2021 PCB DEVELOPMENT FOR FUTURE AUTOMOTIVE TECHNOLOGY. Tracy Watt, VP-KCE Electronics

2021

PCB DEVELOPMENT

FOR FUTURE AUTOMOTIVE

TECHNOLOGY

Phase 1: BODY CONTROLS: Comfort & Convenience

• Dashboards

• Instrument Clusters • Door Control Units • Car Radios

• Wipers Lighting

• Sensors ( Rain, Seat , Speed, etc ) • Remote Keyless Entry

• Seat Positioning • Heads up Display • Sunroof • Power Windows • Security Systems • Cruise Controls

PCB Requirements :

• Low Layer Count ( 2-4L )

• Low Density Interconnect ( 300+ uM ) • Standard FR-4 Laminate

• Eutectic Solder

1980’s

KCE has more than 35 Years Experience Manufacturing

Printed Circuit Boards for Automotive Electronics Applications

KCE HISTORY OF AUTOMOTIVE ELECTRONICS

Phase 2: Power Train, Dynamics, Safety : Critical Applications

• ABS (Anti Lock Brake Systems) • FEI (Electronics Ignition Controls)

• EFI ( Electronic Fuel Injection Systems) • TCS (Traction Control Systems)

• EPS (Electronic Power Steering) • ESP (Electronic Stability Programs) • TPM ( Tire Pressure Monitor Systems) • Emission Controls

• Airbag Sensor Controller • Passive Restraint system • Fatigue Warning

• Engine Control Unit

• Battery Management Systems

PCB Requirements:

• Increasing Layers ( 4 – 8 L )

• Increasing Density ( 125 - 150uM ) • Higher Thermal Resistance

• Lead Free Solder

1990’s – 2000’s : KCE Continued to produce more advanced

Printed Circuit Boards for under the hood and safety applications.

KCE HISTORY OF AUTOMOTIVE ELECTRONICS

Phase 3 : ADAS, e-mobility

• Lane Departure Warning System • Self Parking

• Blind Spot Warning • Pedestrian Detection • Collision Avoidance • Cameras

• Automatic Emergency Braking • Rollover Crash Sensor

• Anti-theft Immobilization • RF Sensors

• Infotainment, Telematics • On Board Chargers

• Battery management

• Mild / Pluggable Hybrid EV’s

PCB Requirements :

• HDI microvia Technology • High Layer Count ( 8 – 16 L )

• Very High Density ( 75 – 100 uM ) • Low Loss Materials for Radar Sensing • Heavy Cu – High Voltage / High Current • Thermal Management

2010’s – Today: KCE has continued to develop products and

Improve processes to meet PCB requirements of Advanced

Driving Assist Systems, and electric vehicles

KCE FUTURE OF PCB’s FOR AUTOMOTIVE ELECTRONICS

Phase 4 : Autonomous , Electrified, Connected, Smart

•

Transition from ADAS to Full Autonomous Driving ( ZERO Accidents )

•

Electrification of the Powertrain ( Gov’t mandated CO2 reduction )

•

Full Connectivity of V2V, V2I, V2X ( Intelligent Transportation System )

•

Smart Mobility ( Security, Ridesharing, Comfort )

FUTURE : KCE is investing in new processes and new production

capability to meet the electronic requirements of

AUTOMOTIVE ELECTRONICS: AUTONOMOUS MOBILITY

• SENSORS: Cameras, Radar, Lidar, Ultrasonic • PROCESSORS: CPU, ECU, DCU, GPS, AI

• ACTUATORS: Smart Steering, Braking, Powertrain, Suspension

• INTERACTION : V2X, 5G, WiFi, Bluetooth, Satellite, Haptic, Facial recognition

Powertrain Battery Voltage Batt. Capacity Battery Power Application Internal Combustion

Engine 12V / 24 V 0.4 - 1.2 kW/hr 2.4 - 3.6 kW Standard Electronics and convenience features Mild Hybrid Assist 48V 1 - 2 kW/hr 5 - 12 kW mild hybrid drive for boost and energy recuperation functions

HEV / PHEV > 80V 2 - 10 kW/hr > 12 kW Full Hybrid and Electric Vehicles for boost, recuperation and Electric Driving

EV >300V 20 - 60 kW/hr All Electric Drive

AUTOMOTIVE ELECTRONICS: ELECTRIFICATION

High Voltage, High Current, Thermal Management for EV Electronics:

• Decline of the Internal Combustion Engine

• Rapid ascent of Hybrid and Battery Electric Vehicles

ELECTRONICS FUNCTION PRINTED CIRCUIT BOARD DESIGN IMPACT Power Converter Convert DC Voltages ( Batteries ) to AC Voltage that drives motors Heavy Copper for High Volt / Current Distribution

High CTI Laminate DC to DC Converters Boost Voltage for Traction motor and Reduce Voltage for vehicle accessories

Battery Management Monitor and maintain safe and reliable battery operation _{Thermal Management, High Voltage CAF Resistance}

AC to DC Converters Convert Grid Power AC to DC for PHEV Pluggable Charging

AUTOMOTIVE ELECTRONICS: ELECTRIFICATION

AUTOMOTIVE ELECTRONICS : CONNECTIVITY ( V2V & V2X )

High Frequency, Low Loss Substrates for Radar and Connectivity:

High Frequency, high band width, network Telecom will necessitate special materials with advanced electrical properties ( PTFE, PPO, PPE )

AUTOMOTIVE ELECTRONICS : IMPACT ON PCB MANUFACTURING

KEY TECH DRIVERS OF FUTURE AUTOMOTIVE ELECTRONICS: 1) Increased I/O Density :

• HDI Blind and Buried Via Interconnection • Stacked microvias ( copper fill plated vias )

• Smaller Aspect Ratio ( ( hole diameter to depth ) 2) Higher Integration

• Crosstalk emission ( Electromagnetic shielding ) • Power Management

• High Frequency Low Loss Dielectrics

• Inverter / Converter ( Battery @ kW, Antenna @ mW ) 3) Thermal Management

• Up to 400 uM thick copper layers ( std. 35 uM ) • Low CTE, Dimensional stability

• Electro-migration / CAF Resistance • Insulated Metal Substrates

AUTOMOTIVE ELECTRONICS : HIGH DENSTY INTERCONNECT

HDI MICROVIA CURRENT NEW PRODUCT FUTURE

ADVANCED DEVELOPMENT DEVELOPMENT LASER DRILLED BLIND VIA DIAMETER 0.10 mm 0.075 mm 0.065

TARGET /CAPTURE PAD SIZE Drill + 0.20 mm Drill + 0.15 mm Drill + 0.10 mm LASER BLIND VIA DEPTH 0.135 mm 0.150 mm (L1 - L3 skipped ) 0.25 mm LASER BLIND VIA ASPECT RATIO 0.8:1 1.0:1 1.2:1 COPPER FILL PLATING ASPECT RATIO 0.75:1 0.9:1 1.2:1

HDI CONSTRUCTION 3 - N - 3 ALIV ( Any layer connect via ) TYPE IV ( metal core ) BGA PITCH 0.40 mm 0.30 mm 0.25 mm VIA IN PAD FILLED / CAP PLATED CONDUCTIVE FILLED

High Density Interconnection ( HDI ) capability is an absolute requirement for next generation Automotive electronics.

PCB Manufacturing must constantly improve laser drilling, copper fill plating, Stacked via lamination to meet the constant increase in circuit density

AUTOMOTIVE ELECTRONICS : MINIATURIZATION

INTERCONNECT DENSITY CURRENT NEW PRODUCT FUTURE

ADVANCED DEVELOPMENT DEVELOPMENT

LAYER COUNT _{2 - 16 16 - 24 > 24}

CIRCUIT DENSITY > 0.075 mm 0.050 - 0.075 mm < 0.050mm ( mSAP )

PAD SIZE OVER DRILL SIZE ( I/L ) _{Drill + 0.25 mm Drill + 0.20 mm padless} PAD SIZE OVER DRILL SIZE ( O/L ) _{Drill + 0.20 mm Drill + 0.15 mm padless / teardrop}

MINIMUM CORE THICKNESS 0.065 mm 0.050 mm

MINIMUM PREPREG THICKNESS _{0.065 mm 0.045 mm 0.035 mm} MINIMUM MECHANICAL DRILL 0.20 mm 0.15 mm

MAXIMUM ASPECT RATIO 10:1 12:1 15:1

MINIMUM BOARD THICKENSS 0.4 mm 0.3 mm 0.2 mm

MAXIMUM BOARD THICKNESS 3.2 mm 3.75 mm 4.0 mm

MECHANICAL DEPTH DRILL 0.30 mm 0.70 mm 1.0 mm

DEPTH CONTROL DRILL ASPECT RATIO 0.60:1 0.80:1 1:1

Automotive Electronics are constantly increasing in functionality and complexity while at the same time are shrinking in size and weight. PCB Industry must constantly improve capability for circuit density

AUTOMOTIVE ELECTRONICS: FUTURE CIRCUIT DENSITIES

2019 2020 2021 2022 2023

uVia Dia. (uM)

150

125

100

75

50

uVia AR

0.7:1

0.8:1

1:1

1.1:1

1.2:1

Min. L/S (uM)

125

100

75

50

30

Cu Foil (uM)

17

12

9

5

2

BGA size (uM)

650

500

400

350

300

Technology

_Subtractive

_mSAP

PCB Industry must install new technologies ( mSAP process , Plasma,

Conductive Polymer, Insoluble anode VCP plating, laser drilling, ) to

be able to produce the Printed circuit board designs of next

• Hybrid Construction : Std. FR4 with Low Loss Dielectrics • Low loss for mid range detection : ( Df : 0.002 – 0.0035 ) • Ultra low loss for high Resolution : ( Df: 0.0013 – 0.0017 )

High Performance Materials ( 77 GHz )

Integrated Antennas built into the PCB

• Line Width Etch Control ( +/- 10 um ) • Cu plating thickness control ( +/- 5 um ) • Controlled Dielectric thickness ( +/- 10% )

Signal Integrity to prevent EMI

• Controlled Depth mechanical drilling • High Aspect ratio blind Via Plating • Back drilling for Stub removal

• Edge Plating for Shielding

AUTOMOTIVE ELECTRONICS : RADAR SENSORS

ADVANCED EQUIMENT FOR AUTOMOTIVE ELECTRONICS

PCB Manufacturing must purchase and install the latest and most advanced Manufacturing equipment to meet the constant increase in complexity

of automotive electronics:

LASER DRILLING for Blind MIcrovias

LASER DIRECT IMAGING for Circuitry < 75 uM

Horizontal CP Plating Lines for Blind microvia and high AR holes

VCP Plating Line for copper fill Plating of blind microvias

ADVANCED EQUIPMENT FOR AUTOMOTIVE ELECTRONICS

Plasma Desmear for Low Loss Dielectrics for RF Sensors

Resin filling for Buried vias and Via in Pad Technology

4 wire Electrical Tester for High Reliability Interconnects Flying Probe Electrical Testers For Ultra High Density Circuits

FUTURE AUTOMOTIVE ELECTRONICS : SUMMARY

• The automotive of the future will be a high performance computer with the networking capabilities of a telecommunication system powered by non polluting environmental friendly technology.

• For Thailand to remain the ‘Hub’ for Automotive production in SEA, We must change our idea of the automobile as a mechanical method of transport. • Mobility of the future will be fully integrated, digital, smart, clean,

safe and connected transportation system.

• PCB industry in Thailand must continue to develop new technologies, add more advanced equipment and improve production methods

to survive and adapt to the changes in automotive technology.

• PCB industry in Thailand will need Government support to incentivize

the activities necessary to transition from traditional automobile electronics to the most advanced mobility electronics of the future.