with Concurrent Engineering

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www.cofan-pcb.com

Enclosures (Plastic and Metal Alloys)

SMT & Through Hole PCB Assembly

Final Integration & Test Services

with Concurrent Engineering

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[email protected] 1-800-766-6097

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A Subsidiary of Cofan USA

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Cofan USA was founded in 1994. Our main office is located in Fremont, CA. Cofan has manufacturing facilities in Shenzhen, China and in Taipei, Taiwan. Also, we have sales office in Toronto, Canada. All of our facilities are ISO 9000:2001 certified for consistent management of our processes.

Cofan oﬀers design and manufacturing services for enclosures, heat sinks, and other customized mechanical parts. Our services include custom sheet metal, die-casting, Aluminum and Copper extrusions, CNC machined parts, and injection molded parts. We use industrial standard design software, such as Flowtherm, ANSYS Icepak, SolidWorks, Pro/E to support your design needs.

We have been in mainstream in energy saving LED lighting industry for 5 years, oﬀering FR-4, MCPCB, thermal solutions and assemblies. We are focused in developing and producing new technologies at Light Guide Panels and Chip-on-Board.

We pride ourselves in giving the best possible customer service, the highest quality products with the shortest lead time in the industry at competitive pricing.

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Electronic Components

Solder Mask Circuit Layer Copper Layer

Dielectric Layer Metal Core Layer

Heat Sink

Top Layer

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High Density

Power Conversion

Metal Base Top Layer Thermal Vias Thermally Conductive Pre-Preg Bottom Layer Top Layer Thermally Conductive Pre-Preg Metal Base

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Motor Control

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General Lighting

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Hybrid & Electric Vehicles

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Single-Sided with Metal Base

Wide Selection of Thermally Conductive PP

One Layer of Pre-Preg (4,6 or 8 mm)

Copper Weight 1~6oz

Metal Base, Copper or Aluminum, 10~10mm

Fully Automation Production Line

Single Layer Construction

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Single side SMT with Metal Base

Surface Mounting on Top Layer

All connectivities are done on second layer.

Two Layer Construction

Electrical Vias Thermal Vias Top Layer Layer 2 Metal Base Top Layer Thermal Vias Thermally Conductive Layer Bottom Layer Top Layer Thermally Conductive Pre-Preg Metal Base

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Single side SMT with Metal Base

Surface Mounting on Top Layer

All connectivities are done on 2nd and 3rd layer

EMI is applied on fourth layer

Thermal Vias, Electrical Vias, and Chasis Viasayer.

Four Layer Construction

Electrical Vias Isolated

Metal Base Electrical Vias Thermally Conductive Layers Thermal Vias Top Layer Layer 2 Layer 3 Layer 4 Bottom Layer Metal Base Top Layer Thermal Vias Thermally Conductive Pre-Preg Bottom Layer Layer 4 Bottom Layer 14

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Double-sided surface mounting

Metal can be isolated or connected to electrical vias

Chasis Vias and thermal interface can be interfaced with the heat sink.

Double-Sided / Single Layer Construction

Electrical Vias Isolated from Metal Base

Metal Base Top Layer Thermally Conductive Layers Bottom Layer Metal Base Electrically connected to base Isolated from Base Mounting Hole Heatsink attached at exposed baseplate

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Concept on Metal Base Grounded to 2nd Layer

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Thermal Pre-Preg Material Selection

• T-lam (Thermagon) • Sekisui

• Customized by Cofan Taiwan • Bergquist

• Denka PCB Lamination

• Thermagon – 3.5W/m-k 1KA series • Bergquist

• Doosan

Metal Core Material Selection • Aluminum

• Copper • Heat Sink

• Heat Sink with Heat Pipes and Heat Spreaders

Layer Count

• Single-sided through 6-layer • Blind/Buried Vias • Thermal Vias • Chassis Vias Copper Weight • Accommodate up to 10 oz. PCB Thickness

• Inner layer dielectrics 0.004~0.25” Surface Finish • Solder (63/37 Tin-Lead) • SN100C • OSP • Carbon Ink • Im Au 18

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Our Concurrent Engineering service is what truly separates Cofan from other Fabricators. Our Applications Engineering Team oﬀers 10+ years of experience in the design and

manufacturing of Metal Core PCBs, assisting our customers during the design and ongoing manufacturing processes of PCB assemblies to ensure the highest level of performance at the lowest possible cost.

We can review your Gerber ﬁles and recommend the best possible Design for Manufacturing practices – including appropriate dielectric insulation characteristics and current carrying capacity. Before proceeding with the procurement, identifying what can be improved at the earlier stage will save substantial time and money for the prototypes.

Moreover, we offer thermal simulation service for your final PCB integration to predict the thermal characteristics of your design. After getting the results, our team can check what components can be simplified and rearranged for the feasible layouts. The customized thickness of the baseplate or any additional direct integration components (i.e., heat sink) can be specified. Either way, Cofan will eliminate the need for multiple prototypes, reducing the time it takes to get your project on the market.

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Thermal Modeling Flowchart

YES NO YES NO C A D / C A M 20

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Thermal Simulation

BOARD THICKNESS: 1.5MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 87.36 C BOARD THICKNESS: 2.0 MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 83.44 C BOARD THICKNESS: 3.0 MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 79.19 C

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Tools for Assisting Product Development

Metal Base Top Layer Thermally Conductive Pre-Preg Metal Base Electrical Vias Thermally Conductive Pre-Preg Thermal Vias Top Layer Layer 2 Layer 3 Layer 4 Bottom Layer Mounting Hole CAD CAM CAE

Computer Aided Design • AutoCAD • Pro/E • SolidWorks Simulation Software • FloTHERM • ANSYS Icepak • COSMOS

Computer Aided Manufacturing • Mastercam

• CAM 350

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The customer contacted us with a plan for a 3-layer design. After reviewing their requirements and the sensitivity of their application, Cofan advised an additional layer to act as a ground plane to reduce EMI.

The ﬁnal design utilizes a Copper Base for improved thermal conductivity and enables grounding of all the capacitors. The design includes both thermal and electrical vias ﬁlled with DuPont’s CB100 for improved conductivity.

Example 1

Metal Base Top Layer Thermally Conductive Pre-Preg Bottom Layer Electrically connected to base Isolated from Base Mounting Hole Heatsink attached at exposed baseplate

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The customer contacted us with a plan for MCPCB assembly that would need to be attached to a Heat Sink assembly. Cofan developed a new lamination process, which would allow us to mount the MCPCB directly to a Heat Sink with T-Lam PP material. The end result is a stand-alone MCPCB and Heat Sink assembly that costs less and minimizes manufacturing processes. Also, it improves the thermal management characteristics.

Example 2

Metal Base

Thermally Conductive Pre-Preg Bottom Layer Electrically connected to base Isolated from Base Mounting Hole Heatsink attached at exposed baseplate 24

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The customer’s MCPCB was experiencing a thermal issue and did not get any suggestions/improvements from another fabricator’s Application Engineer. The client assumed their maximum height was limiting their options and was close to scrapping entire project.

By taking some time to review and understand their application, Cofan was able to increase the base-plate thickness from .062” to .0125”, which was made possible by using counter-bore mounted screw holes. Cofan was also able to implement the improved thermal lamination to maximize the heat dissipation. Cofan helped resolve their issues beyond their expectations.

Example 3

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Metal Fabrication

Cofan USA operates along with Cofan CN (China based facilities) to fabricate the simplest to most complex sheet metal part for a quick-turn prototype or for a production stage. Cofan oﬀers competitive pricing.

Cofan’s procurement items range from simple ﬂat metal plate with a single hole to the complex larger assemblies, consisting various components that have been punched, formed, machined, welded, sanded, plated, painted, silk-screened, and installed along with hardware together. The assembly can include the rivets or welding. Majority of the parts require additional operations, such as ﬁnishing operation on painting or plating before packaging.

Trumpf, Fanuc CNC, Fanuc Wirecut, Charmille Wirecut, Ona Wirecut Sheet Metal operations

• Bending • Ironing • Laser Cutting

• Press Brake Forming • Punching

• Roll Forming • Stamping • NC Routing • Welding

Full line Machining operation including • CNC Tapping / Drill Center • CNC Lathe

• Double/Single-Sided Grinding Measuring Instruments

• CMM, Microscope, etc. Full line metal ﬁnishing

• Wet/powder coat painting • Anodizing

• Nickel plating, etc.

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Cofan has stock units of standard heat pipes with various diameters that can be

integrated into custom heat pipe assemblies. It can be tailored for your application needs. Cofan’s ﬂexible solutions

• At the copper heat pipe, multiple plating options are available. Nickel plated heat pipes can be used at outdoor.

• Custom bending can be done in-house for use in any hardware layout. • Various heat pipe diameters. Small diameters can be used at constrained environments, and larger diameters can be utilized for maximum performance. • Various heat pipe lengths (up to 400mm)

Oﬀ-shelve lengths for readily available stock. Customized lengths.

Cofan’s services

- Custom bending can be done in-house at our Fremont, CA facility.

- The work can be ready in less than one week. Cofan oﬀers 100% inspection on all of the heat pipes before and after bending.

- All heat pipes must pass the

stringent heat transfer tests to reach a minimum temperature gradient within a minimal time period (∆T < 4 °C, time period ≈ 7 seconds).

- ISO9001 Certiﬁed Facilities.

- Capacity: 500,000 heat pipes/month with lead time of less than one week. R&D team dedicated to continuous improvement and product development. Design at active or passive forms.

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Copper or Aluminum Extrusion Proﬁles

COFAN USA 46177 WA RM S PRI N G S BL VD . F RE M ON T, CA 9453 9 0.48 12.19 7/ 1/08 SH ARP EDGES * DI M EN SIO N S IN IN CHES AN D ( M ILL IM ET ER S) * D EB URR A N D B RE A K AL L 7/ 1/08 AL 6063-T5 N O N E EXTRU SIO N PR O FI LE FOR 495 .3 X50 .8 M M JM J 01 IV AN. C 0.28 19.50 50.80 7.11 495.30 2.00 0.33 8.38 3 2 SCAL E: 1 :3 1 D RA W N N O T TO S C A LE SH EE T 1 O F 1 UN LE SS O THE RW IS E SPE C IF IED : 21 -1 07 4 W EIGH T: RE V D W G . N O . A SI ZE N A M E D A TE C O MM EN TS : Q .A . MF G A PP R. EN G A PP R. C HE CK ED D RA W N 4 IN TE RP RE T GEO M ET RI C FIN IS H 5 TO LE RA N C IN G P ER : C O FA N U SA IS PR OHIBI TED . TW O PLA C E DE C IMAL US ED O N PR O PRI ET A RY A N D C O N FI D EN TIA L A PP LIC A TIO N N EXT A SS Y MA TE RI A L 0. 00 5 0. 02 TH REE P LA C E DE C IM A L DI M EN SIO N S A RE IN INC HE S TO LE RA N C ES : FR A C TIO N A L A N G ULA R: M A C H BE N D TH E INF O RM A TIO N C O N TA IN ED IN T HI S D RAW IN G IS T HE S OL E PR O PE RT Y O F C O FA N U SA . A N Y RE PR OD UC TIO N IN PA RT O R A S A W HO LE W /O T HE WR ITT EN P ERM ISS IO N O F TIT LE : 28

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Cofan USA 46177 Warm Springs Blvd Fremont, CA 94539 Tel: 1-800-766-6097 Fax: 1-510-490-7931 Web site: www.Cofan-USA.com www.Cofan-PCB.com Cofan Canada

Tel: 1(905) 761-8887 Tel: 011 886-2-7716-0080 x68Cofan Taiwan Cofan China

Chang Han, President

[email protected]

Ben Finn, Sales Engineer

[email protected]

John Lin, Purchasing Manager

[email protected]

Emily Lee, Sales

[email protected]

Ivan Cho, Mechanical Engineer

[email protected]

James Cho, General Manager

[email protected]

Lac Nguyen, Field Application Engineer

[email protected]

David How, Account Manager

[email protected]

Helmut Mattler, Account Manager

[email protected]

David Lin, Sales Director

[email protected]

Cathy Chan, VP Sales

[email protected]

Chico Su, General Manager

[email protected]

with Concurrent Engineering

www.cofan-pcb.com

with Concurrent Engineering

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Table of Contents

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High Density

Power Conversion

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Motor Control

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General Lighting

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Hybrid & Electric Vehicles

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