description/ordering information

SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

1

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D

Meets or Exceeds TIA/EIA-232-F and ITU

Recommendation V.28

D

Operates From a Single 5-V Power Supply

With 1.0-

m

F Charge-Pump Capacitors

D

Operates Up To 120 kbit/s

D

Two Drivers and Two Receivers

D

±

30-V Input Levels

D

Low Supply Current . . . 8 mA Typical

D

ESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

D

Upgrade With Improved ESD (15-kV HBM)

and 0.1-

m

F Charge-Pump Capacitors is

Available With the MAX202

D

Applications

− TIA/EIA-232-F, Battery-Powered Systems,

Terminals, Modems, and Computers

description/ordering information

The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F

voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.

These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept

±

30-V inputs.

Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and

voltage-generator functions are available as cells in the Texas Instruments LinASIC



library.

ORDERING INFORMATION

TA PACKAGE† ORDERABLE

PART NUMBER

TOP-SIDE MARKING

PDIP (N) Tube of 25 MAX232N MAX232N

SOIC (D) Tube of 40 MAX232D MAX232

0°C to 70°C

SOIC (D)

Reel of 2500 MAX232DR MAX232

0_°C to 70_°C

SOIC (DW) Tube of 40 MAX232DW MAX232

SOIC (DW)

Reel of 2000 MAX232DWR MAX232

SOP (NS) Reel of 2000 MAX232NSR MAX232

PDIP (N) Tube of 25 MAX232IN MAX232IN

SOIC (D) Tube of 40 MAX232ID MAX232I

−40°C to 85°C SOIC (D) Reel of 2500 MAX232IDR MAX232I −40 C to 85 C

SOIC (DW) Tube of 40 MAX232IDW MAX232I

SOIC (DW)

Reel of 2000 MAX232IDWR MAX232I

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Copyright  2004, Texas Instruments Incorporated !"# $"%&! '#(

'"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##(

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

LinASIC is a trademark of Texas Instruments.

1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 C1+ V_S+ C1− C2+ C2− V_S− T2OUT R2IN V_CC GND T1OUT R1IN R1OUT T1IN T2IN R2OUT MAX232 . . . D, DW, N, OR NS PACKAGE MAX232I . . . D, DW, OR N PACKAGE (TOP VIEW)

2 POST OFFICE BOX 655303

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Function Tables

H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L

H = high level, L = low level

logic diagram (positive logic)

T1IN T1OUT R1IN R1OUT T2IN T2OUT R2IN R2OUT 11 10 12 9 14 7 13 8

SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

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absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

†

Input supply voltage range, V

(see Note 1)

. . .

−0.3 V to 6 V

Positive output supply voltage range, V

. . .

V

− 0.3 V to 15 V

Negative output supply voltage range, V

. . .

−0.3 V to −15 V

Input voltage range, V

: Driver

. . .

−0.3 V to

V

+ 0.3 V

Receiver

. . .

±

30 V

Output voltage range, V

: T1OUT, T2OUT

. . .

V

− 0.3 V to V

+ 0.3 V

R1OUT, R2OUT

. . .

−0.3 V to V

+ 0.3 V

Short-circuit duration: T1OUT, T2OUT

. . .

Unlimited

Package thermal impedance,

θJA

(see Notes 2 and 3): D package

. . .

73

°

C/W

DW package

. . .

57

°

C/W

N package

. . .

67

°

C/W

NS package

. . .

64

°

C/W

Operating virtual junction temperature, T

150

. . .

°

C

Storage temperature range, T

. . .

−65

°

C to 150

°

C

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltages are with respect to network GND.

2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7.

recommended operating conditions

MIN NOM MAX UNIT

VCC Supply voltage 4.5 5 5.5 V

VIH High-level input voltage (T1IN,T2IN) 2 V

VIL Low-level input voltage (T1IN, T2IN) 0.8 V

R1IN, R2IN Receiver input voltage ±30 V

TA Operating free-air temperature MAX232 0 70 _°C

TA Operating free-air temperature

MAX232I −40 85 °C

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature (unless otherwise noted) (see Note 4 and Figure 4)

PARAMETER TEST CONDITIONS MIN TYP‡ MAX UNIT

ICC Supply current VCC = 5.5 V,

TA = 25°C

All outputs open,

8 10 mA

‡ All typical values are at VCC = 5 V and TA = 25°C.

4 POST OFFICE BOX 655303

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DRIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature range (see Note 4)

PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT

VOH High-level output voltage T1OUT, T2OUT _{RL = 3 k}Ω to GND 5 7 V

VOL Low-level output voltage‡ T1OUT, T2OUT _{RL = 3 kΩ} to GND −7 −5 V

ro Output resistance T1OUT, T2OUT _{VS+ = VS− = 0, VO =} ±2 V 300 Ω

IOS§ Short-circuit output current T1OUT, T2OUT _{VCC = 5.5 V, VO = 0} ±10 mA

IIS Short-circuit input current T1IN, T2IN _{VI = 0} 200 µA

† All typical values are at VCC = 5 V, TA = 25°C.

‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only.

§ Not more than one output should be shorted at a time.

NOTE 4: Test conditions are C1−C4 = 1 _{µF at VCC = 5 V ±}0.5 V.

switching characteristics, V

_CC

= 5 V, T

_A

= 25

°

C (see Note 4)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SR Driver slew rate RL = 3 kΩ to 7 kΩ,

See Figure 2 30 V/µs

SR(t) Driver transition region slew rate See Figure 3 3 V/µs

Data rate One TOUT switching 120 kbit/s

NOTE 4: Test conditions are C1−C4 = 1 µ_{F at VCC = 5 V} ±0.5 V.

RECEIVER SECTION

electrical characteristics over recommended ranges of supply voltage and operating free-air

temperature range (see Note 4)

PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT

VOH High-level output voltage R1OUT, R2OUT _{IOH = −1 mA} 3.5 V

VOL Low-level output voltage‡ R1OUT, R2OUT _{IOL = 3.2 mA} 0.4 V

VIT+ Receiver positive-going input_{threshold voltage} R1IN, R2IN _{VCC = 5 V, TA = 25}°C 1.7 2.4 V VIT− Receiver negative-going input_{threshold voltage} R1IN, R2IN _{VCC = 5 V, TA = 25}°C 0.8 1.2 V

Vhys Input hysteresis voltage R1IN, R2IN _{VCC = 5 V} 0.2 0.5 1 V

ri Receiver input resistance R1IN, R2IN _{VCC = 5, TA = 25}°C 3 5 7 kΩ

† All typical values are at VCC = 5 V, TA = 25°C.

‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only.

NOTE 4: Test conditions are C1−C4 = 1 µ_{F at VCC = 5 V} ±0.5 V.

switching characteristics, V

_CC

= 5 V, T

_A

= 25

°

C (see Note 4 and Figure 1)

PARAMETER TYP UNIT

tPLH(R) Receiver propagation delay time, low- to high-level output 500 ns

tPHL(R) Receiver propagation delay time, high- to low-level output 500 ns

SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

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PARAMETER MEASUREMENT INFORMATION

≤10 ns VCC R1IN or R2IN R1OUT or R2OUT RL = 1.3 kΩ See Note C CL = 50 pF (see Note B) TEST CIRCUIT ≤10 ns Input Output tPHL tPLH 1.5 V VOL VOH 0 V 3 V 10% 90% 50% 500 ns WAVEFORMS 1.5 V 90% 50% 10%

NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance.

C. All diodes are 1N3064 or equivalent.

Pulse Generator (see Note A)

6 POST OFFICE BOX 655303

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PARAMETER MEASUREMENT INFORMATION

T1IN or T2IN T1OUT or T2OUT

CL = 10 pF (see Note B) TEST CIRCUIT ≤10 ns ≤10 ns Input Output tPHL tPLH VOL VOH 0 V 3 V 10% 90% 50% 5 _µs WAVEFORMS 90% 50% 10% RL 90% 10% 90% 10% tTLH tTHL SR+ 0.8 (V_OH– V_OL) t_TLH or 0.8 (V_OL– V_OH) t_THL

NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle _≤ 50%. B. CL includes probe and jig capacitance.

Pulse Generator (see Note A)

EIA-232 Output

Figure 2. Driver Test Circuit and Waveforms for t

and t

Measurements (5-

µ

s Input)

EIA-232 Output −3 V 3 V −3 V 3 V 3 kΩ 10% 1.5 V 90% WAVEFORMS 20 µs 1.5 V 90% 10% VOH VOL tTLH tTHL ≤10 ns ≤10 ns TEST CIRCUIT CL = 2.5 nF Pulse Generator (see Note A) Input Output SR+ 6 V t_THLor t_TLH

NOTE A: The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.

SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004

7

POST OFFICE BOX 655303

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APPLICATION INFORMATION

NOTES: A. Resistor values shown are nominal.

B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. In addition to the 1-µF capacitors shown, the MAX202 can operate with 0.1-µF capacitors.

+ +

−

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package Drawing

Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

MAX232D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DE4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DG4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DR ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DRE4 ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DRG4 ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWE4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWR ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232ID ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDE4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDG4 ACTIVE SOIC D 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDR ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS

& no Sb/Br)

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package Drawing

Pins Package Qty Eco Plan

(2)

Lead/Ball Finish MSL Peak Temp

(3)

Op Temp (°C) Top-Side Markings

(4)

Samples

MAX232IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDW ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWE4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I

MAX232IN ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 MAX232IN

MAX232INE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type -40 to 85 MAX232IN

MAX232N ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 MAX232N

MAX232NE4 ACTIVE PDIP N 16 25 Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type 0 to 70 MAX232N MAX232NSR ACTIVE SO NS 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232NSRE4 ACTIVE SO NS 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232NSRG4 ACTIVE SO NS 16 2000 Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Jan-2013

Addendum-Page 3

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232DWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232IDWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

MAX232DR SOIC D 16 2500 367.0 367.0 38.0 MAX232DR SOIC D 16 2500 333.2 345.9 28.6 MAX232DRG4 SOIC D 16 2500 333.2 345.9 28.6 MAX232DRG4 SOIC D 16 2500 367.0 367.0 38.0 MAX232DWR SOIC DW 16 2000 366.0 364.0 50.0 MAX232DWRG4 SOIC DW 16 2000 367.0 367.0 38.0 MAX232IDR SOIC D 16 2500 333.2 345.9 28.6 MAX232IDWR SOIC DW 16 2000 366.0 364.0 50.0 MAX232IDWRG4 SOIC DW 16 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

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