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M i c r o c o n t r o l l e r

E v a l u a t i o n B o a r d

For XMC1000 Family

B

oard User‘s Manual

Revision 1.0, 2014-02-20

X M C 2 G o K i t w i t h X M C 1 1 0 0

Kit Version 1.0

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Edition 2014-02-20 Published by

Infineon Technologies AG 81726 Munich, Germany

© 2014 Infineon Technologies AG All Rights Reserved.

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all

warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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Template: IFX_Template_2011-02-24.dot

Revision History

Page or Item Subjects (major changes since previous revision)

Revision 1.0, 2014-02-20

Initial release

Trademarks of Infineon Technologies AG

AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.

Other Trademarks

Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.

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Table of Contents

Board Users Manual 4 Revision 1.0, 2014-02-20

Table of Contents

Introduction ... 7 1 Overview ... 7 1.1 Key Features ... 7 1.2 Block Diagram ... 8 2 Hardware Description ... 9 2.1 Power Supply ... 9

2.2 Pin Header Connector ... 10

2.3 User LEDs ... 10

2.4 Debugging and UART Communication ... 11

3 Production Data... 11

3.1 Schematics ... 11

3.2 Components Placement and Geometry ... 13

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List of Figures

Board Users Manual 5 Revision 1.0, 2014-02-20

List of Figures

Figure 1 Block Diagram of the XMC 2Go Kit ... 8

Figure 2 XMC 2Go Kit with XMC1100 ... 9

Figure 3 Pinning of Pin Header ... 10

Figure 4 Recommended Installation Options for the J-Link driver ... 11

Figure 5 Schematic of the XMC 2Go Kit with XMC1100 ... 12

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List of Tables

Board Users Manual 6 Revision 1.0, 2014-02-20

List of Tables

Table 1 Features of the XMC 2Go Kit with XMC1100 ... 7

Table 2 Pins used for the User LEDs ... 10

Table 3 XMC1100 Pins used for Debugging and UART Communication ... 11

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Overview

Board Users Manual 7 Revision 1.0, 2014-02-20

Introduction

This document describes the features and hardware details of the XMC 2Go equipped with the ARM® Cortex™-M0 based XMC1100 Microcontroller from Infineon Technologies AG.

1

Overview

The XMC 2Go is designed to evaluate the capabilities of the XMC1100 Microcontroller and the powerful, free of charge tool chain DAVE™.

This board is not cost optimized and does not serve as a reference design.

1.1

Key Features

Table 1 summarizes the features of the XMC 2Go.

Table 1 Features of the XMC 2Go Kit with XMC1100

Topic Features

Processor XMC1100 microcontroller (ARM® Cortex™-M0 based) in a 4 x 4 mm VQFN-24 package

Flash 64 kB

RAM 16 kB

Clock Generation Internal Oscillator

Frequencies 32 MHz CPU clock, 64 MHz Timer clock

Dimensions 14.0 x 38.5 mm

Power Supply  from USB via Debug probe (J-Link) or

 3.3V external power

Connectors Two 8-pin header (pin pitch: 2.54 mm ≙ 0.1” / between rows: 10.16 mm ≙ 0.4”) Pin header fits to breadboard

Debugger On-Board J-Link Debugger supports

 Serial Wire Debug (SWD, ARM Standard)

 Single Pin Debug (SPD)

 UART-to-USB bridge (virtual COM) Peripherals Mapped to pin header X1/X2:

 2 Channel USIC (UART, SPI, I2C, I2S, LIN)

 6 Channel Analog to Digital Converter (12-Bit resolution)

 4 x 16-Bit Timer

 External Interrupts (via ERU) Others:

 Real Time Clock

 Random Number Generator

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Overview

Board Users Manual 8 Revision 1.0, 2014-02-20

1.2

Block Diagram

The block diagram in Figure 1 shows the main components of the XMC 2Go Kit including the power supply concept. There are following main building blocks:

 XMC1100 Microcontroller in a 4x4mm VQFN24 package

 On-board USB debugger realized with a XMC4200 Microcontroller for serial wire debug (SWD) and UART-to-USB Bridge

 Two 8 pin header X1 and X2

 On-board power generation for power supply of the XMC1100 Microcontroller and the debug IC

 2 User LEDs

Figure 1 Block Diagram of the XMC 2Go Kit

XMC1100 VQFN24 32MHz Cortex M0 64kB Flash, 16kB RAM 4 x16-bit timer, 6 Ch 12-bit ADC 2 Ch USIC (UART, SPI, I2C, I2S, LIN)

USIC EVR

LED2

ADC, CCU4, USIC, ERU0

ADC, CCU4, USIC, ERU0

XMC4200 Debug IC Micro USB Voltage Regulator +5V +3.3V BSL 8-Pin Header X1 P2.7/P2.8, P2.9, P2.10, P2.11, P0.0, P0.5 8-Pin Header X2 P0.6-P0.9, P0.14, P0.15, P2.0, P2.6 XMC 2Go-V1 Kit XMC1100 in VQFN24 LED1 Debug LED Block_Diag.emf SWD UART Debug, USIC P1.1 P1.0 GPIO P2.1 P2.2 P1.2 P1.3 +3.3V X1 X101 X2

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Hardware Description

Board Users Manual 9 Revision 1.0, 2014-02-20

2

Hardware Description

The following sections give a detailed description of the board hardware and how it can be used. Figure 2 shows the components of the XMC 2Go Kit with XMC1100.

Figure 2 XMC 2Go Kit with XMC1100

2.1

Power Supply

The XMC 2Go Kit must be supplied by an external 5 Volt DC power supply connected to the Micro UBS plugs (X101). Out of the box with the pre-programmed application and the on-board debugger in operation the XMC 2Go typically draws about 75 mA. This current can be delivered via the USB plug of a PC, which is specified to deliver up to 500 mA. The Power&Debug LED indicates the presence of the generated 3.3V supply voltage. An on-board reverse current protection diode will ensure safe operation and protects the USB port of the Laptop/PC in case power is provided through the pin header X1.

If the board is powered via the USB plug, it’s not recommended to apply an additional power supply to the VDD pin of X1 (3.3V), because this power supply could drive against the on-board power supply. The VDD pin can be used to power an external circuit. But care must be taken not to draw more current than 150 mA, which is the maximum current the on-board voltage regulator can deliver.

After power-up the Debug LED starts blinking. In case there is a connection to a PC via the Debug USB plug X101 and the USB Debug Device drivers are installed on this PC, the Debug LED will turn from blinking to constant illumination.

Voltage Regulator & Reverse Current Protection Diode

Micro USB XMC1100 Microcontroller User LED1 @ P1.0 User LED2 @ P1.1 Pin Header X2 Pin Header X1

Power & Debug LED

P in H e a d e r d is ta n c e f it s to B re a d b o a rd ESD Protection Diode Crystal for Debug IC

XMC4200 Debug IC and UART to USB Bridge

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Hardware Description

Board Users Manual 10 Revision 1.0, 2014-02-20

2.2

Pin Header Connector

The pin headers X1 and X2 can be used to extend the evaluation board or to perform measurements on the XMC1100. The order of pins available at X1 and X2 corresponds to the pinning schema of the XMC1100 Microcontroller in the TSSOP-16 pin package. The pinning table is also printed onto the bottom side of the PCB.

Figure 3 Pinning of Pin Header

2.3

User LEDs

The port pins P1.0 and P1.2 of the XMC1100 on the XMC 2Go Kit are connected to LEDs exclusively.

Table 2 Pins used for the User LEDs

LED Port Pin

LED1 P1.1 LED2 P1.0

P

0.6

P

0.7

P

0.8

P

0.9

P

0.1

4

P

0.1

5

P

2.0

P

2.6

Pin_Header.emf

P

0.

5

P

0.

0

3.

3V

G

N

D

P

2.

11

P

2.

10

P

2.

9

P

2.

7

X

1

X

2

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Production Data

Board Users Manual 11 Revision 1.0, 2014-02-20

2.4

Debugging and UART Communication

The on-board debugger supports 2-pin Serial Wire Debug (SWD), Single Pin Debug (SPD) and UART communication. Both require the installation of Segger’s J-Link Driver which is part of the DAVE™ installation. DAVE™ is a high-productivity development platform for the XMC microcontroller families to simplify and shorten SW development. It can be downloaded at www.infineon.com/dave. The latest Segger J-Link Driver can be downloaded at http://www.segger.com/jlink-software.html.

During installation of the J-Link driver you will be asked for the installation of optional components. For support of the UART communication take care to install the CDC USB driver (Composite Device Class). Therefore select the option “Install USB Driver for J-Link-OB with CDC” as shown in Figure 4.

Figure 4 Recommended Installation Options for the J-Link driver

The XMC1100 on the XMC 2Go Kit is configured to SWD1 mode. Use the “BMI Get Set” tool integrated into DAVE™ to configure the XMC1100 to e.g. SPD1 mode if required. Take care: Unintended use of the “BMI Get Set” tool can cause the XMC 2Go Kit not to work anymore, e.g. when configuring the XMC1100 to SWD0, SPD0 mode or to productive user mode.

Note: Do not configure the XMC1100 on the XMC 2Go Kit to SWD0, SPD0 or to productive user mode.

Table 3 shows the pin assignment of the XMC1100-VQFN24 used for debugging and UART communication.

Table 3 XMC1100 Pins used for Debugging and UART Communication

Pin Function Input / Output Port Pin

Data pin for Debugging via SWD/SPD I/O P1.3

Clock pin for Debugging via SWD O P1.2

Transmit Pin for UART Communication O P2.1

Receive Pin for UART Communication I P2.2

3

Production Data

3.1

Schematics

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Production Data

Board Users Manual 12 Revision 1.0, 2014-02-20

Figure 5 Schematic of the XMC 2Go Kit with XMC1100

Power Supply : 200-299 Debugging Device : 100-199 Target Device : 1-99

For further information and software examples please visit www.infineon.com/xmc-dev

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TSSOP-16 Pinout +3V3 +3V3 +3V3 +3V3 +3V3 +3V3 100nF/0402 100nF/0402 100nF/0402 100nF/0402 100nF/0402 100nF/0402 100nF/0402 100nF/0402 10uF/0603 4,7uF/0603 15pF/0402 15pF/0402 100nF/0402 10uF/0603 BAS3010A-03W ESD8V0L2B-03L GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND XMC1100_VQFN24 XMC4200_QFN48 IFX54211 MBV33 LED RT/0603 LED RT/0603 LED GN/0603 +5V +5V 680R/0402 680R/0402 680R/0402 100R/0402 100R/0402 100R/0402 33R/0402 33R/0402 1M/0402 510R/0402 10k/0402 PINHD 1x5 0,05" TH PINHD 8x1 0,1" TH PINHD 8x1 0,1" TH ZX62-AB-5PA +3V3 DBG_RESET DBG_TCK DBG_TMS DEBUG_LED# GND P0.0 P0.0 P0.5 P0.5 P0.6 P0.6 P0.7 P0.7 P0.8 P0.8 P0.9 P0.9 P0.12 P0.13 P0.14 P0.14 P0.15 P0.15 P1.0/LED1 P1.0/LED1 P1.1/LED2 P1.1/LED2 P1.2/SWCLK P1.2/SWCLK P1.3/SWD P1.3/SWD P2.0 P2.0 P2.6 P2.6 P2.7/P2.8 P2.7/P2.8 P2.9 P2.9 P2.10 P2.10 P2.11 P2.11 RX_XMC4200 RX_XMC4200 SWCLK SWCLK TX_XMC4200 TX_XMC4200 C1 C2 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C201 C202 A C D101 1 2 3 D102 EXP EXP P0.0 15 P0.5 16 P0.6 17 P0.7 18 P0.8 19 P0.9 20 P0.12 21 P0.13 22 P0.14 23 P0.15 24 P1.0 14 P1.1 13 P1.2 12 P1.3 11 P2.0 1 P2.1 2 P2.2 3 P2.6 4 P2.8 5 P2.9 6 P2.10 7 P2.11 8 VDD 10 VSS 9 IC1 HIB_IO_0 7 P0.0 2 P0.1 1 P0.2 48 P0.3 47 P0.4 46 P0.5 45 P0.6 44 P0.7 43 P0.8 42 P1.0 40 P1.1 39 P1.2 38 P1.3 37 P1.4 36 P1.5 35 P2.0 26 P2.1 25 P2.2 24 P2.3 23 P2.4 22 P2.5 21 P14.0 16 P14.3 15 P14.4 14 P14.5 13 P14.6 12 P14.7 11 P14.8 20 P14.9 19 PORST# 32 RTC_XTAL_1 8 RTC_XTAL_2 9 TCK 34 TMS 33 USB_D+ 4 USB_D-3 VAGND 17 VAREF 18 VBAT 10 VDDC 6 VDDC1 31 VDDP 5 VDDP1 28 VDDP2 41 VSS 27 XTAL1 29 XTAL2 30 IC101 EN 4 GND1 2 GND2 5 IN 1 OUT 3 IC201 LED1 LED2 LED101 P1 P2 Q101 R1 R2 R101 R102 R103 R104 R105 R106 R107 R108 R109 1 2 3 4 5 SV1 X1 X2 1 2 3 4 5 X101C X101S D1 D2 Supply USB Supply Analog Digital Hibernate/RTC A B C D E 1 2 3 4 5 6 7 8 A B C D E 1 2 3 4 5 6 7 8 XMC_2Go-V1 13.02.2014 15:43:12 1/1 Sheet:

Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

XMC 2Go-V1 Kit

On-board Debugger including a UART to USB Bridge

Configure wiggler-P0.5 as USIC_Tx but only active while X-spy function is selected Configure wiggler-P0.4 as USIC_Rx but only active while X-spy function is selected

SCLKOUT-P1.1

DX0B-P1.4

SPI Slave

SWD_OUT SWCLK MOSI CLK_OUT

MISO CS_OUT CS_IN CLK_IN

SPI Master

U0C0 DOUT0-P1.5 SELO0-P1.0 U0C1 DX2A-P2.3 DX1A-P2.4

RXD TXD UART2 (DM2) RXD TXD DX0A-P0.4 DOUT0-P0.5 U1C0 TXACTIVE# GPIO-P0.6 RESET# GPIO-P0.3 DEBUG_LED# DEBUG_LED# GPIO-P0.2 TX_ENABLE GPIO-P0.7 SWD DIR GPIO-P1.3 SWD_IN ADC AIN P14.9 PULL Select GPIO-P0.8 AUX_LED# GPIO-P0.1 UART SPD No RESET Pin Level Shifter

COM LED SWV JTAG

Power Supply

Debug Connection Concept

LEDs

PinHeader XMC1100 Target Device (XMC1100)

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Production Data

Board Users Manual 13 Revision 1.0, 2014-02-20

3.2

Components Placement and Geometry

Figure 6 Components Placement and Geometry

14.0 mm

38.5 mm

C1 C2 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C201 C202 D101 D102 IC1 IC101 IC201 LED1 LED2 LED101 P1 P2 Q101 R1 R2 R101 R102 R103 R104 R105 R106 R107 R108 R109 X101

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Production Data

Board Users Manual 14 Revision 1.0, 2014-02-20

3.3

List of Material

The list of material is valid for the XMC 2Go Kit with XMC1100 Version 1.

Table 4 List of Material

No. Qty Value Device Reference Designator

1

9

100nF 50V 0402 10% X5R CER

Capacitor

C1 C2 C101 C102 C103

C104 C105 C106 C201

2

2

15pF 50V 0402 10% COG CER

Capacitor

C109 C110

3

2

10uF 10V 0603 10% X5R CER

Capacitor

C107 C202

4

1

4.7uF 10V 0603 10% X7R CER

Capacitor

C108

5

1

NX3225SA 12MHZ AT-W 3.2X2.5

Crystal, NDK

Q101

6

3

100R 0402 1%

Resistor

R102 R103 R104

7

1

10k 0402 1%

Resistor

R109

8

1

1M 0402 1%

Resistor

R107

9

2

33R 0402 1%

Resistor

R105 R106

10

1

510R 0402 1%

Resistor

R108

11

3

680R 0402 1%

Resistor

R1 R2 R101

12

2

LED RT 0603 D 110mcd LSQ976-Z

LED red

LED1 LED2

13

1

LED GN 0603 D 110mcd LGQ971-Z

LED green

LED101

14

1

ZX62-AB-5PA

Connector, Micro-USB, Hirose

X101

15

1

IFX54211 MBV33 SCT595

Linear Voltage Regulator, Vout =

3.3V, Infineon

IC201

16

1

XMC1100_VQFN24

Microcontroller, XMC1100, Cortex

M0, Infineon

IC1

17

1

XMC4200_QFN48

Microcontroller, XMC4200, Cortex

M4F, Infineon

IC101

18

1

BAS3010A-03W SOD323-R

Diode, Infineon

D101

19

1

ESD8V0L2B-03L TSLP-3-1

TVS Diode, Infineon

D102

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w w w . i n f i n e o n . c o m

References

Related documents

With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies

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Simplify deferring revenues or distributing expenses with the ability to make entries for future periods within General Ledger, Receivables Management, Payables Management,

With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies

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With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby