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solder alloys

New tin bismuth based lead free solder alloys with superior properties for industrial applications

New tin bismuth based lead free solder alloys with superior properties for industrial applications

... of solder being used by ...Sn63/Pb37 solder have melting points from 5 to 20 °C higher, though solders with much lower melting points are ...available. Solder alloys are categorized as either ...

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Vibration Fracture Behavior of Sn Bi Solder Alloys with Various Bi Contents

Vibration Fracture Behavior of Sn Bi Solder Alloys with Various Bi Contents

... when solder joints are assembled in automobile vehicles and aircraft, 12,13) in particular when the vibration frequency meets the resonant vibration of the structure, obviously, the vibration fracture resistance ...

7

Investigation of Electrochemical Migration of Tin and Tin- Based Lead-Free Solder Alloys under Chloride-Containing Thin Electrolyte Layers

Investigation of Electrochemical Migration of Tin and Tin- Based Lead-Free Solder Alloys under Chloride-Containing Thin Electrolyte Layers

... of solder alloys under 200-μm-thick electrolyte layers containing 1 mM NaCl at different bias ...-based alloys display longer failure time than that of tin, indicating that the addition of alloy ...

8

The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys

The Effects of Microstructure and Ag3Sn and Cu6Sn5 Intermetallics on the Electrochemical Behavior of Sn-Ag and Sn-Cu Solder Alloys

... Sn-Ag alloys can be considered as promising solder alternatives, few studies highlighting the effects of the morphologies and scales of the phases constituting their microstructures on the corresponding ...

17

Microstructure and Mechanical Properties of Sn 8 55Zn 1Ag XAl Solder Alloys

Microstructure and Mechanical Properties of Sn 8 55Zn 1Ag XAl Solder Alloys

... Sn-8.55Zn-1Ag-XAl solder alloys were prepared from pure elements with ...Sn-8.55Zn-1Ag-XAl alloys inves- tigated ranges from 0.01 to 0.45 mass%. The molten alloys were homogenized at 773 K for ...

6

Low temperature 
		solder alloys for ultrasonic soldering of glass

Low temperature solder alloys for ultrasonic soldering of glass

... both solder alloys were obtained using Hitachi STA7300 thermogravimetric ...on solder joint between glass specimens soldered with (Sn40Bi) ...both solder joints at 25000X ...

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Study of Some Mechanical Properties and Wetting Behavior with Addition Bi to SnCu Solder Alloys

Study of Some Mechanical Properties and Wetting Behavior with Addition Bi to SnCu Solder Alloys

... as-cast alloys at room temperature have been ...solder alloys. These improved properties indicate that these alloys are adequate for low temperature soldering ...

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Development of Sn Based, Low Melting Temperature Pb Free Solder Alloys

Development of Sn Based, Low Melting Temperature Pb Free Solder Alloys

... The Sn-based, matrix phase composition was determined for the following alloys: 96.5Sn-3.5Ag; the three ternary alloys; the 86.8Sn-3.2Ag-5.0Bi-5.0Au quaternary alloy, as well as the ...

11

Pasty Ranges and Latent Heat Release Modes for Sn 9Zn xAg Lead free Solder Alloys

Pasty Ranges and Latent Heat Release Modes for Sn 9Zn xAg Lead free Solder Alloys

... compositions of the alloys are analyzed and shown in Table 1. The equipments used in this study include a crucible, two K- type thermocouples, a data logger, and a heating furnace. The crucible is made out of 0.5 ...

9

Activity Measurement of the Constituents in Molten Sn Mg Zn Ternary
Lead Free Solder Alloys by Mass Spectrometry

Activity Measurement of the Constituents in Molten Sn Mg Zn Ternary Lead Free Solder Alloys by Mass Spectrometry

... Pb-free solder, Sn–Mg–Zn, were studied experimentally using a mass spectrom- ...binary alloys, the excess Gibbs free energy of liquid Sn–Mg–Zn ternary alloy was ...

7

Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys

Electrochemical Corrosion Behavior, Microstructure and Soldering Properties of Tin Based Alloys

... process. Solder joining is a wetting process followed by a chemical ...molten solder and the joining metallurgy to form an intermetallic phase region at the ...interface. Solder alloys are ...

11

Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

Acoustic Microscopy of Interfacial Crack in Sn Ag Cu Alloy Solder Joints under Shear Fatigue Testing

... lead-free solder alloys and the constants A and m were measured for the mode I crack propagation, no reports on the mode II crack ...lead-free solder alloy 8) was used in the present ...

8

Wettability of Lead Free Solders on Gold Plated Copper Substrates

Wettability of Lead Free Solders on Gold Plated Copper Substrates

... Wettability of lead-free solders (Sn-3Ag-0.5Cu, Sn-8Zn-3Bi, and Sn-9Zn) on Au-plated copper substrate was investigated with three different thicknesses of Au layer (0.1 mm, 0.3 mm, and 0.5 mm). The contact angles of ...

5

Thermodynamics Aided Alloy Design and Evaluation of
Pb free Solders for High Temperature Applications

Thermodynamics Aided Alloy Design and Evaluation of Pb free Solders for High Temperature Applications

... High-Pb solder alloys such as 95Pb–5Sn (numbers are all in mass% unless specified otherwise) are currently being used for this ...Pb-free solder alloy for high temperature applications is needed due ...

6

Applicability of an Exponential Law in Creep of Metals

Applicability of an Exponential Law in Creep of Metals

... free solder alloys were also determined using a conventional creep equation like ...the solder alloy is essentially same with the other researchers and, thus, the creep data shown in ...

9

Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni Bearing SAC305 Lead Free Solders by the Strain Rate Change Tensile Test

Estimation of the Thermal Fatigue Resistance and Creep Properties of the Co/Ni Bearing SAC305 Lead Free Solders by the Strain Rate Change Tensile Test

... the solder materials. Even during service conditions, the solder alloys are subjected to creep and fatigue deformation duo to their low melting ...the solder alloys are much ...

5

To Investigate the Thermal and Mechanical Properties of Bismuth Doped SAC Solder

To Investigate the Thermal and Mechanical Properties of Bismuth Doped SAC Solder

... from solder alloys led to the very fast introduction of lead-free solder alloys without a deep knowledge of their ...successful solder material, Pb free alloys need to be ...

11

Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test

Microstructures Variations of Sn 9Zn 1Al and Sn 8Zn 3Bi Solder Pastes with Sn 3 8Ag 0 7Cu Solder Balls on OSP PCBs after Thermal Cycling Test

... Sn­Zn solder alloys increased the solder joint’s strength due to the precipitation of the Zn rich phase, which also decreased the melting point of the solder alloy from ...Sn­Zn solder ...

5

Effect of Bismuth Addition on Structure and Mechanical Properties of Tin 9Zinc Soldering Alloy

Effect of Bismuth Addition on Structure and Mechanical Properties of Tin 9Zinc Soldering Alloy

... Sn-Zn-Bi solder alloys were prepared by using Tin, Zinc and Bi with ...Four alloys compositions were prepared and studied ...cast alloys were sectioned using ...

7

Application of Thermal Latent Carboxylic Acid Derivatives to Pb Free Microsoldering

Application of Thermal Latent Carboxylic Acid Derivatives to Pb Free Microsoldering

... in solder paste, but without exhibiting good ...and solder alloys, the surface of solder mixed with glutaric acid di(2-propoxyethyl) ester was observed using a scanning electron microscope ...

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