Memory and CPU Sockets
© 2009 Tyco Electronics Corporation. All Rights Reserved. TE logo and Tyco Electronics are trademarks.
Market Environment
CPU/Logic Sockets
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Standards driven by Intel and AMD
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Markets include server, desktop and notebook
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Primarily designed in the US
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Consumed in Asia/Pacific
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Multiple competitors and commodity pricing
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Custom ASICs drive lower volume and
higher mix
AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation.
TE Products for Intel Socket B – LGA 1366
System of LGA1366 socket
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Server socket (replaces Socket J – LGA 771)
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Tyco Electronics’ provides three components for LGA1366
socket system
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Socket: 1981837-1(15au), 1981837-2(30au)
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ILM: 1939738-1(U Lever), 1-1939738-2 (Straight Lever)
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Stiffener plate: 1939739-1(DT); 1981467-1(SVR)
CPU Socket Roadmap for (Intel & AMD)
2008
2009
Server
Socket TW (1248)
Socket J (771)
Socket 700
Socket G34
Socket H1 (1156)
Socket 775
Desktop
AM2 940
μ
PGA 479
rPGA989, rPGA988A
Notebook
μ
PGA 638
Socket FS1 (722)
AM3 941
2010
2011
2013
Socket 1207
Socket R (2011)
New AMD FM1 934
Socket LS (1567)
Socket 604
rPGA988B
Socket H2 (1155)
Micro Contact
Socket
2012
Socket B1/B2 (1356)
rPGA988C
rPGA II
Socket B (1366)
AMD is a trademark of Advanced Micro Devices, Inc. Intel is a trademark of Intel Corporation.
TE Products for Intel Socket H – LGA 1160
•
Next generation Intel desktop CPU
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Replaces Socket T LGA 775
•
Tyco Electronics’ provides three components for LGA1366
socket system
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Socket: 2040540-1
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ILM: 2013882-1
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Stiffener Plate: 2013883-1
TE Products for Socket G – rPGA 989
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Mobile socket (replaces mPGA 479)
TE Products for AMD Socket G34 – LGA 1944
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Next generation AMD server CPU
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Replaces Socket F LGA 1207
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Tyco Electronics’ provides two components for LGA 1944 socket
system
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Socket: 2069189-1
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ILM: 2069190-1
Market Environment
Main Memory Sockets
•
Main Memory module designs are
driven by JEDEC standards body.
•
Major memory module makers and
computer OEMs are key participants in
setting module designs.
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Tyco Electronic’s product focus resides in DDR3
DDR3 DIMM LLCR Vertical Through Hole
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240 position
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Retention barb aids during soldering
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Low level contact resistance
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Three solder tail lengths available
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Accepts memory module per JEDEC MO-269
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Used in servers and communications equipment
Part Number Contact Plating Housing Color Extracto r C olor Tail Length Packaging 1932031-1 Gold Flash Natural Natural 2.67 mm Tray 1932031-2 Gold Flash Natural Natural 3.18 mm Tray 1932031-3 Gold Flash Natural Natural 4.00 mm Tray 1932031-4 Gold (15) Natural Natural 2.67 mm Tray 1932031-5 Gold (15) Natural Natural 3.18 mm Tray 1932031-6 Gold (15) Natural Natural 4.00 mm Tray 1932031-7 Gold Flash Black Natural 2.67 mm Tray 1932031-8 1932031-9 Gold Flash Gold Flash Black Black Natural Natural 3.18 mm 4.00 mm Tray Tray 1-1932031-0 Gold (15) Black Natural 2.67 mm Tray 1-1932031-1 Gold (15) Black Natural 3.18 mm Tray 1-1932031-2 Gold (15) Black Natural 4.00 mm Tray 1-1932031-3 Gold Flash Black Black 2.67 mm Tray 1-1932031-4 Gold Flash Black Black 3.18 mm Tray 1-1932031-5 Gold Flash Black Black 4.00 mm Tray 1-1932031-6 Gold (15) Black Black 2.67 mm Tray 1-1932031-7 Gold (15) Black Black 3.18 mm Tray 1-1932031-8 Gold (15) Black Black 4.00 mm Tray 1-1932031-9 Gold Flash Orange Natural 2.67 mm Tray 2-1932031-0 Gold Flash Orange Natural 3.18 mm Tray
DDR3 DIMM Vertical Surface Mount
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240 position
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Retention barb aids during soldering
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Accepts memory module per JEDEC MO-269
•
Used in servers and communications equipment
Part Number
Contact
Plating
Housing
Color
Extractor
C olor
Packaging
2040727-1
Gold Flash
Black
N atural
T ray
2040727-4
Gold (15)
Black
N atural
T ray
2040727-5
Gold (30)
Natural
N atural
T ray
2040727-6
Gold (30)
Black
Black
T ray
2040727-7
Gold (30)
Black
N atural
T ray
DDR3 SODIMM Right Angle Surface Mount
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204 position
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Reverse and Standard module orientation options
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Available in 4.0 mm and 5.2 mm heights
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Accepts memory module per JEDEC MO-268
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Small form factor enables development of
smaller, lighter notebook PCs
Part Number Std Keying Part N umber Rvs Keying Contact Plating Housing
Color Boss Packaging 2013022-1 2013287-1 Gold flash Black With Tray 2013022-2 2013287-2 Gold (6) Black With Tray 2013022-3 2013287-3 Gold (30) Black With Tray 1-2013022-4 1-2013287-4 Gold flash Gray Without Tray 1-2013022-5 1-2013287-5 Gold (6) Gray Without Tray 1-2013022-6 1-2013287-6 Gold (30) Gray Without Tray 2-2013022-1 2-2013287-1 Gold flash Black With Reel 2-2013022-2 2-2013287-2 Gold (6) Black With Reel 2-2013022-3 2-2013287-3 Gold (30) Black With Reel 3-2013022-4 3-2013287-4 Gold flash Gray Without Reel 3-2013022-5 3-2013287-5 Gold (6) Gray Without Reel 3-2013022-6 3-2013287-6 Gold (30) Gray Without Reel
4.0 mm Height
Part Number Std Keying Part N umber Rvs Keying Contact Plating HousingColor Boss Packaging 2013289-1 2013290-1 Gold flash Black With Tray 2013289-2 2013290-2 Gold (6) Black With Tray 2013289-3 2013290-3 Gold (30) Black With Tray 1-2013289-4 1-2013290-4 Gold flash Gray Without Tray 1-2013289-5 1-2013290-5 Gold (6) Gray Without Tray 1-2013289-6 1-2013290-6 Gold (30) Gray Without Tray 2-2013289-1 2-2013290-1 Gold flash Black With Reel 2-2013289-2 2-2013290-2 Gold (6) Black With Reel 2-2013289-3 2-2013290-3 Gold (30) Black With Reel 3-2013289-4 3-2013290-4 Gold flash Gray Without Reel 3-2013289-5 3-2013290-5 Gold (6) Gray Without Reel 3-2013289-6 3-2013290-6 Gold (30) Gray Without Reel