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SD Memory Card Connectors

DM1 Series

■Features

1. Withstands higher force of card insertion

Metal cover extends over the back of the connector

allowing it to withstand force of up to 400 N (static load)

when dropped or accidentally hit.

2. No damage to the card when accidentally

pulled-out

The connectors will release the card when a moderate

pull-out force of about 4 N is applied. There will be no

damage to the lock components and all connector

functions will not be affected.

3. Accidental card fall-out prevention

Built-in lock feature holds the card securely in place.

4. Reliable Card Insertion and Withdrawal

Built-in Push-in / Push-out ejection mechanism assures

simple and reliable card insertion and withdrawal.

5. Designed to accept Secure Digital I/O card

(Built-in Ground Contact)

The connector allows use of various expansion modules,

including the Bluetooth communication modules.

■Applications

Notebook PC's, digital cameras, PDA's, audio/video

equipment and other devices utilizing SD I/O cards.

Card

Standard type

Withstands higher force of card insertion.

Metal cover extends over the back of the connector.

Card

Reverse type

Metal cover extends over the back of the connector.

No damage to the card when

accidentally pulled-out.

Accidental card

fall-out prevention

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DM

1

AA - SF - PEJ

500 V DC 1000 Mømin. (Initial value)

1. Insulation resistance

Rating Current rating 0.5A DC

Voltage rating 125 V AC

Operating temperature range:-25çto +85ç(Note 1) Storage temperature range:-40çto +85ç(Note 2)

Operating humidity range : Relative humidity 95% max. (No condensation)

Product Specifications

Item Specification Conditions

500 V AC / one minute No flashover or insulation breakdown

2. Withstanding voltage

100mA DC 100 mømax. (Initial value)

3. Contact resistance

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis No electrical discontinuity of 100 ns or more

4. Vibration

96 hours at temperature of 40ç ±2çand humidity of 90% to 95%

Contact resistance: 40 mømax. from initial value Insulation resistance: 100 Mømin.

5. Humidity

Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30 /5 /30 /5 (Minutes) 5 cycles

Contact resistance: 40 mømax. from initial value Insulation resistance: 100 Mømin.

6. Temperature cycle

10000 cycles at 400 to 600 cycles per hour Contact resistance: 40mømax. from initial value

7. Durability (mating/un-mating)

Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds

No deformation of components affecting performance. 8. Resistance to soldering heat

Note1: Includes temperature rise caused by current flow.

Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.

Materials

Ordering information

1 2 3 4

Component Material Finish Remarks

Insulator Heat resistant thermoplastic compound Color: Black UL94V-0 Contacts Phosphor bronze Contact area: Gold platingTermination area: Tinned copper plating

---Cover Stainless steel Termination area: Tinned copper plating ---Others Stainless steelPiano wire Nickel plating---

---Series name :DM1

Connector type :AA : Standard receptacle

:B : Reverse receptacle

Terminal type

SF : Right angle surface mount DSF : Reverse right angle surface mount Eject mechanism codes

PEJ : Card Push insert/Push withdraw 1

2

3

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2 2 1.6±0.05 1.2±0.05 25.4±0.05 15±0.05 4.125±0.05 P=2.5±0.05 9-1.1±0.05 1.35±0.05 1.7±0.05 22.4±0.05 2±0.05 1.2±0.05 23.2±0.05 4.55±0.05 2+0.1 0 4-2 +0.1 0 2-Ø1.3 +0.1 0 2+0.1 0 2+0.1 0 3-1 +0.1 0 20.75±0.05 18.15±0.05 9.2±0.05

Card detection switch

Write protection switch

9.2 18.15 3-0.5 20.75 No.8 No.7 No.6 No.5 No.4 No.3 No.2 No.1 No.9 1 CL 1 28 13.2 9.75 8.05 t=0.2,W=0.6 15 5.625 P2.5 1 2.9 22.4 2-Ø1.2 0.55 30.5 2.5 23.2 4.55 4-1.5 1 CL 1 1 CL 1 CL

24.15 (Card slot dimension)

Weight:2.2g When card is ejected When card is ejected When card is inserted

When card is inserted WRITE PROTECT WRITE ENABLE Card detection switch Write protection switch

OPEN CLOSE OPEN OPEN CLOSE

1 CLindicates the center line of card slot.

Standard type

Part number

DM1AA-SF-PEJ(21) 609-0004-8-21

HRS No.

B

PCB mounting pattern

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A(5:1) B(5:1) C(5:1) (R0.6) (R0.4) (R0.4)(R0.6) (R0.4)(R0.6) 1.7 +0.1 0 (Land) 1.2+0.1 0 (Land) 1.3 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) 1.9 +0.1 -0.1 (Land) 1.2+0.1 0 (Land) 1.5 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) 2.4 +0.1 -0.1 (Land) 1.2+0.1 0 (Land) 2 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) CARD DETECT COMMON FOR CD & WP

WP A A C B 5.62 9.47±0.05 12.8±0.05 11.2±0.05 9.75±0.05 0.8±0.05 1.4±0.05 8.05±0.05 12.5±0.05 5.625±0.05 P=2.5±0.05 1.25±0.05 8-1.1±0.05 12.57±0.05 11.23±0.05 14.13±0.05 11.93±0.05 2.03±0.05 1.4±0.05 23.48±0.05 26.98±0.05 28.5±0.05 14.25±0.05 0.8±0.05 11-2.5±0.05 1.05±0.05 28.25±0.05 3 3

Center of Card dimension

Reverse type

B

PCB mounting pattern

2 (0.25) (1.77) No.8 No.7No.6 No.5 No.4 No.3 No.2 No.1 No.9 28 (14.35) 18.68 2 16.85 6-0.65 1.5 1.85 1.05 0.35 2 2 2 2 2 27.2 2 27.45 29 2 8.63 1 CL 1 CL 2 6.95 2 7.65 5.62 2.9 1 CL 1 CL 29.9 SD Card

(5):Card pushed for insertion

(6):Card fully inserted

10:

Card ejected(Card ejected dimension)

Weight:2.1g 1 2

When card is ejected

OPEN OPEN CLOSE

WRITE PROTECT WRITE ENABLE Card detection switch

When card is ejected When card is ejected When card is ejected

Write protection switch

OPEN CLOSE

indicates the dimension of DIP terminals. CLindicates the center line of the card slot.

Part number

DM1B-DSF-PEJ 609-0003-5

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2±0.15 4±0.1 1.75±0.1 Ø1.5 +0.1 0 36±0.1 3.4±0.34.35±0.3 44±0.3 40.4±0.1 20.2±0.1 Unreeling direction

B

Packaging specifications

Embossed Carrier Tape Dimensions (Standard type) 450 pieces per reel

2±0.15 4±0.1 36±0.1 4.6±0.3 3.4±0.3 1.75±0.1 44±0.3 40.4±0.1 20.2±0.1 Ø1.5 +0.1 0 Unreeling direction

Embossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel

End section Mounting section(450) Lead section (400mm min.)

(Ø380) (Ø150) D Unreeling direction 44.4+2 0

Reel dimensions

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100ç 0ç 150ç 200ç 300ç 50S 0S 100S 150S 200S MAX240ç 220ç Preheating Soldering Preheating: 150ç 30 to 90 sec. IR Reflow Conditions

Soldering : 235±5ç 10 sec. Max.

Soldering : 220ç 10 to 20 sec.

Recommended Temperature Profile

Recommended Conditions

Reflow system : IR reflow

Solder : Paste type 63 Sn/37 Pb(Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm thick Metal mask thickness: 0.15 mm

Recommended temperature profile.

References

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