AUIRFIZ44N
HEXFET ® Power MOSFET
PD - 97767
AUTOMOTIVE GRADE
TO-220AB Full-Pak AUIRFIZ44N
G D S
Gate Drain Source
D S G
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (T
A) is 25°C, unless otherwise specified.
Parameter Units
I
D@ T
C= 25°C Continuous Drain Current, V
GS@ 10V
I
D@ T
C= 100°C Continuous Drain Current, V
GS@ 10V A
I
DMPulsed Drain Current ch
P
D@T
C= 25°C Power Dissipation W
Linear Derating Factor W/°C
V
GSGate-to-Source Voltage V
E
ASSingle Pulse Avalanche Energy (Thermally Limited)dh mJ
I
ARAvalanche Current ch A
E
ARRepetitive Avalanche Energy c mJ
dv/dt Peak Diode Recovery dv/dt eh V/ns
T
JOperating Junction and
T
STGStorage Temperature Range °C
Soldering Temperature, for 10 seconds (1.6mm from case ) Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Parameter Typ. Max. Units
R
JCJunction-to-Case i ––– 3.3 °C/W
R
JAJunction-to-Ambient ––– 65
-55 to + 175
300 10 lbfyin (1.1Nym)
45 0.3 ± 20 Max.
31 22 160
5.0 4.5 210 25
HEXFET
®is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
Description
Specifically designed for Automotive applications, this cellular design of HEXFET® Power MOSFETs utilizes the latest processing techniques to achieve low on-resistance per silicon area. This benefit combined with the fast switching speed and rugge- dized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in Automotive and a wide variety of other applications.
Features
l
Advanced Planar Technology
l
Low On-Resistance
l
Isolated Package
l
High Voltage Isolation = 2.5KVRMS
l
Sink to Lead Creepage Distantce = 4.8mm
l
175°C Operating Temperature
l
Fully Avalanche Rated
l
Lead-Free, RoHS Compliant
l
Automotive Qualified*
V
(BR)DSS55V
R
DS(on)max. 24m
I
D31A
AUIRFIZ44N
Notes:
Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 )
V
DD= 25V, starting T
J= 25°C, L = 470µH R
G= 25, I
AS= 25A. (See Figure 12)
I
SD 25A, di/dt 320A/µs, V
DD V
(BR)DSS, T
J 175°C.
Pulse width 300µs; duty cycle 2%.
t=60s, =60Hz
Uses IRFZ44N data and test conditions.
R
is measured at Tj at approximately 90°C.
S D
G
S D
G
Static Electrical Characteristics @ T
J= 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units
V
(BR)DSSDrain-to-Source Breakdown Voltage 55 ––– ––– V
V
(BR)DSS/T
JBreakdown Voltage Temp. Coefficient ––– 0.055 ––– V/°C
R
DS(on)Static Drain-to-Source On-Resistance ––– ––– 24 m
V
GS(th)Gate Threshold Voltage 2.0 ––– 4.0 V
gfs Forward Transconductance 17 ––– ––– S
I
DSSDrain-to-Source Leakage Current ––– ––– 25 μA ––– ––– 250 I
GSSGate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
Dynamic Electrical Characteristics @ T
J= 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units
Q
gTotal Gate Charge ––– ––– 65
Q
gsGate-to-Source Charge ––– ––– 12 nC
Q
gdGate-to-Drain ("Miller") Charge ––– ––– 27
t
d(on)Turn-On Delay Time ––– 7.3 –––
t
rRise Time ––– 69 –––
t
d(off)Turn-Off Delay Time ––– 47 ––– ns
t
fFall Time ––– 60 –––
L
DInternal Drain Inductance ––– 4.5 ––– Between lead,
nH 6mm (0.25in.)
L
SInternal Source Inductance ––– 7.5 ––– from package
and center of die contact
C
issInput Capacitance ––– 1300 –––
C
ossOutput Capacitance ––– 410 ––– pF
C
rssReverse Transfer Capacitance ––– 510 –––
C Drain to Sink Capacitance ––– 12 –––
Diode Characteristics
Parameter Min. Typ. Max. Units
I
SContinuous Source Current ––– ––– 31
(Body Diode) A
I
SMPulsed Source Current ––– ––– 160
(Body Diode)c
V
SDDiode Forward Voltage ––– ––– 1.3 V
t
rrReverse Recovery Time ––– 65 98 ns
Q
rrReverse Recovery Charge ––– 160 240 nC
t
onForward Turn-On Time
Intrins ic turn-on time is negligible (turn-on is dominated by LS+LD)ƒ = 1.0MHz, See Fig. 5 h V
GS= 20V
V
GS= -20V
MOSFET symbol showing the integral reverse p-n junction diode.
V
DS= 25V, I
D= 25A h
I
D= 25A V
DS= 44V
Conditions R
D= 1.1, See Fig. 10 fh
V
GS= 0V
T
J= 25°C, I
S= 17A, V
GS= 0V f T
J= 25°C, I
F= 25A
di/dt = 100A/μs f Conditions V
GS= 0V, I
D= 250μA
Reference to 25°C, I
D= 1mA h V
GS= 10V, I
D= 17A f V
DS= V
GS, I
D= 250μA
V
DS= 55V, V
GS= 0V
V
DS= 44V, V
GS= 0V, T
J= 150°C
ƒ = 1.0MHz
Conditions
V
GS= 10V, See Fig. 6&13 fh V
DD= 28V
I
D= 25A R
G= 12
V
DS= 25V
AUIRFIZ44N
Qualification standards can be found at International Rectifiers web site: http//www.irf.com/
Highest passing voltage.
Qualification Information
†TO-220 Fullpak N/A
RoHS Compliant
Yes
ESD
Machine Model Class M2 (+/- 200V)
††AEC-Q101-002
Human Body Model Class H1B (+/- 1000V)
††AEC-Q101-001
Qualification LevelAutomotive (per AEC-Q101)
Comments: This part number(s) passed Automotive qualification.
IR’s Industrial and Consumer qualification level is granted by extension of the higher Automotive level.
Charged Device Model Class C5 (+/- 2000V)
††AEC-Q101-005
Moisture Sensitivity LevelAUIRFIZ44N
Fig 4. Normalized On-Resistance Vs. Temperature
Fig 2. Typical Output Characteristics Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1 10 100 1000
0.1 1 10 100
I , D rai n- to -S ou rc e C ur re nt ( A ) D
V , Drain-to-Source Voltage (V) DS
VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V
20μs PULSE WIDTH
T = 25°CC A
4.5V
1 10 100 1000
0.1 1 10 100
I , D ra in -to -S ou rc e C ur re nt (A ) D
V , Drain-to-Source Voltage (V) DS
VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V
A 4.5V
20μs PULSE WIDTH T = 175°CC
1 10 100 1000
4 5 6 7 8 9 10
T = 25°CJ
V , Gate-to-Source Voltage (V)
GSD
I , Dra in -t o -So ur ce Cu rre nt (A)
A V = 25V
20μs PULSE WIDTHDS T = 175°CJ
0.0 0.5 1.0 1.5 2.0 2.5
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
T , Junction Temperature (°C)
JR , D ra in -to -S ou rc e O n R es is ta nc e
DS(on)(N or m al iz ed )
V = 10VGS A I = 41AD
T
JT
JAUIRFIZ44N
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 8. Maximum Safe Operating Area Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
Fig 7. Typical Source-Drain Diode Forward Voltage
0 500 1000 1500 2000 2500
1 10 100
C , Ca pa ci ta nc e ( pF)
V , Drain-to-Source Voltage (V)
DS A V = 0V, f = 1MHzC = C + C , C SHORTED C = C
C = C + C GS
iss gs gd ds rss gd
oss ds gd
C
issC
ossC
rss0 4 8 12 16 20
0 10 20 30 40 50 60 70
Q , Total Gate Charge (nC)
GV , G ate -to -S ou rc e V ol ta ge (V )
GSA FOR TEST CIRCUIT SEE FIGURE 13 V = 44V
V = 28VDSDS I = 25AD
1 10 100 1000
0.5 1.0 1.5 2.0 2.5 3.0
T = 25°CJ
V = 0VGS
V , Source-to-Drain Voltage (V)
I , R ev ers e D ra in C urre nt (A )
SD
SD
A T = 175°CJ
1 10 100 1000
1 10 100
V , Drain-to-Source Voltage (V)
DSI , D ra in C u rr ent ( A )
OPERATION IN THIS AREA LIMITED BY R
D
DS(on)
10μs
100μs
1ms
10ms
A T = 25°C
T = 175°C Single Pulse
C J
AUIRFIZ44N
Fig 10a. Switching Time Test Circuit
VDS 90%
10%
VGS
td(on) tr td(off) tf
Fig 10b. Switching Time Waveforms
V
DSPulse Width µs Duty Factor
R
DV
GSR
GD.U.T.
10V
+-
V
DDFig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig 9. Maximum Drain Current Vs.
Case Temperature
25 50 75 100 125 150 175
0 5 10 15 20 25 30 35
T , Case Temperature ( C)
I , Drain Current (A)
C
°
D
0.01 0.1 1 10
0.00001 0.0001 0.001 0.01 0.1 1
Notes:
1. Duty factor D = t / t 2. Peak T = P x Z + T
1 2
J DM thJC C
P
t t DM
1 2
t , Rectangular Pulse Duration (sec)
Ther m al Response (Z )
1
th JC
0.01 0.02 0.05 0.10 0.20 D = 0.50
SINGLE PULSE (THERMAL RESPONSE)
AUIRFIZ44N
D.U.T. VDS
ID IG
3mA VGS
.3F 50K
12V .2F
Current Regulator Same Type as D.U.T.
Current Sampling Resistors
+ - 0
100 200 300 400 500
25 50 75 100 125 150 175
J
E , S in gle P ul se A va la nc he E ne rg y (m J)
ASI TOP 10A 18A BOTTOM 25A
A
Starting T , Junction Temperature (°C)
V = 25VD
DD
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
Fig 13b. Gate Charge Test Circuit Fig 12a. Unclamped Inductive Test Circuit
Fig 12b. Unclamped Inductive Waveforms
VDS L
D.U.T.
VDD
IAS
tp 0.01
RG +
-
t p
V DS
I AS
V DD V (BR)DSS
10 V
Q G Q GS Q GD V G
Charge
10 V
Fig 13a. Basic Gate Charge Waveform
AUIRFIZ44N
P.W. Period
di/dt Diode Recovery
dv/dt
Ripple 5%
Body Diode Forward Drop Re-Applied
Voltage Reverse Recovery
Current Body Diode Forward
Current
VGS=10V
VDD
ISD Driver Gate Drive
D.U.T. ISDWaveform
D.U.T. VDSWaveform
Inductor Curent
D = P.W.
Period