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-IBM'S 4381 PROCESSOR FAMILY: STEPS FORWARD IN TECHNOLOGY
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THE IBM 4381 STORY CONTINUES
The IBM 4381 processors contain some of the most
advanced
and innovative technologvavailable from IBM to provide new
levels of performance
and
reliability.
IBM
engineers have developed the B M 4381 to provide more perfor-mance than earlier intermediate systems.The 4381 provides from nearly two to over five times the internal throughput of the 4341 Model Group 2, for example. At the same time, the IBM 4381 processors require less floor space and service clear-ance and weigh less than the 4341 processors. In addition, the air-cooled 4381 requires no specially cooled air Because of its compact size and use of room-temperature air for cooling, the IBM 4381 can be located in virtually any work environment.
Engineering innovation and creativity were the key to the successful design of the B M 4381 For example, Large Scale Integrated (LSI) chips, containing thou
-sands of microscopic integrated circuit elements, are used for both processing and memory applications. New
packaging, also developed by IBM takes full advantage of the power these advanced logic and memory chips con-tain. High-density logic chips, for example,
are joined to multi-chip modules, de-signed for improved heat dissipation. These in turn are mounted on circuit boards and individually cooled by a patented technique (called impingement cooling) using room-temperature air Multi-chip modules and logic chips were developed in plants and laboratories in
East Fishkill and Endicott, N Y Memory chips including the latest 256K-bit chip technology were produced in Burlington,
Vt. The BM 4381 with its novel air-cooling and state-of-the-art circuit boards were developed in Endicott, NY The new components are assembled in I BM plants in Endicott, NY, Valencia, Spain; and Sumare, Brazil.
The IBM 4381 family of processors repre-sents some of the most advanced tech-nology now in production anywhere in the world. Their innovations add up to unparalleled performance and value in IBM intermediate systems.
2
IBM 4381 DESIGN
The evolution of computing power and performance in IBM's
jntermediate
systems continues with its
4381 family of processors.
T he IBM 4381 provides an exciting new solution for commercial and engi -neering/scientific applications that require central site,end user, ordistributed processing. The IBM 4381 satisfies these diverse requirements through the integration of the best of both IBM 4341 and 308X technologies, including high
The most recent member of the 4381 family, the Model Group 3 Dual Processor, contains two processor boards. Each of the two inte-grated central processors has its own channels and high speed buffer. The engineering/scientific performance of the 4381 Dual Processor is up to 90% greater than the 4381 Model Group 2 Uniprocessor.
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performance, high density multi-chip module circuit packaging, and a new design for increasing the efficiency of air cooling. Design improvements in the IBM 4381 combine to give it an internal throughput up to 5 times faster than the IBM 4341 Model Group 2.
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. COMMERCIAL APPLICATIONS
. ENGINEERING/SCIENTIFIC APPLICATIONS
4341 Model 2
4381 Model 1
IBM 4381 Processor Storage Million bytes (MB) Channels Control storage arrays Processor boards
High speed buf-fers (cache), for SCPs using:
2kpages 4kpages
Assists
Model Group 1
4,8, 6
Model Group 2
4,8,16,24,32
6
+
6 optional (for a maximum instantaneous aggregate data rate of 22MB w/data streaming)1 byte mpx + 1 optional
Up to 11 block mp;<, 4 w/data
rates up to 3MB ir'l data
streaming mode
4k 8,k
16k 32k
Model Group 3 DUIII Proce.eor'
8,16,24,32
12
+
6 optional (for a maximum inst. aggregate data rate of 32MB w/data streaming)2 bytempx
+
2 optional Up to 16 block mpx,8 w/data rates up to 3MB in data streaming mode
2
2
n/a Tw032k Preferred Machine Assist (For MVS as a VM guest)
Engineering Scientific assists:
• Multiply and Add Facility
• Square Root Facility2
• Mathematical Function 1"'::11"1"" .. ,,,'
including:
- Common Logarithm - Exponentiation - Natural Logarithm
VM/HPO Assist
Internal throughput performance compared wllBM 4341 Model Group 2:
• Commercial • Engineering/
Scientific,
(w/o assists) Notes:
Up to 1.5 times
Up to 1.8 times
Up to 2.3 times Up to 3 limes
Up to 3.9times3 Up to 5.7times3
1 Statistics shown here are total quantities on the Dual Processor; quantities are equally divided between the two processors.
2. Designed for use with the Elementary Math Library, program number 5799-BTB.
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IBM 4381 PROCESSOR FEATURES
• Upright design to minimize floor space
• Unique air cooling technique
• Up to 32 million byte processor storage depending on model
• Dense one and two million byte memory cards
• New Mmm muHi-chip logic modules
• New module packaging
• 88 nanosecond internal processor cycle time
• 8-byte wide data flow within the processor and between the processor's high-speed buffer (cache) and channels.
• ie-byte wide data flow between the high-speed buffer and processor storage and between the dual processors' high-speed buffers.
• AHemative use of a standard block multiplexer channel as a second byte multiplexer channel
• Six optional block-muHiplexer channels
• Optional Channel-to-channel adapter
• Attach support for a broad spectrum of IBM and OEM terminals and work stations
• Two modes of operation:
1. System/370 Extended Architecture (37G-XA) Mode, support provided by:
-MVS/XA
- VM/XA Migration Aid
2. System/370 (5/370) Mode, support provided by operating systems:
-MVS/SP
- YM/SP with or without VM/SP High Performance Option - DOS/VSE with VSE/Advanced Functions and VSE/SP
(Native on Model Groups 1 and 2; as VM guests on Model Groups 1, 2 and 3)
- OS/VS1 with OS/VS1 Basic Programming Extensions (Native on Model Groups 1 and 2; as VM guests on Model Groups 1, 2 and 3)
- ACP/TPF1 or ACP/TPF2 (except Model Group 3)
• Extended Control Program Support (ECPS) for MVS/370
andYM/370
,
• Enhancements to ECPS:MVS for MVS/SP
• Preferred Machine Assist
• Engineering Scientific Assists
• Remote Support Facility (RSF) with Remote Operator Console Facility (ROCF)
• Problem Ana!ysis routines
• Optional 3205 console(s) with 4381 Operator Control Panel
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IBM 4381 PACKAGING
The impressive performance of the IBM
4381
is due in part to
its 68 nanosecond internal processor cycle time.
N ew packaging in the IBM 4381
reduces the number of levels through which electronic signals must travel.
Each packaging level causes delay in
the signal. Fewer levels mean less delay.
The card-on-board technology of the IBM 4341 consistsoffourlevels-achip,
in a module, on a card, plugged into a
CYCLE TIME IMPROVEMENT IN THE IBM 4381
120
board. Thus, in the IBM 4341 , a signal
traveling between processor boards
~
60 may have to cross as many as eight pack- Q) aging levels, incurring delays at each~
level.In the IBM 4381 more chips are
pack-aged per module (possible because of its
new cooJing technique), and the module
plugs directly into the circuit board. By
eliminating use of the card, and packag-ing the equivalent processor logic on
a single board, the IBM 4381 's module-on-board technology reduces
"pack-aging delay" to approximately one-half
that of the IBM 4341 Fewer levels and
less delay improve internal cycle time
and increase processing power In
addition, fewer components and con-nections mean better reliability
4341 Model 2
Fast chips and new packaging enable the IBM 4381 internal cycle time to be nearly twice as fast as the cycle time in the IBM 4341 Model 2.
Following is a description of the IBM 4381 system and its innovative design features which together offer intermediate
system users new levels of price/per-formance, availability and reliability and an exciting new growth path through the 1980's.
A. MULTI-CHIP MODULE BOARD (Model Group 3 only)
B. CHANNEL-TO-CHANNEL ADAPTER
C. MAINTENANCE SUBSYSTEM/SUPPORT PROCESSOR
D. CHANNEL DRIVERS/RECEIVERS
E. MULTI-CHIP MODULE BOARD (all Model Groups)
F. PROCESSOR STORAGE
G. IMPINGEMENT NOZZLES for cooling
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IBM 4381 TECHNOLOGY
64K-bit and highly advanced 256K-bit AfOSFET memory chips
are used for main storage where high density is
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a
key requirement.
N ew, dense IBM 256K-bit MOSFET
(Metal Oxide Semiconductor Field Effect
Transistor) memory chips have been developed since the introduction of the IBM 4381 family. They are the results of careful improvements to the proven SAMOS (Silicon and Aluminum Metal
Oxide Semiconductor) process which
IBM introduced in 1978. These new chips
allow the IBM 4381 Model Groups 2 and
3 to double memory size to thirty-two
megabytes with no increase in storage
space requirements.
A complete, encapsulated 24mm2 (one inch square) stacked module contains eight 84K-bit MOSFET chips with up to 524,288 bits of memory for high density, speed and reliability.
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84K-bit MOSFET chips are used
for main memory of up to 16 megabytes.
Advanced IBM 256K-bit MOSFET chips are used for main memory of up to 32 megabytes.
Two million bytes of main storage are pack-aged on this single card. Up to 32 million bytes of storage can be provided on the
Model Groups 2 and 3 with only sixteen
cards and no increase in space
requirements.
M ain storage capacity is often a vital factor in performance. The IBM 4381 is designed to allow the right balance of processing power and storage size with an entry level capacity of 4 or 8 million bytes, expandable to 16,24, or 32 million bytes, depending on model. One or two million bytes of main storage are packaged on a single card using 64K-bit or 256K-64K-bit chips. Memory upgrades are accomplished simply by adding or exchanging cards. Up to 32 million bytes of storage can be provided on Model Groups 2 and 3 with sixteen, two million byte cards.
One million bytes of main storage are pack-aged on this single card. 16 million bytes
of storage can be provided on IBM
4381 models with 16 cards.
Memory upgrades are accomplished simply
by adding or exchanging cards. This Field
Replaceable Unit (FRU), for example,
con-tains two milli~n bytes of memory.
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IBM 4381 INNOVATIONS
The IBM 4381 combines 704-circuit bipolar chips with
a
reliable,
innovative packaging design to offer dense logic packaging.
P erformance, reliability, availability,
and serviceability are all strongly
in-fluenced by the advanced, LSI
com-ponents and packaging used in the IBM
4381 Its design is centered around its
new 64mm, (2.5 inch) multi-chip modules
(MCM) utilizing IBM's proven bipolar
chips for main processor logic. The new
MCMs, which can contain up to
thirty-six high-speed logic and array chips used
for processing and channel control,
represent an exciting breakthrough for
LSI packaging. The IBM 4381 's dense
packaging reduces the distance between
Underside view of hand-held MCM. The pluggable 64mm MCM is a field replaceable unit (FRUI which provides fast and easy maintenance.
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circuits and improves internal perfor-mance. Use of this high-density is possible because of newly-developed techniques for heat dissipation and air cooling of the individual MCMs. Twenty-two MCMs are packaged on a board which measures only 600mm (24 inches)
in length by 700mm (28 inches) wide.
This high-density board containing
approximately 250,000 circuits,
consti-tutes the system's main processor logic.
Two such boards are used in the power
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IBM 4381 AIR COOLING FOR ADDED RELIABILITY
A
n
IBM-patented technique, called .¥npingement cooling, is used to reduceheat and produce added reliability This technique ensures even cooling by cooling logic modules individually at a uniform temperature and rate. This offers significant advantages over conven -tional serial air-cooling in other
proc-essors. In a serial-cooled processor, air
is usually blown over modules from the bottom to the top of the processor This
produces temperature gradients at
various levels as the dissipated heat rises. In this environment, engineers must
Impingement cooling employs a "plenum" that fits over the MCM board. The plenum consists of an air chamber, high-speed blower, and twenty-two rubber impingement nozzles. The blower forces a steady stream of high-velocity, room-temperature air onto each of the processor board's 84mm MCMs.
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position heat-sensitive electronic circuits for even heat distribution. The result leads to longer processor cycle times since
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chi . . produoemo ... heat In •• '''''' ... Th ••
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the heatalnk, Ita multkurfaoe
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TIle . .
..,.,epoxr/ ...
board,whloh... metal frame tor mechanical
ata-~ . . . alnale FI.ld R.placeable Unit
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:=
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Interconnecta n . . rIyOOOoll'oulta. One board
accomMO-. accomMO-. accomMO-. accomMO-. twentp.two Mmm MeM.- the
. . . proal . . r IotJIo ofth.IBM 4381
UnIpI'oal •• ora, Mod.1 Group. 1
.nd
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A ... m of 181081e or
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. . _ ... otth. ca ... mle
IUb-_ IUb-_ ... electrical contact with
... cto ... In the procellor
... On top 01_ .ubatm.I ••
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BUILT-IN RELIABILITY, AVAILABILITY, SERVICEABILITY (RAS)
T
he
IBM 4381 is designed to be defect-J free on delivery and to provide maximumavailability throughout its working life.
New manufacturing processes and new circuit board designs result in greater reliability and shorter production cycles, which reduce the risk of introducing
defects during the manufacturing
process. These designs also enhance the ability to inspect and test the product. Components, circuit cards and modules are also subjected to "burn-in" proce-dures as well as actual machine test. All of these measures have as their objec-tive the goal of delivering a defect-free product to you.
Fault tolerance is a key feature of the IBM 4381 design. In main storage, for example, all single-bit errors are detected and corrected. Even rare double-bit errors are detected and, as is often the case, where one bit of the two is failing
intermittently, newly-designed circuits will allow for correction of both.
For added RAS, in every IBM 4381 processor there is a separate Support Processor that is continuously monitor-ing its operation. If a failure occurs, the Support Processor is invoked, and, in many cases, its actions allow system operation to continue. It can automatic-ally substitute failing components in
vital processor and channel storage arrays using "built-in" spare circuits. Failing instructions can be re-executed, under control of the Service Processor, which analyzes and records all such events on the system diskette for sub-sequent review by I BM Customer
Engi-'.
neers. The dual processor (Model Group 3), can continue as a uniprocessor after some single processor failures.
In the case of a system failure, the Support Processor can be used by the operator to analyze or correct a problem. The Problem Analysis facility provides routines for use by the operator to verify IBM 4381 operations. Console messages (avail-able in seven languages) assist the opera-tor with appropriate actions to correct or bypass the problem and to identify failing components. This allows IBM to dispatch a trained Customer Engineer with the necessary part to effect a fast, "first-call" repair For intermittent prob-lems, Problem Analysis routines record status information for follow-up diagnosis.
Another feature of the IBM 4381-the Remote Support Facility (RSF)-can be used for remote diagnosis and resolu-tion of a problem. This facility allows the data stored by Problem Analysis to be sent over a telephone link to an IBM
service representative (without disruption in your normal system operations). It also allows the service representative, if
necessary and with your permission, to recreate the problem on your system for
"hands-on" diagnosis. RSF is one of the most powerful diagnostic tools that has ever been made available to your IBM Customer Engineer It may never be
needed, but it is reassuring to know that specialist support from an IBM Product Support Location, Manufacturing Plant, or Development Laboratory can be brought virtually "on-site" in the time it takes to make a telephone call.
15
A SYSTEM
FOR
NOW AND TOMORROW
B M
'S
4381 fam i Iy offers ex-citing systems solutions for today's data processing problems while its advanced technology and software will allow it to grow with your organization. Its unique packaging technology for both logic and storage subsystems is the result of many years of development in IBM plants and labs throughout the world. These technology advances allow the BM4381 to offer intermediate users the
functions formerly available only in very large high-performance systems. Ask
your IBM Marketing Representative for more detai Is about the IBM 4381 today
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IBM Eurocoordination SA au capital de 2.700.000 F Siege social' Tour Pascal 22, Route de la Demi-Lune 92075 Puteaux
R.C.S. Nanterre B 304 538192, France
IBM World Trade
Americas/Far East Corporation
Town of Mount Pleasant
Route 9, North Tarrytown New York, 10591 USA.
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References in this publication to
IBM products, programs or services do not imply that IBM intends to make these available in all countries in which IBM operates.
Any reference to an IBM program product in this publication is not intended to state or imply that only
IBM's program products may be used. Any functionally equivalent program may be used instead.
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