Learning
Objectives...
Chapter 12:
Chapter 12:
Electrical Properties
Electrical Properties
• How are electrical conductance and resistance characterized?• What are the physical phenomena that distinguish conductors, semiconductors,
and insulators?
• For metals, how is conductivity affected by imperfections, deformation,
and temperature?
F i d h i d i i ff d b i f i i i i (d i )
• For semiconductors, how is conductivity affected by imperfections, impurities (doping) and Temperature?
•
Pages 483-541
Relevant Reading for this Lecture...
1
•
Ohm's
Law:
V = I R
voltage
drop
(volts)
resistance
(Ohms)
current
(amps)
A
V
L
I
A
ELECTRICAL
CONDUCTION
I
V
e-A (cross sect. area) LCross‐sectional Area
•
Resistivity,
and
Conductivity,
:
these
terms
are
independent
of
sample
geometry
or
shape
this
equation
is
another
form
of
Ohm's
Law
(recall
normalization
with
)
RA
•
Resistance:
R
L
A
L
A
I
conductivity
(Ohm‐m)
‐1 e e eq
n
More about this laterresistivity
(Ohm
‐
m)
L
Electrical Properties
• Which will have the greater resistance?
D
R
2
8
2
D
2
D
R
1
D
2
2
D
2
R
2
2
D
2
2
D
2
R
18
Chapter 12 - 3• Analogous to flow of water in a pipe
• Resistance depends on sample geometry and
size.
3
Electrical
Conductivity
Electrical
Conductivity
:
:
Comparison
Comparison
(at room temperature!)
• Ceramics
10
-10Soda lime glass
Material
(Ohm‐m)‐1• Metals
Silver
6.8 x 10
7Material
(Ohm‐m)‐1Alumina (Al
2O
3)
10
10Soda-lime glass
10
-9Concrete
10
-13Aluminum
Silver
6.8 x 10
Copper
6.0 x 10
7Iron
1.0 x 10
73.8 x 10
7 conductors• Semiconductors
Silicon
4.0 x 10
-4• Polymers
<10
-13Polystyrene
Silicon
4.0 x 10
Germanium
2.2 x 10
0GaAs
1.0 x 10
-6 semiconductorsPolyethylene
10
Polystyrene
10
-15– 10
-17 insulators100m
Cu wire- e- I = 2.5A +
EX:
CONDUCTIVITY
PROBLEM
EX:
CONDUCTIVITY
PROBLEM
What
is
the
minimum
diameter
(D)
of
the
Cu
wire
so
that
V
<
1.5V?
V
R
L
V
<
1.5V
100m
R
A
I
2.5A
6.07
x
10
7
(Ohm
‐
m)
‐1
D
24
Solve
to
get
D
>
1.88
mm
5Pauli
Exclusion
Principle
gives
rise
to
energy
bands
Figure 12.2 in Callister
Quantum Mechanics
states that no two
electrons can occupy the
same state Electrons not accompanying h same state http://www.aps.org/p ublications/apsnews/2 00701/images/Wolfga ng_Pauli_1.jpg
Energy‐level diagram for a hypothetical Nɑ4 molecule. The four shared, outer orbital
electrons are “split” into four slightly different energy levels (the Pauli exclusion principle). the same state
Metals are good conductors since their valence band is
only partially filled.
Adapted from Fig. 12.3,
Callister & Rethwisch 4e.
7 Metal e.g., Cu Metal e.g., Mg Insulator Semiconductor Know this! >2eV <2eV
Adapted from Fig. 12.4,
Callister & Rethwisch 4e.
Ef= Fermi energy.
This is the boundary between the filled and unfilled energy levels. For electrons to conduct, they must move to where there are unfilled energy levels.
•
Metals:
‐‐
Thermal
energy
puts
many
electrons
into
a higher energy state.
+
-net e- flow
CONDUCTION
&
ELECTRON
TRANSPORT
CONDUCTION
&
ELECTRON
TRANSPORT
e e e
q
n
ne= # of e‐per m3 qe= Charge of e‐ e= e‐mobilitya
higher
energy
state.
net e flow•
Energy
States:
the
cases
at
right
for
metals
show
that
nearby
energy
states
are
accessible
by
th
l fl t ti
Energy
filled empty bands
Energy
partly filled empty bandGAP
‘My level’ – highest filled state Cu is like this. Mg is like this.thermal
fluctuations
filled band filled valence bandfilled state
s
filled band filled valence bandfilled states
Fermihttp://www.bayarea.net/~kins/ AboutMe/GIFs/Fermi_2.jpg
Only
those
e
‐
that
can
get
into
the
empty
energy
levels
can
“conduct”
9
•
Insulators:
‐
Higher
energy
states
are
not
accessible
due
to
band
gap.
•
Semiconductors:
‐
Higher
energy
states
separated
by
a
smaller
gap.
ENERGY
STATES:
INSULATORS
AND
SEMICONDUCTORS
g p
Energy
filled valence empty banda
tes
GAP
Energy
filled
valence
empty
band
es
GAP
?
Engineered material: Gaps are tunable – more to come…filled
band
band
filled st
a
filled
band
valence
band
filled stat
wide band gap (> 2 eV)
narrow band gap (< 2 eV) 10
Insulators:
A parallel‐plate capacitor involves an insulator, or dielectric, betweentwo metal electrodes. The charge density buildup at the capacitor surface is related to
the dielectric constant of the material
kE
D
E, Electric field strength (V/m)
A
kE
D
o D, chargedensity (C/m2)
oelectric permittivity in vacuum, constant, 8.9x10‐12C/(Vm) k, dielectric constant (material property)
l
constant, 8.9x 0 C/(Vm)k
o
electric permittivity = C = Q/V→C=A/ll
A
C
V
Q
C
Capacitance chargevoltage Note your text uses rfor k
11
Dielectric
Constants
&
Strength
• Ceramics
Titanate ceramics
--
15 – 10,000
Dielectric constant
r60 Hz 1 MHz
Dielectric strength
(V/mil)*
50 – 300
Soda-lime glass 6.9
Titanate ceramics
15 10,000
Mica --
5.4 – 8.7
Porcelain 6.0
6.0
6.9
• Polymers
2.6
2.6
Polystyrene
500 – 700
40 – 400
250
1000 – 2000
50 300
Polyethylene
2.6 2.6
Polystyrene
2.3 2.3
450 – 500
500 700
* 0.001 in = 1 mil
•
Imperfections
increase
resistivity
‐
grain
boundaries
‐
dislocations
‐
impurity
atoms
These act to scatter electrons so that they
take a less direct path, thus
.
METALS:
RESISTIVITY
VS
T,
IMPURITIES
‐
vacancies
Cu +
3.3
2 at
%Ni
Cu +
2.16
at%
Ni
defo
rme
d Cu
+ 1.
12 a
t%N
i
2
3
4
5
6
R
esistivity,
0
-8
Ohm-m)
1 12
at%
Ni
•Resistivity
)]
(
1
[
rt o
a
T
T
a is temperature coefficient ofresistivity, ois intrinsic (no impurity) resistivity
T (°C)
-200 -100
0
d
1
2
R
(1
0
Cu +
1.1
“Pur
e” Cu
•Resistivity
increases
with:
‐
temperature
‐
wt% impurity
‐
%Cold Work
Adapted from Fig. 18.8, Callister 6e. (Fig. 18.8 adapted from J.O. Linde,Ann. Physik5, p. 219 (1932); and C.A. Wert and R.M. Thomson, Physics of
Solids, 2nd ed., McGraw‐Hill Book Company, New York, 1970.)
Why????
13
Variation
in
electrical
resistivity
with
composition
for
various
copper
alloys
with
small
levels
of
elemental
additions
(at
T
=
20
°
C).
i
ic
Ac
1
A – composition independent constant
c
ii– concentration of impurities
p
14• Data for Pure Silicon:
‐
increases
with
T
‐
opposite
to
metals
Energy empty band GAP ? electronsPURE
SEMICONDUCTORS:
CONDUCTIVITY
VS
T
l t i l d ti it filled band filled valence band filled states can cross gap at higher T
material band gap (eV) electrical conductivity, (Ohm-m)-1 100 101 102 103 104 pure Si Ge GaP CdS 1.11 0.67 2.25 2.40 Adapted from Fig. 19.15, Callister 5e. (Fig. 19.15 adapted
from G.L. Pearson and J. Bardeen, Phys. Rev. 75, p. 865,
1949.)
Selected values from Table
18.2, Callister 6e. 50 100 1000 10-2 10-1 10 p (undoped) T(K) 15
CONDUCTION
IN
TERMS
OF
ELECTRON
AND
HOLE
MIGRATION
Light (shown), heat,
some input of energy
• Electrical Conductivity given by:
# holes/m
3 some input of energyis required to excite
e‐from valence band
to conduction band
leaving a positively
charged hole behind. Conduction can be either by negative carriers, h e
p
q
q
n
# electrons/m
3electron mobility
#
holes/m
3hole
mobility
y g ,electrons (n‐type) and/or positive carriers, holes (p‐type).
Electrons move towards (+) potential and holes
In class problem
What fraction of the conductivity of intrinsic silicon at room temperature is due to
(a) electrons and (b) holes?
h e
p
q
q
n
n
eq
e
e ne= # of e‐per m3 qe= Charge of e‐ From Table 12.3, =0.736 e= e‐mobility Here n = p From Table 12.3, = 0.263 17kT
Eg
o
e
2
Arrhenius equation; Why 2?Produce two
charge carriers – electron and hole
mx B y T k E e g o T k E o g 1 2 ln ln 1 2
Determining the activation energy for conduction
•
Intrinsic
semiconductors:
#
of
thermally
generated
electrons
=
#
of
holes
(broken
bonds)
•
Extrinsic semiconductors: Impurities are added to the
INTRINSIC
VS
EXTRINSIC
CONDUCTION
•
Extrinsic
semiconductors:
Impurities
are
added
to
the
semiconductor
that
contribute
additional
electrons
or
holes.
Doping
=
intentional
impurities
•
Si
is
the
primary
material
in
semiconductors
– Large band gap (1.1 eV); allows Si to operate at warmer temperatures (150oC) – Can form a native oxide, SiO2, for insulating barriers (important in fabrication)
•
Si
can
be
made
into
large
(12
inch
dia.),
high
purity,
single
crystal
ingots.
•
Doping
of
Si
– Si has 4 outer shell electrons (group IV)
– n‐type: Phosphorous, arsenic (group V), donate extra electron – p‐type: boron (group III) for Si
19
n
‐
type
4 valence electrons of As allow it to bond like Si, but the fifth electron is left orbiting As
site – the energy to release the fifth electron into the CB is small
p
‐
type
• Boron has only 3 valance electrons. When it substitutes for a Si atoms, one of its bonds
has a missing electron (hole)
• Hole tunnels around, and can be liberated by thermal vibration of Si atoms, from the B
site into the VB.
p e
h
21 p‐type n‐type ?‐type ?‐type 22Arrhenius plot of electrical
conductivity for an n‐type
semiconductor over a wide
temperature range. At low
temperatures (high 1/T), the
material is extrinsic. At high
temperatures (low 1/T), the
material is intrinsic. In
between is the exhaustion
range, in which all “extra
electrons” have been promoted
to the Why the
increase?
Why 2?Produce two charge carriers – electron and hole
to the
why?
23
In class problem
Calculate the conductivity for the saturation range of silica doped with 10‐ppb boron.
The calculated density of B atoms/m3is also the density of electron holes in this
p‐type semiconductor at saturation. 10/109
= 10‐8 Hence solve for n
h d h d f bl ( h d f l amu B n = 10‐8 6.02x10 23atoms B 10.81 g B 2.33x10 6g/m3 Si = 1.30 x1021 X X Density of Si Hence solve for n
Using this equation σ=nqµhand the data from Table 12.3: (q is the magnitude of electron charge which equals 0.16 x 10‐18 C)
σ
=
nqµ
hCompound
Semiconductors
Group III‐V and II‐V compounds nominally have
the Zinc Blend structure and are intrinsic
the inc lend structure and are intrinsic semiconductors. Can be doped, like Si, to change
conduction (extrinsic)
MX Compounds: Group III 3+ valence, Group V
5+ valence – avg. of 4+ valence per atom //
Group II 2+ valence, Group VI 6+ valence – avg.
4+ valence per atom
Applications:
•Solar cells
•Light emitting diodes (occurs with
electron‐hole recombination)
•Higher operation speeds, etc.
25
•
Allows
flow
of
electrons
in
one
direction
only
(e.g., useful
to convert alternating current to direct current).
•
Results:
+
p-type
n-type
IC
DEVICES:
P
‐
N
RECTIFYING
JUNCTION
‐
No applied potential:
no net current flow.
‐
Forward bias: carriers
flow through p‐type and
n‐type regions; holes and
electrons recombine at
p‐n junction; current flows
+
+ +
+
+
--
-
-p ty-pe
n type
+
+
+
+
+
-
-
-p-type
n-type
+
-14
p‐n junction; current flows.
‐
Reverse bias: carriers
flow away from p‐n junction;
carrier conc. greatly reduced
at junction; little current flow.
+
+
+
+
+
--
-
-p-type
n-type
-
+
26P
‐
N
Rectifying
Junction
27
Light
Emitting
Diode
(LED)
http://electronics.howstuffworks.com/led.htm/printable
http://spie.org/Images/Graphics/Newsroom/Importe Band gap determines
Compare three light bulbs.
Compare three light bulbs.
Conventional incandescent (tungsten filament)
Bulb is hot to the touch, most of the electricity is lost as heat. Short life (few months?)
Compact fluorescent (CFL’s)
Bulb is warm, but not hot, less heat loss Longer life (many months – 2 years)
LED’s
E t l ffi i t littl i f l t i it t h t
Extremely efficient, little or no conversion of electricity to heat.
Very long life – decades. Many LED’s made in the 70’s & 80’s are still working!
29
The
Transistor
•
Invented by Shockley, Bardeen, and
Brattain in 1948. Nobel prize in 1956.
•
A three terminal device that acts like a
simple “on‐off” switch (logic control).
–
The basis of Integrated Circuits (IC)
The basis of Integrated Circuits (IC)
Circa 1948technology
–
Computers, cell phones,
automotive control, etc.
today
•When voltage (potential) is applied
to the “gate”, current flows between
the “source” and the “drain”. On/off
switch –logic switch, go/no go
•
Electrical
conductivity
and
resistivity
are:
‐
material
parameters,
i.e.
properties.
‐
independent of
geometry.
•
Electrical
resistance
is:
SUMMARY
‐
a
geometry
and
material
dependent parameter.
•
Conductors,
semiconductors,
and
insulators...
‐
each
is
different,
depending
on
whether
there
are
accessible
energy
states
for
conducting
electrons.
•
For
metals,
conductivity
is
increased
by
‐
reducing
deformation
reducing imperfections
‐
reducing
imperfections
‐
decreasing
temperature.
•
For
pure
semiconductors,
conductivity
is
increased
by
‐
increasing
temperature
‐
doping
(e.g.,
adding
B
to
Si
(p
‐
type)
or
P
to
Si
(n
‐
type).
Transistors
are
logic
based
devices
31
Metals:
Influence
of
Temperature
and
Impurities
on
Resistivity
• Presence of imperfections increases resistivity
-- grain boundaries
-- dislocations
-- impurity atoms
These act to scatter
electrons so that they
t k
l
di
t
th
-- vacancies
take a less direct path.
• Resistivity
increases with:
3
4
5
6
e
sistivity
,
0
-8Ohm-m)
d%
CW
-- wt% impurity
-- temperature
=
Adapted from Fig. 12.8, Callister & Rethwisch 4e.(Fig. 12.8 adapted from J.O. Linde, Ann. Physik 5, p. 219 (1932); and C.A.
T(°C)
-200
-100
0
1
2
R
e
(1
0
0
-- %
CW
+
deformation i +
impurity t
thermal