What is this course is about? Design of Digital Circuitsit. Digital Integrated Circuits. What is this course is about?

(1)

Design of Digital Ci it

EE4143 Design of Digital Circuits

Circuits

What is this course is about?

 Design of digital microelectronic circuits.

» CMOS devices and manufacturing technology.

» Digital gates. Propagation delay, noise margins, and power dissipation.

» Programmable logic arrays and FPGAs.

» Microelectronic circuits, simulation, verification, and specification.

» Structural design concepts, design tools.

» VHDL language, data types, objects, operators, control statements, concurrent statements, functions, and procedures.

» VHDL modeling techniques, algorithmic, RTL, and gate level designs.

What is this course is about?

Design of digital microelectronic circuits.

» VLSI fabrication process.

» Design rules, Design synthesis, Logic design.

» Performance estimation, chip engineering.

» Emphasis on virtual prototyping, circuit design, optimization,

p p yp g g p

verification, and testing.

What will you learn?

» Understanding, designing, and optimizing digital circuits with respect to different quality metrics: cost, speed, power dissipation, and reliability

» Hardware programming language

» Behavioral and structural design concepts

» Design benchmarking and test.



What is meant by VLSI?



Brief history of evolution



Today’s Chips

Digital Integrated Circuits

Today s Chips



Moore’s Law



Digital circuit applications



Design challenges



Machines Making Machines

What is a VLSI Circuit?

VERY LARGE SCALE

A circuit that has 10k ~ Technique where many INTEGRATED CIRCUIT

1Bln transistors on a single chip

•Still growing as number of transistors on chip quadruple every 24 months (Moore’s law!)

circuit components and the wiring that connects them are manufactured simultaneously on a compact chip (die)

Brief History

The First Computer: Babbage Difference Engine (1832)

•Executed basic operations (add, sub, mult, div) in arbitrary sequences

•Operated in two-cycle “St ” d “Mill”

sequence, “Store”, and “Mill”

(execute)

•Included features like pipelining to make it faster.

•Complexity: 25,000 parts.

•Cost: £17,470 (in 1834!)

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The Electrical Solution

•More cost effective

•Early systems used relays to make simple logic devices

•Still used today in some train safety systems

•Th V T b

•The Vacuum Tube

•Originally used for analog processing

•Later, complete digital computers realized High Point of Tubes: The ENIAC

•18,000 vacuum tubes

•80 ft long, 8.5 ft high, several feet wide

ENIAC - The first electronic computer (1946)

Dawn of the Transistor Age

1947: Bardeen and Brattain create point-contact transistor

1951: Shockley develops junction transistor which can be manufactured in quantity.

w/two PN junctions. Gain = 18p

Early Integration

Jack Kilby, working at Texas Instruments, invented a monolithic “integrated circuit” in July 1959.

He had constructed the flip-flop shown in the patent drawing above.

Early Integration

In mid 1959, Noyce develops the first true IC using planar transistors,

•back-to-back pn junctions for isolation

isolation

•diode-isolated silicon resistors and

•SiO2 insulation

•evaporated metal wiring on top

Practice Makes Perfect

1961: TI and Fairchild introduced first logic IC’s

(cost ~ $50 in quantity!) This is a (cost ~ $50 in quantity!). This is a dual flip-flop with 4 transistors.

1963: Densities and yields improve. This circuit has four flip-flops.

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Practice Makes Perfect

1967: Fairchild markets the first semi-custom chip. Transistors (organized in columns) can be easily rewired to create different circuits

rewired to create different circuits.

Circuit has ~150 logic gates.

1968: Noyce and Moore leave Fairchild to form Intel. By 1971 Intel had 500 employees;

By 2004, 80,000 employees in 55 countries and

$34.2B in sales.

The Big Bang

1970: Intel starts selling a 1k bit RAM, the 1103.

1971: Ted Hoff at Intel designed the first microprocessor. The 4004 had 4-bit busses and a clock rate of 108 KHz. It had 2300 transistors and was built in a 10 um process.

Exponential Growth

1972: 8080 introduced.

Had 3,500 transistors supporting a byte-wide data path.

1974: Introduction of the 8088.

Had 6,000 transistors in a 6 um process. The clock rate was 2 MHz.

Today

Many disciplines have contributed to the current state of the art in VLSI Design:

•Solid State Physics M i l S i

•Circuit design and layout

•Materials Science

•Lithography and fab

•Device modeling

layout

•Architecture design

•Algorithms

•CAD tools To come up with chips like:

Intel Pentium

Intel®

Intel® Pentium®Pentium® 44 Intel®

Intel® Celeron®Celeron® DD Intel®

Intel® Pentium®Pentium® MM

Intel®

Intel® Itanium®Itanium® 22 Intel®

Intel® Xeon™Xeon™

Intel®

Intel® PCAPCA CellularCellular Intel®

Intel® IXPIXP465465 NetworkNetwork Intel®

Intel® MXPMXP58005800 DigitalDigital MediaMedia

•Actually a MCM comprising of microprocessor and L2 cache

Pentium Pro

Why not make it on one chip?

(4)

Today

Sun UltraSparc

UltraSPARC IV

UltraSPARC III UltraSPARC IIIi UltraSPARC IIi UltraSPARC IIe

Pentium 4

»Introduction date: November 20, 2000

– 1.4 GHz clock

– fabricated in 180 nm process, 42 l t i t )

– 42 mln transistors)

»In 2002 (2 GHz in 130 nm, 55 mln transistors)

»In 2005 (3.8 GHz in 90 nm, 125 mln transistors)

»Typical Use: Desktops and entry-level workstations

•

IBM chip has nine processor cores

•

192 billion

Supercomputer for Sony's PlayStation 3

•

192 billion floating-point operations per second (192 G)

•

Typical Use:

multimedia

• ^{In 2006}

• ^{143 mm}

²

• 3 GHZ operation

Intel Core 2 Microprocessor

3 GHZ operation

• 65 nm CMOS technology

• 291 mln transistors

Other chips

IDT R5000 IBM Power PC 601

Other chips

cyrix_math_coprocessor_83S87 Fairchild Clipper C100

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Other chips

EE4143 Design of Digital Circuitsfrom http://micro.magnet.fsu.edu/chipshots/index.html Fujitsu 68903

HP PA8000

Other chips

EE4143 Design of Digital Circuitsfrom http://micro.magnet.fsu.edu/chipshots/index.html Motorola MC68020

IBM/Motorola Power PC620

Evolution of Electronics

Moore’s Law



In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 12 months.

y



He made a prediction that

semiconductor technology will double its effectiveness every 18 months

Moore’s Law

1 6 1 5 1 4 1 3 1 2 1 1 1 0 9 NUMBER OF EGRATED FUNCTION

EE4143 Design of Digital Circuits 8 7 6 5 4 3 2 1 0

1959 1960 1961 1962 1963 1964 1965 1966 1967 1968 1969 1970 1971 1972 1973 1974 1975

LOG2 OF THE N COMPONENTS PER INTE

Electronics, April 19, 1965.

Technology Directions: SIA Roadmap

Year 1999 2002 2005 2008 2011 2014 Feature size (nm) 180 130 100 70 50 35 Logic trans/cm² 6.2M 18M 39M 84M 180M 390M Cost/trans (mc) 1 735 580 255 110 049 022

Cost/trans (mc) 1.735 .580 .255 .110 .049 .022

#pads/chip 1867 2553 3492 4776 6532 8935 Clock (MHz) 1250 2100 3500 6000 10000 16900 Chip size (mm²) 340 430 520 620 750 900

Wiring levels 6-7 7 7-8 8-9 9 10

Power supply (V) 1.8 1.5 1.2 0.9 0.6 0.5 High-perf pow (W) 90 130 160 170 175 183

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Evolution in Complexity

Transistor Counts

1,000,000 100,000 10,000 K

1,000

10 100

1

1970 1975 1980 1985 1990 1995 2000 2005 Source: Intel Source: Intel

Projected Projected Courtesy, Intel

Moore’s law in Microprocessors

486Pentium® procP6 1

10 100 1000

stors (MT) 2X growth in 1.96 years!

400480088080 8085 8086

286386 86

0.001 0.01 0.1 1

1970 1980 1990 2000 2010

Year

Transis

Transistors on Lead Microprocessors double every 2 years Courtesy, Intel

Die Size Growth

486 Pentium ® procP6 10

100

e (mm)

40048008 8080

80858086286386486 p

1 10

1970 1980 1990 2000 2010

Year

Die size

~7% growth per year

~2X growth in 10 years

Die size grows by 14% to satisfy Moore’s Law Courtesy, Intel

Frequency

CMOS

Lead Microprocessors frequency doubles every 2 years nMOS

Power dissipation warning in 2000

5KW 18KW

1.5KW 500W Pentium® proc 100

1000 10000 100000

(Watts)

40048008808080858086286 386486

0.1 1 10 100

1971 1974 1978 1985 1992 2000 2004 2008 Year

Power (

Did this really happen?

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Power Dissipation

Lead Microprocessors power increase Courtesy, Intel

Power density

100 1000 10000

sity (W/cm2)

Nuclear Reactor Rocket Nozzle

4004 8008 8080

8085 8086

286386

486Pentium® procP6 1

10 100

1970 1980 1990 2000 2010

Year

Power Dens

Hot Plate Reactor

Power density too high to keep junctions at low temp Courtesy, Intel

Cell Phones

Not Only Microprocessors

Video games

EE4143 Design of Digital Circuits Digital Cellular Market

(Phones Shipped) 1996 1997 1998 1999 2000 Units 48M 86M 162M 260M 435M

iPod Video games

Analog Baseband

Digital Baseband (DSP + MCU)

Power Management Small

Signal RF Power

RF

iTablet

Challenges in Digital Design

“Microscopic Problems”

• Ultra-high speed design

• Interconnect

“Macroscopic Issues”

• Time-to-Market

• Millions of Gates

• Interconnect

• Noise, Crosstalk

• Reliability, Manufacturability

• Power Dissipation

• Clock distribution.

Everything Looks a Little Different

Millions of Gates

• High-Level Abstractions

• Reuse & IP: Portability

• Predictability

• etc.

…and There’s a Lot of Them!

Productivity Trends

10,000 100,000 1,000,000 10,000,000

100,000 1,000,000 10,000,000 100,000,000 Logic Tr./Chip

Tr./Staff Month.

58%/Yr. compounded Complexity growth rate 10,000

1,000 100

10 sistor per Chip(M)

100 1,000 10,000 100,000

uctivity /Staff -Mo.

mplexity

Complexity outpaces design productivity

1 10 100 1,000

2003

1981 1983 1985 1987 1989 1991 1993 1995 1997 1999 2001 2005 2007 2009

10 100 1,000 10,000

x x x xx x

x

21%/Yr. compound Productivity growth rate x

1 0.1 0.01 0.001

Logic Trans

0.01 0.1 1 10

Produ (K) Trans./

Source: Sematech

Com

Courtesy, ITRS Roadmap

Definitions

 Wafer– a thin circular silicon

 Each wafer holds hundreds of dies

 Transistors and wiring are made from many layers (usually 10 – 15) built on top of one another

» the first half-dozen or so layers define transistors

th d d fi th t l i b t t i t

» the second define the metal wires between transistors

 Lambda ()– the smallest resolvable feature size imprinted on the IC;

it is roughly half the length of the smallest transistor

» 0.2m IC – the smallest transistors are approximately 0.2m in length (= 0.1m)

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Why Scaling?

Technology shrinks by 0.7/generation

With every generation can integrate 2x more functions per chip for about the same $/chip

Cost of a function decreases by 2x

But …

»How to design chips with more and more functions?

»Design engineering population does not double every two years…

Hence, a need for more efficient design methods

»Exploit different levels of abstraction

Design Flow

Design Abstraction Levels

+

MODULE SYSTEM

n+

S G

D +

DEVICE CIRCUIT GATE

What is this course is about? Design of Digital Circuitsit. Digital Integrated Circuits. What is this course is about?

Design of Digital Ci it

Circuits

What is this course is about?

What is this course is about?

What is meant by VLSI?

Brief history of evolution

Today’s Chips

Digital Integrated Circuits

Today s Chips

Moore’s Law

Digital circuit applications

Design challenges

Machines Making Machines

What is a VLSI Circuit?

Brief History

The Electrical Solution

ENIAC - The first electronic computer (1946)

Dawn of the Transistor Age

Early Integration

Early Integration

Practice Makes Perfect

Practice Makes Perfect

The Big Bang

Exponential Growth

Today

Intel Pentium

Pentium Pro

Today

Pentium 4

•

•

Supercomputer for Sony's PlayStation 3

•

•

• In 2006

• 143 mm

• 3 GHZ operation

Intel Core 2 Microprocessor

3 GHZ operation

• 65 nm CMOS technology

• 291 mln transistors

Other chips

Other chips

Other chips

Other chips

Evolution of Electronics

Moore’s Law

In 1965, Gordon Moore noted that the number of transistors on a chip doubled every 12 months.

y

He made a prediction that

semiconductor technology will double its effectiveness every 18 months

Moore’s Law

Technology Directions: SIA Roadmap

Evolution in Complexity

Transistor Counts

Moore’s law in Microprocessors

Die Size Growth

Frequency

Power dissipation warning in 2000

Power Dissipation

Power density

Not Only Microprocessors

Challenges in Digital Design

Productivity Trends

Definitions

Why Scaling?

Design Flow

Design Abstraction Levels

• ^{In 2006}

• ^{143 mm}