opens on digital components using the TEST XPRESS software.

A GR228X system is particularly effective at detecting manufacturing faults, such as:

z Shorts and opens within components or on board etches

z Missing, wrong, damaged, or improperly inserted components

z Out of tolerance and faulty components

z Incorrectly programmed components and faulty memory devices

z Functional faults on complete circuits

This chapter provides an introduction to all Windows NT-based GR228X Test Systems, which include any VMS-based GR228X Test Systems that have been retrofitted with a Windows NT-based PC.

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1-2 Overview

G

R228X System Architecture

All Windows NT-based GR228X systems are PC-controlled and have similar standard and optional hardware components. Table 1–1 describes each of the GR228X system’s major components that are shown in Figure 1–1.

KEYBOARD HARDWARE VIDEO DISPLAY PRINTER DISK DRIVE 1/4–INCH TAPE DRIVE REPAIR TICKET 42601.3 DISKETTE DRIVE KEYPAD (Optional) HARD MOUSE

PROCESSOR _INSTRUMENTSTEST

TEST FIXTURE RECEIVER

MODEM

CD–ROM DRIVE

PRINTER LINE

Figure 1–1 System Components

Table 1–1

GR228X System Components

Component Description

Mouse Used to select options and enter input.

Keyboard Used to enter commands to the PC or to respond to system prompts and test boards. Hardware Keypad This option enables you to test UUTs easily without constantly using the keyboard. Video Display Used during program preparation and during the testing sequence to display

measurements, waveforms, error messages, and other operator information. Repair Ticket

Printer

Prints diagnostic messages and results from the PC. Used by the test system to document test results and error messages, which can be attached to the failing boards.

Line Printer This option is available for hard-copy output of program listings and log listings. CD-ROM Used to load CD-ROM formatted software.

Hard Disk Drive Stores system software, test programs and data, and any other information that the PC needs to quickly access. Optional disk drives may be added to provide additional storage.

3.5-inch Diskette Drive

This 1.44 Mb diskette drive is used for system backup and data transfer.

1_/

4-inch Tape Drive This 525Mb tape drive is used for loading system software and for system

backup.

Modem An internal modem for remote accessing. Processor Executes the test programs.

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Component Description

Test Instruments The source and measure instruments perform a variety of device tests. For example, by forcing a known voltage from the dc source and measuring the current, the software computes the value of dc resistance under test using Ohm’s Law (R=E/I). Test Fixture

Receiver and Support Circuitry

Provides an interface between the test instruments and the variety of boards that undergo tests. Fixtures, which are uniquely fabricated for each board design to be tested, are mounted to the test system’s receiver. Through the fixture, the test system establishes electrical connections between the test instruments and individual components on the UUT.

Basic System Components

The GR228X systems include a variety of specially designed interconnected modules and components that provide easy access at the front for UUT testing and at the rear for equipment servicing. Internal ventilation is provided by positive pressure air circulation from air intakes on each cabinet. Figure 1–2 shows the system as a block diagram. The basic system contains a PC, analog and digital subsystems, a receiver, and UUT power supplies.

NOTE The GR2281A and GR2287A Test Systems do not contain a digital subsystem.

(MTG) INTERFACE PERSONAL STRIP MXI-TO-GENRAD ANALOG SUBSYSTEM DIGITAL SUBSYSTEM RECEIVER UUT POWER SUPPLIES UNIT UNDER TEST PRINTER 42541.1 COMPUTER GR228X Test System

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1-4 Overview

S

ystem Activities

Figure 1–3 identifies activities that are needed to use the system effectively. The activities are grouped under four major functions.

Remove and Replace

GR228X Test System

Set Up System Develop Test Programs Production Testing

-Prepare Site Install Hardware Load Software Create User Accounts SetĆup System

Use Window NT

Choose an Editor Identify Test Program Build, Test, and Debug

Debug Test Program

Perform UUT Testing Routine Maintenance

Perform Preventative Calibrate Instruments If Test System fails, Customize Environment

Development Process

Release Test Program

Maintenance

Run Diagnostic Defective System Parts

- _{Develop Test Program}

Test Fixture

and Service

- Collect and Analyze Test Data and Fixtures SelfĆTests System Management - _{SetĆup Network} - Run Verification Programs Maintenance

for Production Testing

31953.1

Operating System

Figure 1–3 GR228X Test System Activities

T

esting Methods

There are two testing methods available for the GR228X systems; in-circuit and functional. Both methods can produce tests that identify a high percentage of all possible defects. Depending on the assembly stage, either the in-circuit or the functional testing method is easier to implement and provides the most useful information.

In-circuit tests are usually performed at earlier and intermediate stages of assembly when it is most important to identify and correct component faults. While the in-circuit test does not provide direct information about how well a board functions, experience shows that most boards that pass an in-circuit test can also pass a thorough functional test. Therefore, even though the in-circuit test does not determine whether the whole board works correctly, it can indicate whether a board should continue through assembly or whether it has faults that need repair.

Once it is established that all components are correctly inserted and are operational, board–level functional tests or quality control tests can be useful for verifying a board’s overall performance. Functional tests are usually performed in the later stages of assembly when access is only available at the board edge.

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A dedicated functional test system is often used for functional testing. Alternatively, you can move many of the functional tests to the GR228X Test System which has many of the necessary hybrid test capabilities built-in. The ICA systems contain instruments for testing groups of analog

components, groups of ICs using the system’s parallel Driver/Sensors, and groups of hybrid

components using the AWG, DMM, and ACM in addition to the other instruments. Functional testing may require the addition of optional power supplies. The Hybrid Test Library (HTL) enables you to develop a library of functional tests that can be automatically generated. Functional testing enables you to collect additional test statistics using the system’s data logging feature.

In-circuit testing individually checks the performance of each component on the board with little or no operator probing. Occasionally a fault such as an open connection needs to be localized further. The GR228X systems offer a scratchprobing technique that can discriminate between a poor test probe contact, a bent IC pin that was not inserted correctly, or a broken track.

Performing a combination of in-circuit and functional tests provides the most thorough fault coverage. The GR228X software and hardware are optimized for in-circuit component testing, therefore, the test development process focuses on in-circuit testing. GR228X systems can also perform “clusters” of functional tests using the same test fixture. By grouping the UUT into functional clusters, you can simplify test development and improve the diagnostic accuracy of failing cluster tests.

Table 1–2 identifies and contrasts the major characteristics of functional and in-circuit testing.

Table 1–2

Functional and In-Circuit Test Characteristics Characteristic Functional (Board-Edge) Test In-Circuit Test

What is tested Component inputs and outputs. Component connections, values, and functions.

How is it tested Power is applied to the board. Component-by-component; power is applied to UUT for digital and hybrid tests.

Fixture requirements

Board edge connector that may accept many boards.

Bed-of-nails fixture for each board design.

Software requirements

Can use an optional circuit simulator as a diagnostic aid to predict outputs and fault coverage. Test development requires a simulator library, and a programmer to write part of the test. It requires a longer test development cycle.

Automatic Test Generator (ATG) writes the test using test libraries. The hybrid library can generate functional tests.

Component library

Must contain complete transfer function or truth table for each digital device.

Contains analog, digital, and hybrid model tests, written for a variety of circuit environments. Fault diagnosis Provided by guided operator probing; fault

identification depends on adequate simulation.

Probing is not required to obtain good fault identification.

Fault coverage Excellent fault coverage, although both the test development and debug time are lengthy. Also, manufacturing faults may not be detected.

Excellent fault coverage with fast test development and debug time.

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1-6 Overview

InĆCircuit Testing

In-circuit testing methods are used to check for manufacturing faults. Manufacturing faults are defects in individual components and inter-connections on the board. To test components individually, connections from the test system to all functioning component pins is required. This is accomplished using a test fixture that mates with each of the board’s circuit nodes and test methods that can effectively isolate a single component from the parts surrounding it. An in-circuit component test is often performed as the first or second test after a board has been assembled and soldered. It may be preceded by a separate bare board test to check for opens and shorts in the conductive tracks before parts are inserted.

In-circuit tests generally fall into four test categories:

z Connectivity tests that check for shorts and open connections on the board.

z Analog tests that measure component values.

z Digital tests that check the operation of digital integrated circuits.

z Hybrid tests that check components that are a combination of analog and digital components. The System contains test hardware appropriate for each kind of test, but it must be connected to each part on the board individually before you can perform a test. Since components are tested individually, the system can usually localize a fault immediately and issue a report telling the operator or technician which part needs repair. Interactive faults that can cause the board to malfunction are generally overlooked, but such faults are rare on a well–designed board.

The in-circuit tests are generated by the Automatic Test Generation (ATG) software. Programmers who need to modify tests created by ATG or who need to write tests of their own should thoroughly understand these techniques and the criteria ATG uses in selecting various test methods.

The most troublesome aspect of the in-circuit test is the assumption that you can test each

component as if it were the only part on the board. Fairly complex test strategies are often required to analyze the component’s circuit environment and to isolate the component from the surrounding circuits. Since these test strategies involve only individual components and their immediate circuit connections, you can assemble libraries of standard test procedures and adapt them to the limited range of environments in which the components are found. Given an appropriately coded

description of the circuit, the system software can write the entire board test by drawing tests for individual components from test libraries. VLSI devices are tested in a way that is, in principle, no more complex than the method used for simple components.

The system does not need to know the entire truth table or transfer function of a digital device, since it does not analyze how signals move through the circuit. Instead, it only requires that the library contain a set of typical input and output patterns for each device that is used to test the device. For a simpler digital IC, these patterns are usually based on the device’s truth tables, but for a larger device, they may consist of no more than a carefully chosen sample of the possible inputs and outputs.

Bused ICs present a special class of challenges. Before full tests are performed on bused devices, all the devices on the bus are tri–stated, that is, put in a low current state to verify that the bus is free. If the bus test fails, the BUSBUST diagnostic technique can automatically identify the IC(s) causing the bus failure. Once the bus test passes, you can individually test the performance of each IC on the bus. All other devices on the bus are disabled or disconnected from the bus and the IC is tested as if it were the only device on the board.

For an in-depth explanation of in-circuit testing strategies, refer to the GR228X Test Program

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Functional Testing

Functional circuit testing is often used to identify any faults that went undetected by in-circuit testing. A functional test is most important to the end user of a circuit board because it certifies that the board meets its performance specifications.

To connect the unit–under–test (UUT) to the test instruments, you must construct a fixture that mates easily with the board and provides reliable electrical connections. Usually, you only need to test the board’s inputs and outputs, and the fixture needs to provide little more than the board’s normal interface connectors. Therefore, the test fixture can be relatively simple and inexpensive to construct, which is especially attractive for low–volume testing. Using a functional tester, it is often possible to test a variety of bus–oriented boards from an edge connector in a single fixture.

With power applied to the board, a functional test checks that the board, or chosen sections of the board, produces the desired output response when various input stimuli are applied. Functional testing can also check that further stages of assembly have not damaged the board.

When a board fails a functional test, the test cannot always identify the cause of the fault immediately since there can be any number of paths from the inputs to the outputs along which the fault might lie. As boards become more complex, the possible signal paths become much longer, and the simple information that a particular board output has failed becomes less useful in identifying the cause of the failure. After a board fails a functional test, a technician usually has to trace the fault from the output back to its origin.

Since ATG does not generate functional test programs, you must write a test in the system’s test language. The test you develop needs to apply an appropriate stimulus, a waveform or a bit pattern, at the board’s inputs and measure the outputs to determine if the board or a group of components, such as a filter section, are functioning properly.

When a sophisticated functional test is required, or if diagnostic information can be gained from the functional test, some proficiency in manual programming in the test language may be required. For functional testing, you can use software to adapt the output of simulator models to the GR228X test language to form digital models of function units. You can then use the PinPoint Guided Probe for testing a function unit. The guided probe provides an important capability for diagnosing functional faults. Refer to the PinPoint Guided Probe User’s Guide for more information.

The PinPoint Guided Probe is ideally suited for tracking digital functions. Using a probe connected to a signal tracer or logic analyzer, is not as efficient as using PinPoint Guided Probe. If the

PinPoint Guided Probe capability is to aid in locating the fault, it must have a software model of the board’s circuits available so that it can compute the possible signal paths and guide the operator to probable sources of the error. However, when you perform a functional test in conjunction with an in-circuit test, the in-circuit test is often sufficient to identify component faults that cause functional failures.

To model a circuit, the simulator must be able to predict the state of each pin as a signal propagates from the inputs to the outputs. A complete truth table for each digital device on the board must be available so that for each input pattern that appears at an IC’s inputs, it can find the resulting outputs and advance to the next devices. This has important consequences for functional testing of boards containing VLSI devices. For SSI and most MSI devices you can record the truth tables without difficulty; however, for some VLSI devices such as microprocessors, the truth tables comprise from 10,000 to several million test vectors. For these devices you must find other less thorough methods for simulation. In general, adequate software modeling of boards containing VLSI devices is a formidable and expensive task.

For an explanation of functional testing strategies, refer to the GR228X Test Program Generation

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1-8 Overview

S

ystem Test Devices

The GR228X test language controls the system test hardware and software devices,which enable you to test and measure the components on the UUT. Figure 1–4 provides a global view of the system test devices. Table 1–3 describes the function of the hardware and software devices.

SVS UPS PVS/HCS PS [3] [3] [3] ACZ DCS DCM RM SHORTS, LGC [2] I488 (BUS OPT) ARITH [1] PIO STM MUX SCAN UUT NOTE: PEX OPENS, AND CONTACT

LGC may include standard digital test nails and/or special nails [2]

AFTM

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[1]

[1] Not actual instruments, they are software drivers Power supplies for UNIX PC Retrofitted Systems [3] ICA ACM DMM AWG DSM TEST PINOPENS [1]

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Table 1–3

System Test Device Functions

Acronym Device Name Function

ACM Digital AC

Voltmeter/Ammeter

Measures a signal’s positive peak, negative peak, RMS, or dc offset (Voltages up to 200 V and currents up to 160 mA for signals between 1 Hz and 40 kHz.).

ACZ AC Impedance Measure Measures impedance or admittance by applying the ac source voltage and measuring the result. AFTM Analog Functional Test

Module

The AFTM option contains these analog instruments:

DC Voltmeter, AC Voltmeter, AC Source, TTL Sync Signal Output, Frequency/Time-Interval Meter.

ARITH Arithmetic Test Module Tests arithmetic quantities not directly measured by an instrument, such as the gain of a

transistor. This utility device is considered a system device because the action required when it fails is the same as other instrument statements.

AWG Arbitrary Waveform Generator

Sources voltage or current waveforms. Programmed waveforms can be sine, square, and triangle. You can also define arbitrary waveforms.

DCM DC Measure Uses a differential voltmeter and an ammeter to measure dc voltage. The DCM module on an ICA-configured system has a wider range than on a non-ICA configured system.

DCS DC Source Serves as voltage source (DCV) or current source (DCI). The DCS module on an

ICA-configured system has a wider range than on a non-ICA configured system. Trigger command available for ICA systems only. DMM Digital Multimeter Measures voltage and current. Permits

immediate or triggered voltage and current sequence measurements which are then stored in the DMM’s memory.

DSM Deep Serial Memory Extends test system memory by supplying state data to the Driver/Sensors through the digital instrument bus.

I488 (BUS OPT)

IEEE Standard 488–1978 Permits up to nine external devices that conform to IEEE Standard 488–1978. These external devices can be attached to the system, then operated remotely by test language statements. LGC Logic Driver/Sensors Digitally controls the D/S subsystem for standard

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1-10 Overview Table 1–3

System Test Device Functions

Acronym Device Name Function

MUX Instrument Multiplexer Relay matrices used to connect selected instruments to any of four (A, B, C, D) or eight (A, B, C, D, E, F, G, H) output channels. PEX Pin Expander Connects Driver/Sensor or analog BUS lines to

a larger number of pins.

PINOPEN Open Pins This software driver tests for open pins on selected components and connectors. It uses various tester instruments depending on your tester configuration and selected PINOPEN options.

PIO Parallel I/O Reads driver outputs and monitors TTL inputs. This utility device consists of program controlled driver circuits that activate relays, TTL circuits, LED indicators, and sensor circuits.

PS Programmable Supply Power supply option used on the

Windows NT-based GR228X Systems to power the UUT.

RM Resistance Measure Uses an ohmmeter to measure resistance. SCAN Analog Pin Scanner Uses relay matrices to connect the MUX

channels to designated UUT nails. SHORTS OPENS CONTACT Shorts Opens Continuity

Connects the DCS and DCM to perform analog continuity tests. The DCS and DCM go through the MUX and SCAN, to connect source and measure units to the UUT.

STM Self–Test Module This utility device contains circuits and

components of known values that check how the various system test devices operate.

SVS UPS PVS/HCS

Selectable Voltage Supply; Universal Power Supply; High Current Supplies

Power supply options used on the

Windows NT-PC Retrofitted GR228X Systems to power the UUT.

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Testing Board Continuity

Continuity tests are the first set of in-circuit tests that ATG generates. Continuity tests identify shorts and opens in the circuit board connections by:

z Measuring the resistances between all possible node pairs.

z Checking unconnected nodes for very high resistance.

z Checking connected nodes for very low resistance.

Optionally, you can select a test that verifies the integrity of the connections between the receiver, fixture, and UUT. This test checks for a leakage path between source nodes and sense nodes on the UUT. If a leakage path does not exist, it usually means that the receiver, fixture, or UUT is not making electrical contact.

The scratchprobing diagnostic technique is another form of connectivity testing that you can use to determine if a component failed because of a bad connection on the UUT. You use a probe for this test. When a component fails, the operator can be instructed to probe the pins of the failed component. This tests the connection from each IC pin to the test probe. It verifies that the connection from the test probe to the IC pin is intact and whether the IC or the board connection needs repair.

Testing Analog Components

Analog testing is usually performed with no power supplies or ground reference applied to the UUT. Passive analog components are tested by applying an external stimulus to the component, either voltage or current, and measuring the results. Tests of more complex devices, such as active filters, usually require power. In either case, appropriate source and measure instruments are connected to component pins on the board. The source instruments force a voltage or current input. The Measure instruments measure the voltage or current output.

ATG automatically analyzes the circuitry surrounding each analog component and then searches the Analog Test Library (ATL) for an appropriate measurement configuration.

ATG uses the library procedure as a template for the test to:

z Select source, measure, and guard terminals.

z Calculate the unknown component value.

z Check for error conditions.

The ATG test selection process can generate these basic impedance test configurations:

z 2-terminal unguarded measurement and 4–terminal Kelvin measurement

z 4- and 6-terminal guarded measurement

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1-12 Overview

ATG can also determine if a test system has an 8–wire mode, and, when appropriate, writes accurate 8–wire resistor tests for low value components.

Each in-circuit analog test that ATG generates:

z Defines relevant measurement parameters, such as resistance, capacitance, or gain, and selects a stimulus current or voltage for measuring it.

z Determines how the device can be isolated from its circuit environment so that interactions from other components do not affect the measurement.

z Connects the appropriate circuit nodes to the tester’s measurement instruments so that it can issue relay commands. In some cases, both analog and digital test strategies are used to accomplish these ends. Fortunately, most testing problems are solved by the ATG software, using programmed circuit analysis and libraries of test procedures for circuit components to develop tests for the board.

Testing Digital Components

NOTE The GR2281A and GR2287A Test Systems do not have digital test vector capabilities, but can detect opens on digital components using the TEST XPRESS software.

Digital component testing requires a method of testing the device and a method of isolating it from the surrounding devices or from adjacent buses. The device test requires a set of known logic states applied to the device’s inputs, and a set of expected output states that the device should produce. These input and output bit patterns, called test vectors, usually reflect the truth table associated with the device. To allow the device to function, power and ground are applied to the device during the test.

Digital component testing is actually several tests that are performed in this order:

z Non–bused IC tests are performed before full tests on the bused devices.

z Bus connections are tested by attempting to free the bus from all the devices connected to it. A digital circuit component test usually requires a large number of simultaneous input and output test vectors. Accordingly, the test hardware for digital testing consists of a relatively large number of Driver/Sensor circuits. Test programs are written as if a separate Driver/Sensor were available at each test probe. The actual number of Driver/Sensors is, however, much smaller than the number of available probes. The system software arranges connections from the Driver/Sensors through a relay–based multiplexing system, so you can connect all probes to the Driver/Sensors. This means that a program cannot actually use all of the test probes at once; but test programs rarely need to use more than 250 probes at any one time.

Each Driver/Sensor contains built–in, programmable pull–up and pull–down resistors that connect to the logic high and low drive voltages. These resistors are commonly used to simplify the sensing of open–emitter and open–collector outputs.

In bus testing, the pull–down resistors are first used to pull the bus lines low. If the pull–down resistors can bring the bus lines to a low voltage level, you can assume that the bus is in a high impedance state, at least in the high voltage range. The programmable pull–up resistors are connected to the logic high voltage, and the bus lines are checked for logic highs. These two tests verify that no device is driving the bus at the low logic level.

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The output of each driver normally functions as a programmable voltage source, generating highs and lows at voltages the test program determines. To test open–collector, open–emitter, and tri–state devices, the Driver/Sensor can switch in a pair of pull–up and pull–down resistors. A sensor is simply a voltage comparator that returns a logic 1 for all voltages above a certain programmed threshold, and a logic 0 for voltages below a second programmed threshold. Values falling between the two thresholds fail tests for both high and low.

A digital test is conducted by applying as many input combinations to the device’s inputs as the circuit connections allow. Inputs tied high or low cannot be tested and inputs tied together cannot be tested separately. Using the truth table or an appropriate set of test vectors, the test system checks the outputs for the expected high and low states. Within certain limits, you can specify the device’s current and voltage parameters, as well as signal delays, in the test. In-circuit digital tests generally, however, are meant to verify the device’s logical functions rather than its electrical parameters.

Testing Hybrid Components

A hybrid test is a test that usually includes both analog and digital test statements. Hybrid tests are effective at generating tests for multiple components that are tested as a function (such as filters, pulse width modules). Examples of other hybrid devices include: programmable gain amplifiers and analog–to–digital converters. Hybrid tests can be generated on GR228X test systems. Hybrid tests can use any of the system’s test instruments to construct the test to measure a component or group of components.

The Hybrid Test Generator (HTG) uses hybrid library models that effectively take advantage of these GR228X test software features:

z TRIGGER statement that synchronizes the source and measurement instrument timing. Both single–step and continuous triggering are permitted.

z Floating–point arrays and system subroutines that simplify the handling of large amounts of data. The test language includes routines to process and display array data. A test program can use arrays with up to 32K elements.

The subroutines can perform:

Simple mathematical calculations on arrays of real numbers Mathematical calculations on complex vectors

Discreet Fourier Transforms, Fast Fourier Transforms, and Inverse Fast Fourier Transforms

z Arbitrary Waveform Generator (AWG) that provides various input stimulus to test a circuit’s response. You can create a multi–tone signal that increases testing efficiency. By combining multiple tones into a single waveform, tests can be performed in parallel.

z Digital Multimeter (DMM) that performs voltage and current sampling on digitized analog signals for applications requiring tests like signal/noise ratio calculations, spectral analysis, and slew rate calculations. Sampling a waveform enables you to compare the frequency response of a device output to the input signal generated by the test system.

z AC voltage and current meter (ACM) that performs RMS, peak, and DC–offset measurements on analog signals.

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1-14 Overview

A hybrid test is generated from a hybrid model. The hybrid model can contain both unpowered and powered sections that define how the hybrid device is tested.

Unpowered section tests are performed on the passive section of a component or group of components. The unpowered hybrid test is inserted in the test program after the analog in-circuit tests and before the power up routine.

Powered section tests are performed on the key operating parameters of a device or group of devices. The powered hybrid test is inserted in the test program after the power up routine and before the digital tests. These tests can contain a digital burst.

When both unpowered and powered tests are within the same model, ATG splits the test and places the sections in the appropriate place within the program.

For examples of these advanced test techniques, refer to the GR228X Advanced Applications.

Testing Boundary Scan Components

Boundary scan is a structured design-for-testability method applicable to digital devices. The phrase “design-for-testability” refers to the on-going effort by both component and board designers to improve the observation and control of their designs during test.

NOTE The GR2281A and GR2287A Test Systems do not support boundary scan component testing.

Some circuit board assemblies contain boundary scan components. These components offer testing advantages by exercising the components’ internal circuitry to overcome probing limitations.

In addition, you can further test the board by exercising boundary scan components to perform self-tests.

To improve UUT fault coverage and diagnostics, GenRad combines traditional in-circuit test techniques with boundary scan test techniques. GenRad offers two optional software products that perform in-circuit testing of boundary scan components:

z BasicSCAN is very effective for testing UUTs that contain a few boundary scan components with full access.

z Scan Pathfinder is very effective for testing UUTs that contain many boundary scan components with limited access.

For further information, refer to Meeting the Challenge of Boundary Scan. This GenRad handbook provides an informal introduction to Boundary Scan. You can obtain this handbook from your sales representative.

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T

est Fixtures

A test fixture is a custom built interface that provides reliable electrical paths to the UUT from the system’s analog source and measure instruments, digital driver/sensor circuits, and UUT power supplies.

There are many test fixture types. The most common are:

z In-circuit (bed-of-nails)

z Functional (edge)

InĆCircuit Test Fixture

The in-circuit test fixture connects rows of contact nails on the receiver to a bed-of-nails on the top side of the fixture. The nails on the fixture are called test nails, and the nails on the receiver are called receiver nails. Since each UUT is unique, it requires its own in-circuit test fixture.

Fixture manufacturers usually provide test fixtures that are completely assembled and wired or test fixture kits that you assemble and wire. No matter who assembles the test fixture, you need to provide UUT and test program information that includes:

z Nail Fixture Report (.NFR) file, and optionally, the Nail Wire List (.NWL) file, which is used for short–wire length fixtures, and the CAD design data that contains the X, Y coordinate information for all pins on the UUT.

z Your test system’s configuration.

z Test program requirements such as special Opens Xpress, Cap Xpress, and Orient Xpress fixture wiring data (.DPR) file.

z Fixture Wiring Instructions (.FWI) file, that contains informational messages and instructions to the fixture assembler on how to wire the power supply connections to the test fixture. The Fixture design and construction is coordinated with the test program development objectives. Refer to your test system’s Test Fixture Manual for the reasons and procedures for the various fixture design strategies.

Refer to the GR228X Test Program Generation Manual for information on generating reports required for building a test fixture. For information on installing and using a test fixture, refer to the

GR228X Production Test User’s Guide.

Functional Test Fixture

The Functional test fixture connects the UUT to the system’s test instruments. In functional testing, you only test the inputs and outputs that are at the UUT edge connectors. Therefore, the test fixture need only be a little more than the UUT’s normal interface connectors. The test fixture can be relatively simple and inexpensive to construct, which is especially attractive for

low–volume testing. Using a functional tester, it is often possible to test a variety of bus–oriented boards from an edge connector in a single fixture.

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2-1 Introduction to GR228X Test Systems

GR228X Test Systems

GenRad’s GR228X Test Systems are a family of Windows NT-based PC–controlled,

combinational test systems. Providing a variety of GR228X systems enables you to choose the configuration that best suits your board testing needs. This section describes the hardware that comprises the Windows NT-based GR228X Test System.

G

R228X System Configurations

Each Windows NT-based GR228X Test System is configured differently. A description of the fields used in the GR228X System Configurations appears before Table 2–1.

A description of the fields used in Table 2–1 follow.

Field Name Identifies the

System Type Type of GR228X System. Pin Board (Type) System’s performance class.

Pin Board (Max) Maximum number of pin boards allowed for that system type. Driver/Sensors per board Maximum number of driver/sensor (D/S) connections per pin

board.

Avail. Nails (Max) Maximum number of test nails available for that system type. Mux Ratio Multiplexing system ratio (i.e. 2 D/S per 16 nails).

Data Rate Maximum digital subsystem vector speed rate.

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Table 2–1 GR228X System Configurations System Type Pin Board (Type) Pin Boards (Max) Driver/ Sensors per board Avail. Nails (Max) Mux Ratio Data Rate GR2280 Combo I 10 16 1280 2:16 5 MHz GR2281 Combo II 10 32 1280 2:8 5 MHz GR2281A ASM 11 0 1408 2:8 Not Applicable GR2282 Combo I 30 16 3840 2:16 5 MHz GR2283 Combo I 15 16 1920 2:16 5 MHz GR2284 Combo II 15 32 1920 2:8 5 MHz GR2285e XP 15 32 1920 2:8 10 MHz GR2286 Combo I 30 16 3840 2:16 5 MHz GR2286 Combo I 30 16 3840 2:16 5 MHz GR2287 Combo II 30 32 3840 2:8 5 MHz GR2287 Combo II 30 32 3840 2:8 5 MHz GR2287L HDC1 30 32 7680 2:16 5 MHz GR2287LX HDC2 30 64 7680 2:8 5 MHz GR2287A ASM 30 0 3840 2:8 Not Applicable GR2288 Combo II 9 32 1152 2:8 5 MHz GR2289e XP 30 32 3840 2:8 10 MHz

_{System allows 11 pin boards if the AFTM is not installed.} _{1408 if 11 pin boards are present}

_{Analog Scanner Modules} _{Windows NT PC Retrofitted system} _{e-Series system or i-Series system} _{Xtended Performance}

_{High Density Card 1. You must have a minimum of two HDC1s. Optionally, you can populate the GR2287L with up to 28 Combo II pin boards.} _{High Density Card 2. You can only populate the GR2287LX with HDC2 pin boards.}

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G

R2280 and GR2281 Production Test Systems

The GR2280 and GR2281 Production Test Systems are designed to provide comprehensive testing for small to large scale Printed Circuit Boards (PCB) and assemblies. Each Production Test System provides full analog and digital measurement capabilities for testing.

In addition, some functional tests can be performed with the standard system measurement modules. External measurement or source devices, controlled via an IEEE bus interface option, can be added to expand the functional test capabilities. These external instruments can be connected to the system’s scanner subsystem through external multiplexer ports.

Figure 2–1 shows the GR2280 and GR2281 Production Test Systems.

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Standard System Hardware

The standard system hardware configurations include:

Hardware GR2280 GR2281

Pin board type Combo I Combo II

Pin board (max) 10 10

Driver/Sensors per board 16 32 Available nail (max) 1280 1280

Mux Ratio 2:16 2:8

Data Rate 5 MHz 5 MHz

Analog Functional Test Module (AFTM) Yes Yes Analog testing & measurement Yes Yes Digital testing & measurement Yes Yes Clock/Sync/Trigger board Yes Yes High Speed Controller Yes Yes

NOTE If an AFTM is not used in these systems, they can accommodate 11 pin boards and has 1408 available nails.

Optional Hardware

The hardware options that can be added to the standard system configurations include:

z Increasing the number of pin boards from minimum configurations

GR2280 and GR2281 systems can contain up to 10 pin boards, 11 if AFTM is not present. The standard system comes with 2 pin boards.

z UUT power supplies in any combination of these voltages:

Programmable Voltage (PS) (up to 7 PS in alliance rack)

Fixed Voltage (Fixed)

(set of 3 )

0 - 7V @ 15A +5V @ 6A +5V @ 6A 0 - 20V @ 8A +15V @ 1.0A or +12V @ 1.3A 0 - 60V @ 2.5A

z High Voltage DC Voltage Source (+120V). DC Current Measure (+60mA).

z IEEE-488 Interface Controller and Instrument Multiplexer

z Deep Serial Memory Module (DSM)

z Custom Function Board (CFB) with Vehicle Control Interface (VCI) or Frequency Time Interval Instrument (FTI) modules

z Bar Code Scanner

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G

R2281A and GR2287A Production Test Systems

The GR2281A and GR2287A Production Test Systems perform analog testing. They do not have a digital subsystem. These systems are designed to quickly identify component faults early in the manufacturing process.

Figure 2–2 shows the GR2281A and GR2287A Test Systems.

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Standard System Hardware

The standard system hardware configurations include:

Hardware GR2281A GR2287A

Pin board type ASM ASM

Pin board (max) 11 30

Available nail (max) 1408 3840

Mux Ratio 2:8 2:8

Analog testing & measurement Yes Yes Digital testing & measurement No No Clock/Sync/Trigger board No No High Speed Controller No No

NOTE Data rates are used to describe digital test vector speeds. Since the GR2281A and GR2287A Production Test Systems do not have a digital subsystem, data rates are not available.

ASM refers to Analog Scanner Modules

Optional Hardware

The hardware options that can be added to the standard system configurations include:

z Increasing the number of pin boards from minimum configurations

GR2281A systems can contain up to 11 pin boards. The standard system comes with 4 pin boards.

GR2287A systems can contain up to 30 pin boards. The standard system comes with 4 pin boards.

Programmable Voltage (PS) (up to 5 PS in alliance rack)

(set of 3 )

z High Voltage DC Voltage Source (+120V)

z Additional vacuum port (2281A only)

z Bar Code Scanner

z IEEE interface

z Custom Function Board (CFB) with Frequency Time Interval Instrument (FTI)

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G

R228X iĆSeries Test Systems

The Production Test Systems are designed to provide comprehensive testing for small to large scale Printed Circuit Boards (PCB) and assemblies. Each Production Test System provides full analog and digital measurement capabilities for testing.

Figure 2–3 shows a GR228X i–Series Test System. The GR228X i–Series Test Systems include the GR2283, GR2284, GR2286, GR2287, and GR2287L.

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Standard Hardware

The standard test system hardware configurations include:

Hardware GR2283 GR2284 GR2286 GR2287 GR2287L GR2287LX

Pin board type Combo I Combo II Combo I Combo II HDC1 or Combo II

HDC2

Pin board (max) 15 15 30 30 30 30 Driver/Sensors per board 16 32 16 32 32 64 Available nails (max) 1920 1920 3840 3840 7680 7680 Mux Ratio 2:16 2:8 2:16 2:8 2:16 2:8 Data Rate 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz 5 MHz Analog testing and

measurement

YES YES YES YES YES YES

Digital testing and measurement

Clock/Sync/Trigger board

High Speed Controller

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Optional Hardware

The hardware options that can be added to the standard system configurations include:

z Increasing the number of pin boards from the 2 pin board minimum configuration. GR2283 and GR2284 systems can contain up to 15 pin boards. In addition, there are 7 accessory slots available which can contain optional hardware modules such as DSM boards and the AFTM board.

GR2286 and GR2287 systems can contain up to 30 boards including more pin boards and the optional DSM and/or the AFTM. Accessory slots are not available for these systems. The GR2287L must have a minimum of two High Density Cards (HDC1). Optionally, you can populate the GR2287L with up to 28 Combo II boards. The GR2287LX can only be configured with HDC2 pin boards.

Programmable Voltage (PS) (up to 2 cages of 7 PS)

(set of 3 )

z High Voltage DC Voltage Source (+120V). DC Current Measure (+60mA).

z IEEE-488 Interface Controller and Instrument Multiplexer

z Deep Serial Memory Module (DSM)

z Custom Function Board (CFB) with Vehicle Control Interface (VCI) or Frequency Time Interval Instrument (FTI) modules

z Bar Code Scanner

z Repair ticket printer, line printer

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G

R228X eĆSeries Test Systems

The GR228X e-Series Test Systems are designed to provide comprehensive testing for small to large scale Printed Circuit Boards (PCB) and assemblies. Each GR228X e-Series Test System provides full analog and digital measurement capabilities for testing:

z Analog, digital, and mixed signal components.

z Functional blocks of components.

z All types of components (including SMT) without using device libraries, if you purchase the TEST XPRESS option.

Each e-Series system is compatible with all other e-Series systems that contain the same mux ratio. Test programs and fixtures developed on one system are easily migrated to another

e-Series system.

Figure 2–4 shows the GR228X e-Series Test System.

CPU ON OFF SYS POWER ON DVR/STROBE 1 SNR/STROBE 2 TRIGGER CLOCK STROBE 3 STROBE 4 TEST STEP DIG INSTR PROBE PROBE L R AUTOOFFON UUT VACUUM CONTROLFIXTURERAISE

AUTO MODE LOWER

AUTO MODEENABL SINGLE DUAL

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Standard System Hardware

The six standard e-Series system configurations are described in the following table. The

e-Series systems use one of two receivers:

z GR2283e, GR2284e, and GR2285e systems use receiver connector positions 0 through 18.

z GR2286e, GR2287e, and GR2289e systems use receiver connector positions 0 through 33.

Hardware GR2283e GR2284e GR2285e GR2286e GR2287e GR2289e

Pin board type Combo I Combo II XP Combo I Combo II XP Pin board (max) 15 15 15 30 30 30 Driver/Sensors per board 16 32 32 16 32 32 Available nails (max) 1920 1920 1920 3840 3840 3840 Mux Ratio 2:16 2:8 2:8 2:16 2:8 2:8 Data Rate 5 MHz 5 MHz 10 MHz 5 MHz 5 MHz 10 MHz Analog testing and

measurement

Yes Yes Yes Yes Yes Yes

Digital testing and measurement

Yes Yes Yes Yes Yes Yes

Clock/Sync/Trigger board Yes Yes Yes Yes Yes Yes High Speed Controller Yes Yes Yes Yes Yes Yes

Introduction to GR228X Test Systems

GR228X Test Systems

Introduction to

9007-4008-03

GenRad

List of Effective Pages

Contents

Preface

Overview

GR228X Test Systems

GR228X Test Software

Windows NT System Environment

Documentation Quick Reference

Preface

Overview

Audience

About this Manual

Related GenRad Documentation

Document Conventions

GenRad Customer Care Center

Overview

G

R228X System Architecture

Basic System Components

S

ystem Activities

T

esting Methods

InĆCircuit Testing

Functional Testing

S

ystem Test Devices

Testing Board Continuity

Testing Analog Components

Testing Digital Components

Testing Hybrid Components

Testing Boundary Scan Components

T

est Fixtures

InĆCircuit Test Fixture

Functional Test Fixture

GR228X Test Systems

G

R228X System Configurations

G

R2280 and GR2281 Production Test Systems

Standard System Hardware

Optional Hardware

G

R2281A and GR2287A Production Test Systems

Standard System Hardware

Optional Hardware

G

R228X iĆSeries Test Systems

Standard Hardware

Optional Hardware

G

R228X eĆSeries Test Systems

Standard System Hardware