solder alloys
New tin bismuth based lead free solder alloys with superior properties for industrial applications
7
Vibration Fracture Behavior of Sn Bi Solder Alloys with Various Bi Contents
7
Investigation of Electrochemical Migration of Tin and Tin- Based Lead-Free Solder Alloys under Chloride-Containing Thin Electrolyte Layers
8
The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys
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Microstructure and Mechanical Properties of Sn 8 55Zn 1Ag XAl Solder Alloys
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Low temperature solder alloys for ultrasonic soldering of glass
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Study of Some Mechanical Properties and Wetting Behavior with Addition Bi to SnCu Solder Alloys
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Development of Sn Based, Low Melting Temperature Pb Free Solder Alloys
11
Pasty Ranges and Latent Heat Release Modes for Sn 9Zn xAg Lead free Solder Alloys
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Activity Measurement of the Constituents in Molten Sn Mg Zn Ternary Lead Free Solder Alloys by Mass Spectrometry
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Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys
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Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing
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Wettability of Lead Free Solders on Gold Plated Copper Substrates
5
Thermodynamics Aided Alloy Design and Evaluation of Pb free Solders for High Temperature Applications
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Applicability of an Exponential Law in Creep of Metals
9
Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni Bearing SAC305 Lead Free Solders by the Strain Rate Change Tensile Test
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To Investigate the Thermal and Mechanical Properties of Bismuth Doped SAC Solder
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Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
5
Effect of Bismuth Addition on Structure and Mechanical Properties of Tin 9Zinc Soldering Alloy
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Application of Thermal Latent Carboxylic Acid Derivatives to Pb Free Microsoldering
6