SD Memory Card Connectors
DM1 Series
■Features
1. Withstands higher force of card insertion
Metal cover extends over the back of the connector
allowing it to withstand force of up to 400 N (static load)
when dropped or accidentally hit.
2. No damage to the card when accidentally
pulled-out
The connectors will release the card when a moderate
pull-out force of about 4 N is applied. There will be no
damage to the lock components and all connector
functions will not be affected.
3. Accidental card fall-out prevention
Built-in lock feature holds the card securely in place.
4. Reliable Card Insertion and Withdrawal
Built-in Push-in / Push-out ejection mechanism assures
simple and reliable card insertion and withdrawal.
5. Designed to accept Secure Digital I/O card
(Built-in Ground Contact)
The connector allows use of various expansion modules,
including the Bluetooth communication modules.
■Applications
Notebook PC's, digital cameras, PDA's, audio/video
equipment and other devices utilizing SD I/O cards.
Card
Standard type
Withstands higher force of card insertion.
Metal cover extends over the back of the connector.
Card
Reverse type
Metal cover extends over the back of the connector.
No damage to the card when
accidentally pulled-out.
Accidental card
fall-out prevention
DM
1
AA - SF - PEJ
500 V DC 1000 Mømin. (Initial value)
1. Insulation resistance
Rating Current rating 0.5A DC
Voltage rating 125 V AC
Operating temperature range:-25çto +85ç(Note 1) Storage temperature range:-40çto +85ç(Note 2)
Operating humidity range : Relative humidity 95% max. (No condensation)
■
Product Specifications
Item Specification Conditions
500 V AC / one minute No flashover or insulation breakdown
2. Withstanding voltage
100mA DC 100 mømax. (Initial value)
3. Contact resistance
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis No electrical discontinuity of 100 ns or more
4. Vibration
96 hours at temperature of 40ç ±2çand humidity of 90% to 95%
Contact resistance: 40 mømax. from initial value Insulation resistance: 100 Mømin.
5. Humidity
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç Duration: 30 /5 /30 /5 (Minutes) 5 cycles
Contact resistance: 40 mømax. from initial value Insulation resistance: 100 Mømin.
6. Temperature cycle
10000 cycles at 400 to 600 cycles per hour Contact resistance: 40mømax. from initial value
7. Durability (mating/un-mating)
Reflow: At the recommended temperature profile Manual soldering: 300ç for 3 seconds
No deformation of components affecting performance. 8. Resistance to soldering heat
Note1: Includes temperature rise caused by current flow.
Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
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Materials
■
Ordering information
1 2 3 4
Component Material Finish Remarks
Insulator Heat resistant thermoplastic compound Color: Black UL94V-0 Contacts Phosphor bronze Contact area: Gold platingTermination area: Tinned copper plating
---Cover Stainless steel Termination area: Tinned copper plating ---Others Stainless steelPiano wire Nickel plating---
---Series name :DM1
Connector type :AA : Standard receptacle
:B : Reverse receptacle
Terminal type
SF : Right angle surface mount DSF : Reverse right angle surface mount Eject mechanism codes
PEJ : Card Push insert/Push withdraw 1
2
3
2 2 1.6±0.05 1.2±0.05 25.4±0.05 15±0.05 4.125±0.05 P=2.5±0.05 9-1.1±0.05 1.35±0.05 1.7±0.05 22.4±0.05 2±0.05 1.2±0.05 23.2±0.05 4.55±0.05 2+0.1 0 4-2 +0.1 0 2-Ø1.3 +0.1 0 2+0.1 0 2+0.1 0 3-1 +0.1 0 20.75±0.05 18.15±0.05 9.2±0.05
Card detection switch
Write protection switch
9.2 18.15 3-0.5 20.75 No.8 No.7 No.6 No.5 No.4 No.3 No.2 No.1 No.9 1 CL 1 28 13.2 9.75 8.05 t=0.2,W=0.6 15 5.625 P2.5 1 2.9 22.4 2-Ø1.2 0.55 30.5 2.5 23.2 4.55 4-1.5 1 CL 1 1 CL 1 CL
24.15 (Card slot dimension)
Weight:2.2g When card is ejected When card is ejected When card is inserted
When card is inserted WRITE PROTECT WRITE ENABLE Card detection switch Write protection switch
OPEN CLOSE OPEN OPEN CLOSE
1 CLindicates the center line of card slot.
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Standard type
Part number
DM1AA-SF-PEJ(21) 609-0004-8-21
HRS No.
B
PCB mounting pattern
A(5:1) B(5:1) C(5:1) (R0.6) (R0.4) (R0.4)(R0.6) (R0.4)(R0.6) 1.7 +0.1 0 (Land) 1.2+0.1 0 (Land) 1.3 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) 1.9 +0.1 -0.1 (Land) 1.2+0.1 0 (Land) 1.5 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) 2.4 +0.1 -0.1 (Land) 1.2+0.1 0 (Land) 2 +0.1 0 (Through hole) 0.8+0.1 0 (Through hole) CARD DETECT COMMON FOR CD & WP
WP A A C B 5.62 9.47±0.05 12.8±0.05 11.2±0.05 9.75±0.05 0.8±0.05 1.4±0.05 8.05±0.05 12.5±0.05 5.625±0.05 P=2.5±0.05 1.25±0.05 8-1.1±0.05 12.57±0.05 11.23±0.05 14.13±0.05 11.93±0.05 2.03±0.05 1.4±0.05 23.48±0.05 26.98±0.05 28.5±0.05 14.25±0.05 0.8±0.05 11-2.5±0.05 1.05±0.05 28.25±0.05 3 3
Center of Card dimension
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Reverse type
B
PCB mounting pattern
2 (0.25) (1.77) No.8 No.7No.6 No.5 No.4 No.3 No.2 No.1 No.9 28 (14.35) 18.68 2 16.85 6-0.65 1.5 1.85 1.05 0.35 2 2 2 2 2 27.2 2 27.45 29 2 8.63 1 CL 1 CL 2 6.95 2 7.65 5.62 2.9 1 CL 1 CL 29.9 SD Card
(5):Card pushed for insertion
(6):Card fully inserted
10:
Card ejected(Card ejected dimension)
Weight:2.1g 1 2
When card is ejected
OPEN OPEN CLOSE
WRITE PROTECT WRITE ENABLE Card detection switch
When card is ejected When card is ejected When card is ejected
Write protection switch
OPEN CLOSE
indicates the dimension of DIP terminals. CLindicates the center line of the card slot.
Part number
DM1B-DSF-PEJ 609-0003-5
2±0.15 4±0.1 1.75±0.1 Ø1.5 +0.1 0 36±0.1 3.4±0.34.35±0.3 44±0.3 40.4±0.1 20.2±0.1 Unreeling direction
B
Packaging specifications
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Embossed Carrier Tape Dimensions (Standard type) 450 pieces per reel
2±0.15 4±0.1 36±0.1 4.6±0.3 3.4±0.3 1.75±0.1 44±0.3 40.4±0.1 20.2±0.1 Ø1.5 +0.1 0 Unreeling direction
●
Embossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel
End section Mounting section(450) Lead section (400mm min.)
(Ø380) (Ø150) D Unreeling direction 44.4+2 0
●
Reel dimensions
100ç 0ç 150ç 200ç 300ç 50S 0S 100S 150S 200S MAX240ç 220ç Preheating Soldering Preheating: 150ç 30 to 90 sec. IR Reflow Conditions
Soldering : 235±5ç 10 sec. Max.
Soldering : 220ç 10 to 20 sec.
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Recommended Temperature Profile
Recommended Conditions
Reflow system : IR reflow
Solder : Paste type 63 Sn/37 Pb(Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm thick Metal mask thickness: 0.15 mm
Recommended temperature profile.