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Learning

 

Objectives...

Chapter 12:

Chapter 12:

Electrical Properties

Electrical Properties

•  How are electrical conductance and resistance characterized?

•  What are the physical phenomena that distinguish conductors, semiconductors, 

and insulators?

•  For metals, how is conductivity affected by imperfections, deformation, 

and temperature?

F i d h i d i i ff d b i f i i i i (d i )

•  For semiconductors, how is conductivity affected by imperfections, impurities (doping) and Temperature?

Pages 483-541

Relevant Reading for this Lecture...

1

Ohm's 

Law:

V =   I  R

voltage

 

drop

 

(volts)

resistance

 

(Ohms)

current

 

(amps)

A

V

L

I

A

ELECTRICAL

 

CONDUCTION

I

V

e-A (cross sect. area) L

Cross‐sectional Area

Resistivity,

 

and

 

Conductivity, 

:

these

 

terms

 

are

 

independent

 

of

 

sample

 

geometry

 

or

 

shape

this

 

equation

 

is

 

another

 

form

 

of

 

Ohm's

 

Law

 

(recall

 

normalization

 

with

 



)

RA

Resistance:

R

L

A

L

A

 

I

conductivity

 

(Ohm‐m)

‐1 e e e

q

n

More about this later

resistivity

 

(Ohm

m)

L

(2)

Electrical Properties

• Which will have the greater resistance?

D

R

2

8



2

D

2

D



R

1

D

2













2

D

2





R

2

2

D

2













2

D

2

R

1

8

Chapter 12 - 3

• Analogous to flow of water in a pipe

• Resistance depends on sample geometry and

size.

3

Electrical

 

Conductivity

Electrical

 

Conductivity

:

:

 

 

Comparison

Comparison

(at room temperature!)

• Ceramics

10

-10

Soda lime glass

Material

(Ohm‐m)‐1

• Metals

Silver

6.8 x 10

7

Material

(Ohm‐m)‐1

Alumina (Al

2

O

3

)

10

10

Soda-lime glass

10

-9

Concrete

10

-13

Aluminum

Silver

6.8 x 10

Copper

6.0 x 10

7

Iron

1.0 x 10

7

3.8 x 10

7 conductors

• Semiconductors

Silicon

4.0 x 10

-4

• Polymers

<10

-13

Polystyrene

Silicon

4.0 x 10

Germanium

2.2 x 10

0

GaAs

1.0 x 10

-6 semiconductors

Polyethylene

10

Polystyrene

10

-15

– 10

-17 insulators
(3)

100m

Cu wire- e- I = 2.5A +

EX:

  

CONDUCTIVITY

 

PROBLEM

EX:

  

CONDUCTIVITY

 

PROBLEM

What

 

is

 

the

 

minimum

 

diameter

 

(D)

 

of

 

the

 

Cu

 

wire

 

so

 

that

   

V

 

<

 

1.5V?

V

R

L

V

<

 

1.5V

100m

R

A

I

2.5A

6.07

 

x

 

10

7

   

(Ohm

m)

‐1

D

2

4

Solve

 

to

 

get

 

D

 

>

 

1.88

 

mm

5

Pauli

 

Exclusion

 

Principle

 

gives

 

rise

 

to

 

energy

 

bands

Figure 12.2 in Callister

Quantum Mechanics 

states that no two 

electrons can occupy the 

same state Electrons not  accompanying  h same state http://www.aps.org/p ublications/apsnews/2 00701/images/Wolfga ng_Pauli_1.jpg

Energy‐level diagram for a hypothetical Nɑ4  molecule. The four shared, outer orbital 

electrons are “split” into four slightly different energy levels (the Pauli exclusion principle). the same state

(4)

Metals are good conductors  since their valence band is 

only partially filled.

Adapted from Fig. 12.3,

Callister & Rethwisch 4e.

7 Metal e.g., Cu Metal e.g., Mg Insulator Semiconductor Know this! >2eV <2eV

Adapted from Fig. 12.4,

Callister & Rethwisch 4e.

Ef= Fermi energy.

This is the boundary between the filled and unfilled energy levels. For electrons to conduct, they must move to where there are unfilled energy levels.

(5)

Metals:

‐‐

Thermal

 

energy

 

puts

many

 

electrons

 

into

a higher energy state.

+

-net e- flow

CONDUCTION

 

&

 

ELECTRON

 

TRANSPORT

CONDUCTION

 

&

 

ELECTRON

 

TRANSPORT

e e e

q

n

ne= # of e‐per m3 qe= Charge of e‐ e= e‐mobility

a

 

higher

 

energy

 

state.

net e flow

  

Energy

 

States:

the

 

cases

 

at

 

right

for

 

metals

 

show

 

that

nearby

 

energy

 

states

are

 

accessible

 

by

th

l fl t ti

Energy

filled empty band

s

Energy

partly filled empty band

GAP

‘My level’  – highest  filled state Cu is like this. Mg is like this.

thermal

 

fluctuations

filled band filled valence band

filled state

s

filled band filled valence band

filled states

Fermi

http://www.bayarea.net/~kins/ AboutMe/GIFs/Fermi_2.jpg

Only

 

those

 

e

that

 

can

 

get

 

into

 

the

 

empty

 

energy

 

levels

 

can

 

“conduct”

9

  

Insulators:

Higher

 

energy

 

states

 

are

 

not

accessible

due

 

to

 

band

 

gap.

  

Semiconductors:

Higher

 

energy

 

states

separated

 

by

 

a

 

smaller

 

gap.

ENERGY

 

STATES:

  

INSULATORS

 

AND

 

SEMICONDUCTORS

g p

Energy

filled valence empty band

a

tes

GAP

Energy

filled

valence

empty

band

es

GAP

?

Engineered  material: Gaps  are tunable more to come…

filled

band

band

filled st

a

filled

band

valence

band

filled stat

wide band gap (> 2 eV)

narrow band gap (< 2 eV) 10

(6)

Insulators:

A parallel‐plate capacitor involves an insulator, or dielectric, between 

two metal electrodes. The charge density buildup at the capacitor surface is related to 

the dielectric constant of the material

kE

D

E, Electric field strength (V/m)

A

kE

D

o D, charge 

density (C/m2)

oelectric permittivity in vacuum,  constant, 8.9x10‐12C/(Vm) k, dielectric constant  (material property)

l

constant, 8.9x 0 C/(Vm)

k

o

electric permittivity = C = Q/V→C=A/l

l

A

C

V

Q

C

Capacitance charge

voltage  Note your text uses rfor k

11

Dielectric

 

Constants

 

&

 

Strength

• Ceramics

Titanate ceramics

--

15 – 10,000

Dielectric constant

r

60 Hz      1 MHz

Dielectric strength

(V/mil)*

50 – 300

Soda-lime glass 6.9

Titanate ceramics

15 10,000

Mica --

5.4 – 8.7

Porcelain 6.0

6.0

6.9

• Polymers

2.6

2.6

Polystyrene

500 – 700

40 – 400

250

1000 – 2000

50 300

Polyethylene

2.6 2.6

Polystyrene

2.3 2.3

450 – 500

500 700

* 0.001 in = 1 mil

(7)

•  

Imperfections

 

increase

 

resistivity

grain

 

boundaries

dislocations

impurity

 

atoms

These act to scatter electrons so that they

take a less direct path, thus 



.

METALS:

  

RESISTIVITY

 

VS

 

T,

 

IMPURITIES

vacancies

Cu +

3.3

2 at

%Ni

Cu +

2.16

at%

Ni

defo

rme

d Cu

+ 1.

12 a

t%N

i

2

3

4

5

6

R

esistivity,

0

-8

Ohm-m)

1 12

at%

Ni

Resistivity

)]

(

1

[

rt o

a

T

T

a is temperature coefficient of 

resistivity, ois intrinsic (no impurity)  resistivity

T (°C)

-200 -100

0

d

1

2

R

(1

0

Cu +

1.1

“Pur

e” Cu

•  

Resistivity

increases

 

with:

temperature

wt% impurity

%Cold Work

Adapted from Fig. 18.8, Callister 6e.  (Fig. 18.8 adapted from J.O. Linde, 

Ann. Physik5, p. 219 (1932); and C.A. Wert and R.M. Thomson, Physics of 

Solids, 2nd ed., McGraw‐Hill Book Company, New York, 1970.)

Why????

13

Variation

 

in

 

electrical

 

resistivity

 

with

 

composition

 

for

 

various

 

copper

 

alloys

 

with

 

small

 

levels

 

of

 

elemental

 

additions

 

(at

 

T

 

=

 

20

°

C).

 

i

i

c

Ac

1

A – composition independent constant

c

ii

– concentration of impurities

p

14
(8)

•  Data for Pure Silicon:

increases

 

with

 

T

opposite

 

to

 

metals

Energy empty band GAP ? electrons

PURE

 

SEMICONDUCTORS:

  

CONDUCTIVITY

 

VS

 

T

l t i l d ti it filled band filled valence band filled states can cross gap at higher T

material band gap (eV) electrical conductivity, (Ohm-m)-1 100 101 102 103 104 pure Si Ge GaP CdS 1.11 0.67 2.25 2.40 Adapted from Fig. 19.15, Callister 5e.  (Fig. 19.15 adapted 

from G.L. Pearson and J. Bardeen, Phys. Rev. 75, p. 865, 

1949.)

Selected values from Table 

18.2, Callister 6e. 50 100 1000 10-2 10-1 10 p (undoped) T(K) 15

CONDUCTION

 

IN

 

TERMS

 

OF

 

ELECTRON

 

AND

 

HOLE

 

MIGRATION

Light (shown), heat, 

some input of energy

•  Electrical Conductivity given by:

# holes/m

3 some input of energy

is required to excite 

e‐from valence band 

to conduction band 

leaving a positively 

charged hole behind. Conduction can be either  by negative carriers,  h e

p

q

q

n

# electrons/m

3

electron mobility

#

 

holes/m

3

hole

 

mobility

y g ,

electrons (n‐type) and/or  positive carriers, holes  (p‐type). 

Electrons move towards  (+) potential and holes 

(9)

In class problem

What fraction of the conductivity of intrinsic silicon at room temperature is due to 

(a) electrons and (b) holes?

h e

p

q

q

n

n

e

q

e

e ne= # of e‐per m3 qe= Charge of e‐ From Table 12.3,   =0.736 e= e‐mobility Here n = p From Table 12.3,   = 0.263 17

kT

Eg

o

e

2

Arrhenius equationWhy 2?Produce two 

charge carriers – electron and hole

mx B y T k E e g o T k E o g      1 2 ln ln 1 2

Determining the activation  energy for conduction

(10)

Intrinsic

 

semiconductors:

 

#

 

of

 

thermally

 

generated

 

electrons

 

=

 

#

 

of

 

holes

 

(broken

 

bonds)

Extrinsic semiconductors: Impurities are added to the

INTRINSIC

 

VS

 

EXTRINSIC

 

CONDUCTION

Extrinsic

 

semiconductors:

 

Impurities

 

are

 

added

 

to

 

the

 

semiconductor

 

that

 

contribute

 

additional

 

electrons

 

or

 

holes.

 

Doping

 

=

 

intentional

 

impurities

Si

 

is

 

the

 

primary

 

material

 

in

 

semiconductors

– Large band gap (1.1 eV); allows Si to operate at warmer temperatures (150oC) – Can form a native oxide, SiO2, for insulating barriers (important in fabrication)

Si

 

can

 

be

 

made

 

into

 

large

 

(12

 

inch

 

dia.),

 

high

 

purity,

 

single

 

crystal

 

ingots.

 

Doping

 

of

 

Si

– Si has 4 outer shell electrons (group IV)

– n‐type: Phosphorous, arsenic (group V), donate extra electron – p‐type: boron (group III) for Si

19

n

type

4 valence electrons of As allow it to bond like Si, but the fifth electron is left orbiting As 

site – the energy to release the fifth electron into the CB is small

(11)

p

type

• Boron has only 3 valance electrons. When it substitutes for a Si atoms, one of its bonds 

has a missing electron (hole)

• Hole tunnels around, and can be liberated by thermal vibration of Si atoms, from the B 

site into the VB.

 

p e

h

21 p‐type n‐type ?‐type ?‐type 22
(12)

Arrhenius plot of electrical 

conductivity for an n‐type 

semiconductor over a wide 

temperature range. At low 

temperatures (high 1/T), the 

material is extrinsicAt high 

temperatures (low 1/T), the 

material is intrinsic. In 

between is the exhaustion 

range, in which all “extra 

electrons” have been promoted 

to the Why the 

increase?

Why 2?Produce two charge carriers – electron and hole

to the

why?

23

In class problem

Calculate the conductivity for the saturation range of silica doped with 10‐ppb boron.

The calculated density of B atoms/m3is also the density of electron holes in this

p‐type semiconductor at saturation.   10/109

= 10‐8 Hence solve for n

h d h d f bl ( h d f l amu B n = 10‐8 6.02x10 23atoms B 10.81 g B 2.33x10 6g/mSi = 1.30 x1021 X X Density of Si Hence solve for n

Using this equation σ=nqµhand the data from Table 12.3: (q is the magnitude of electron  charge which equals 0.16 x 10‐18 C)

σ

=

 

nqµ

h
(13)

Compound

 

Semiconductors

Group III‐V and II‐V compounds nominally have 

the Zinc Blend structure and are intrinsic 

the inc lend structure and are intrinsic semiconductors. Can be doped, like Si, to change 

conduction (extrinsic) 

MX Compounds: Group III 3+ valence, Group V 

5+ valence – avg. of 4+ valence per atom // 

Group II 2+ valence, Group VI 6+ valence – avg. 

4+ valence per atom

Applications:

•Solar cells

•Light emitting diodes (occurs with 

electron‐hole recombination)

•Higher operation speeds, etc.

25

•  

Allows

 

flow

 

of

 

electrons

 

in

 

one

 

direction

 

only

(e.g., useful

to convert alternating current to direct current).

  

Results:

+

p-type

n-type

IC

 

DEVICES:

 

P

N

 

RECTIFYING

 

JUNCTION

No applied potential:

no net current flow.

Forward bias:  carriers

flow through p‐type and

n‐type regions; holes and

electrons recombine at

p‐n junction; current flows

+

+ +

+

+

--

-

-p ty-pe

n type

+

+

+

+

+

-

-

-p-type

n-type

+

-14

p‐n junction; current flows.

Reverse bias:  carriers

flow away from p‐n junction;

carrier conc. greatly reduced

at junction; little current flow.

+

+

+

+

+

--

-

-p-type

n-type

-

+

26
(14)

P

N

 

Rectifying

 

Junction

27

Light

 

Emitting

 

Diode

 

(LED)

http://electronics.howstuffworks.com/led.htm/printable

http://spie.org/Images/Graphics/Newsroom/Importe Band gap determines 

(15)

Compare three light bulbs.

Compare three light bulbs.

Conventional incandescent (tungsten filament)

Bulb is hot to the touch, most of the electricity is lost as heat. Short life (few months?)

Compact fluorescent (CFL’s)

Bulb is warm, but not hot, less heat loss Longer life (many months – 2 years)

LED’s

E t l ffi i t littl i f l t i it t h t

Extremely efficient, little or no conversion of electricity to heat.

Very long life – decades. Many LED’s made in the 70’s & 80’s are still working!

29

The

 

Transistor

Invented by Shockley, Bardeen, and 

Brattain in 1948. Nobel prize in 1956.

A three terminal device that acts like a 

simple “on‐off” switch (logic control). 

The basis of Integrated Circuits (IC)

The basis of Integrated Circuits (IC) 

Circa 1948

technology

Computers, cell phones, 

automotive control, etc.

today

•When voltage (potential) is applied 

to the “gate”, current flows between 

the “source” and the “drain”. On/off 

switch –logic switch, go/no go 

(16)

•  

Electrical

 

conductivity

and

 

resistivity

are:

material

 

parameters,

 

i.e.

 

properties.

independent of

 

geometry.

  

Electrical

 

resistance

is:

SUMMARY

a

 

geometry

 

and

 

material

 

dependent parameter.

  

Conductors,

 

semiconductors,

 

and

 

insulators...

each

 

is

 

different,

 

depending

 

on

 

whether

 

there

 

are

 

accessible

 

energy

 

states

 

for

 

conducting

 

electrons.

  

For

 

metals,

 

conductivity

 

is

 

increased

 

by

reducing

 

deformation

reducing imperfections

reducing

 

imperfections

decreasing

 

temperature.

  

For

 

pure

 

semiconductors,

 

conductivity

 

is

 

increased

 

by

increasing

 

temperature

doping

 

(e.g.,

 

adding

 

B

 

to

 

Si

 

(p

type)

 

or

 

P

 

to

 

Si

 

(n

type).

Transistors

 

are

 

logic

 

based

 

devices

31

Metals:

 

Influence

 

of

 

Temperature

 

and

 

Impurities

 

on

 

Resistivity

• Presence of imperfections increases resistivity

-- grain boundaries

-- dislocations

-- impurity atoms

These act to scatter

electrons so that they

t k

l

di

t

th

-- vacancies

take a less direct path.

• Resistivity

increases with:

3

4

5

6

e

sistivity

,

0

-8

Ohm-m)

d

%

CW

-- wt% impurity

-- temperature

=

Adapted from Fig. 12.8, Callister & Rethwisch 4e.(Fig. 12.8 adapted from J.O. Linde, Ann. Physik 5, p. 219 (1932); and C.A.

T(°C)

-200

-100

0

1

2

R

e

(1

0

0

-- %

CW

+

deformationi +

impurity t

thermal

References

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