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Preliminary GTRA360502M

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Preliminary Data Sheets describe products that are being considered by Wolfspeed for development and market introduction. The target performance shown in Preliminary Data Sheets is not final and should not be used for any design activity. Please contact Wolfspeed about the future availability of these products.

Features

• GaN on SiC HEMT technology • Asymmetric Doherty design

- Main: P1dB = 20 W Typ - Peak: P1dB = 37 W Typ

• Typical pulsed CW performance, 3500 MHz, 48 V - Output power at P3dB = 50 W

- Gain = 15 dB - Efficiency = 55% • Low thermal resistance

Description

The GTRA360502M is a 50-watt (P3dB) GaN on Sic high electron mobility transistor (HEMT) for use in multi-standard cellular power amplifier applications. It features input matching, high efficiency, and a thermally-enhanced, overmold package.

Target RF Characteristics

Single-carrier WCDMA Specifications

(tested in Wolfspeed test fixture)

VDD = 48 V, IDQ = 26 mA, POUT = 7 W avg, VGS(PEAK) = VGS @ IDQ = 43 mA – 2.5 V, ƒ = 3600 MHz, 3GPP, channel bandwidth = 3.84 MHz, peak/average = 10 dB @ 0.01% CCDF

Characteristic

Symbol Min Typ Max Unit

Gain Gps — 15 — dB

Drain Efficiency

h

D — 55 — %

Adjacent Channel Power Ratio ACPR — –22 — dBc

GTRA360502M

Package: PG-DFN-6.5x7-1

Thermally-Enhanced High Power RF GaN on SiC HEMT

50 W, 48 V, 3400 – 3800 MHz

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®

Rev. 01, 2020-07-16 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com

Rev. 01, 2020-07-16 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com

DC Characteristics

Characteristic

Conditions

Symbol Min Typ Max Unit

Drain-source Breakdown Voltage (main) VGS = –8 V, ID = 0.36 mA V(BR)DSS 150 — — V (peak) VGS = –8 V, ID = 0.60 mA V(BR)DSS 150 — — V

Drain-source Leakage Current VGS = –8 V, VDS = 10 V IDSS — — 5 mA

Gate Threshold Voltage (main) VDS = 10 V, ID = 26 mA VGS(th) — –3 — V (peak) VDS = 10 V, ID = 43 mA VGS(th) — –3 — V

Recommended Operating Conditions

Parameter

Conditions

Symbol Min Typ Max Unit

Operating Voltage VDD 0 — 50 V

Gate Quiescent Voltage VDS = 48 V, ID = TBD mA VGS(Q) — TBD — V

Absolute Maximum Ratings

Parameter

Symbol Value

Unit

Drain-source Voltage VDSS 125 V

Gate-source Voltage VGS –10 to +2 V

Operating Voltage VDD 55 V

Gate Current (main) IG 2.5 mA

(peak) IG 4.3 mA

Drain Current (main) ID 0.97 A

(peak) ID 1.6 A

Junction Temperature TJ 225 °C

Storage Temperature Range TSTG –65 to +150 °C

Operation above the maximum values listed here may cause permanent damage. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the component. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For reliable continuous operation, the device should be operated within the operating voltage range (VDD) specified above.

Thermal Chracteristics

Thermal resistance, junction to case (TFLANGE = 70°C)

Parameter

Symbol

Value

Unit

Thermal Resistance Main: XXX W CW , 48 V, IDQ = XXX mA, XXXX MHz RqJC TBD °C/W

Peak: XXX W CW , 48 V, IDQ = XXX mA, XXXX MHz RqJC TBD °C/W

Moisture Sensitivity Level

Level

Test Signal

Package Temperature

Unit

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®

Ordering Information

Type and Version

Order Code

Package

Shipping

GTRA360502M V1 (TBD) TBD PG-DFN-6.5x7-1, overmold TBD

Pinout Diagram

(bottom view)

Pin Description

1 VGS/ RFIN (Main)

2 N/C*

3 VGS/ RFIN (Peak) 4 VDS/ RFOUT (Peak) 5 N/C*

6 VDS/ RFOUT (Main)

S Ground (package, bottom metallization)

* It is recommended that all pins labelled "NC" be connected to ground

4 5 6

3 2 1 S

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®

Rev. 01, 2020-07-16 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com

Rev. 01, 2020-07-16 4600 Silicon Drive | Durham, NC 27703 | www.wolfspeed.com

Package Outline Specifications

Package PG-DFN-6.5x7-1

Diagram Notes—unless otherwise specified:

1. Interpret dimensions and tolerances per ASME Y14.5M-1994. 2. Package dimensions: 7.00mm X 6.50mm X 0.90mm

3. Primary dimensions are mm; alternate dimensions are inches 4. Pins: see Pinout Diagram previous page

5. Gold plating thickness: 0.125 – 0.350 micron [5 – 14 microinch] 6. Coplanarity applies to the terminals and all other bottom surface

metallization

TOP VIEW

BOTTOM VIEW

SIDE VIEW

3.60±0.10 [.142±.004]

6X 0.02+0.03-0.02

[.001+.001-.001] SPH

7.00 [.276] 6.50 [.256] 6X 0.90±0.10 [.035±.004] INDEX MARKING S A$C46D902E1.DWG_pg-dfn-6.5x7-1_PO_4-22-20_bn 4X 1.60 [.063] 5.31±0.10 [.209±.004] 6X 1.00±0.10 [.039±.004] 6X 0.80±0.05 [.031±.002] B A 0.05 C 0.05 0.05 C 0.05 C 0.10 C 0.08 C C

0.10 C A B 0.05 C

3 2 1

4 5 6

INDEX MARKING RIGHT VIEW 6. 0.40 [.016] 0.40 [.016] C

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Revision History

Revision Date Data Sheet Type Page Subjects (major changes since last revision)

01 2020-07-16 Preliminary All Data Sheet reflects preliminary specification for product development

For more information, please contact:

4600 Silicon Drive

Durham, North Carolina, USA 27703

www.wolfspeed.com/rf

Sales Contact

[email protected]

Notes & Disclaimer

Specifications are subject to change without notice. “Typical” parameters are the average values expected by Cree

in large quantities and are provided for information purposes only. Cree products are not warranted or authorized

for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where

a failure would reasonably be expected to cause severe personal injury or death. No responsibility is assumed by

Cree for any infringement of patents or other rights of third parties which may result from use of the information

References

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