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INTRODUCTION

INTRODUCTION

A heat exchanger is a device that is used to transfer thermal energy (enthalpy) A heat exchanger is a device that is used to transfer thermal energy (enthalpy)  between two or more flu

 between two or more fluids, between a solid suids, between a solid surface and a fluid, or between sorface and a fluid, or between solid particulateslid particulates and a fluid, at different temperatures and in thermal contact. [3].he goal of enhancing heat and a fluid, at different temperatures and in thermal contact. [3].he goal of enhancing heat tra

transfnsfer er whwhile ile minminimiimi!in!ing g prepressussure re drodrops ps and and redreduciucingtngthe he si!si!e e and and volvolume ume of of eneenergyrgy conversion"thermal management systems has beenthe sub#ect of intensive research for more conversion"thermal management systems has beenthe sub#ect of intensive research for more than four decades. $ut

than four decades. $ut growing energydemands, the need for increased energy efficiency andgrowing energydemands, the need for increased energy efficiency and materials savings, spacelimitations for device pac%aging, and increased functionality and materials savings, spacelimitations for device pac%aging, and increased functionality and eas

ease e of of ununithithandandlinling g havhave e crecreateated d revrevoluolutiotionary nary chachallellengenges s for for the the devdeveloelopmpment ent of of  highperformance, next&generation heat and mass exchangers. 'urrent heat

highperformance, next&generation heat and mass exchangers. 'urrent heat exchanger designsexchanger designs rely heavily on fin&and& tube or plate heat exchanger designs, often constructed using copper  rely heavily on fin&and& tube or plate heat exchanger designs, often constructed using copper  and aluminum. he strive for heat

and aluminum. he strive for heat exchangers that are more compact exchangers that are more compact and highly efficient hasand highly efficient has led to the development of microchannel heat exchangers.

led to the development of microchannel heat exchangers.

The innovative microchannel heat and mass exchangers appear to be the mostpromising

The innovative microchannel heat and mass exchangers appear to be the mostpromising

way to meet these challenges in thermal management. When properlydesigned and

way to meet these challenges in thermal management. When properlydesigned and

utilized, microchannels can distribute the flow precisely among thechannels, reduce

utilized, microchannels can distribute the flow precisely among thechannels, reduce

flow travel length, and establish laminar flow in the channelswhile achieving high heat

flow travel length, and establish laminar flow in the channelswhile achieving high heat

transfer coefficients, high surface area-to-volume ratios,and reduced overall pressure

transfer coefficients, high surface area-to-volume ratios,and reduced overall pressure

drops. These are among the major advantages ofmicrochannels for use in a diverse

drops. These are among the major advantages ofmicrochannels for use in a diverse

range of industries

range of industries

..

ecent developments in material sciences, in particular advances in ceramics and ceramic ecent developments in material sciences, in particular advances in ceramics and ceramic matrix composites open opportunities for new heat

matrix composites open opportunities for new heat exchanger designs. 'eramic materialsexchanger designs. 'eramic materials offer potentially significant advantages compared to metal alternatives. A ma#or advantage is offer potentially significant advantages compared to metal alternatives. A ma#or advantage is

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the capability to operate at very high temperature. 'eramics

the capability to operate at very high temperature. 'eramics are also much more tolerant toare also much more tolerant to harsh chemical environments than metals. $ecause the oxide ceramics can tolerate strongly harsh chemical environments than metals. $ecause the oxide ceramics can tolerate strongly oxidi!ing environments

oxidi!ing environments, it may be , it may be possible to remove certain fouling deposits bypossible to remove certain fouling deposits by intermittently introducin

intermittently introducing oxygen to g oxygen to burn deposits []. he performance burn deposits []. he performance of counterflow heatof counterflow heat exchangers can be

exchangers can be improved with low thermal conductivitymaterials that impede axial wallimproved with low thermal conductivitymaterials that impede axial wall conduction. *or ceramic microchannel heat

conduction. *or ceramic microchannel heat exchangers thelow value of exchangers thelow value of conductivity hasconductivity has negligible effect on its performance [+].

negligible effect on its performance [+].

1.2 LITERATURE SURVEY 1.2 LITERATURE SURVEY

nly a few researches focus specifically on ceramic microchannel heat exchangers. nly a few researches focus specifically on ceramic microchannel heat exchangers. a%euchi et al. [+] developed and applied three dimensional models to assist the design of a a%euchi et al. [+] developed and applied three dimensional models to assist the design of a silicon&carbide (-i') heat exchanger for application to / nuclear reactors. -chulte& silicon&carbide (-i') heat exchanger for application to / nuclear reactors. -chulte& *ischedic% et al. [+] designed and tested -i' plate&and&fin heat exchangers for applications *ischedic% et al. [+] designed and tested -i' plate&and&fin heat exchangers for applications in

in biombiomass ass conveconversionrsion. . heiheir r desigdesignwas nwas also also suppsupported by orted by detadetailed iled threethree&dim&dimensioensionalnal modeling of fluid flow and con#ugate heat transfer. Alm et al.[+] designed and fabricated modeling of fluid flow and con#ugate heat transfer. Alm et al.[+] designed and fabricated small alumina microchannel counter& flow heat exchangers, and evaluated performance at small alumina microchannel counter& flow heat exchangers, and evaluated performance at low temperature using water as the wor%ing fluid. 0specially in small high&performance low temperature using water as the wor%ing fluid. 0specially in small high&performance counter&flow heat exchangers, it is well %nown that longitudinal conduction within the solid counter&flow heat exchangers, it is well %nown that longitudinal conduction within the solid materials can play an important role in performance.

materials can play an important role in performance.

Although the general formulation of longitudinal conduction isavailable in textboos,

Although the general formulation of longitudinal conduction isavailable in textboos,

more comprehensive analyses can beachieved via three-dimensional simulation of the

more comprehensive analyses can beachieved via three-dimensional simulation of the

fluid flow andconjugate heat transfer. Although correlations for fully developed,

fluid flow andconjugate heat transfer. Although correlations for fully developed,

steady-state, laminarflow, heat-transfer coefficients are readily available, details of theflow and

state, laminarflow, heat-transfer coefficients are readily available, details of theflow and

heat transfer within microchannels depend upon channeland manifold geometry.

heat transfer within microchannels depend upon channeland manifold geometry.

!randner et al."#$ exploredopportunities for enhancing heat transfer within channels by

!randner et al."#$ exploredopportunities for enhancing heat transfer within channels by

usingsmall obstructions that alter the flow patterns. %iofalo "#$ explored theeffects of

usingsmall obstructions that alter the flow patterns. %iofalo "#$ explored theeffects of

spatial variations in the local heat-transfer coefficient onthe longitudinal conduction. &n

spatial variations in the local heat-transfer coefficient onthe longitudinal conduction. &n

the study conducted by A.'ommers et al "#$ assessment of potential bene

the study conducted by A.'ommers et al "#$ assessment of potential bene

ff

ts of ceramic

ts of ceramic

materials (both monolithic and composite) for usein heat exchangers, and the and

materials (both monolithic and composite) for usein heat exchangers, and the and

feasibility for application in heat transfer systems was done. A detailed comparative

feasibility for application in heat transfer systems was done. A detailed comparative

study of application of metals and ceramics was done and besides the concept of

study of application of metals and ceramics was done and besides the concept of

application of ceramic matrix composites in heat exchangers was also discussed. A

application of ceramic matrix composites in heat exchangers was also discussed. A

detailed experimental study and performance assessment of a counter flow ceramic

detailed experimental study and performance assessment of a counter flow ceramic

microchannel heat exchanger was conducted by *.+ ee et al."$. This study highlights

microchannel heat exchanger was conducted by *.+ ee et al."$. This study highlights

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the performance of microchannel heat exchangers besides emphasizing the advantages

of ceramics over metals. The textboo undamentals /f 0eat 1xchanger 2esign by *.

'hah "3$ gives the basic definition, functioning of a typical microchannel heat

exchangers. 4ext 5eneration 6icrochannel 0eat 1xchangers by /hadi et al "7$ clearly

describes the advantages, applicatins and woring of various microchannel heat

exchangers.0eat Transfer And luid low &n 6inichannel And6icrochannles written

by'atish 5 andliar et al "8$ gives the detailed study and analysis of various flow

regimes that can happen in a microchannel heat exchangers

.

CERAMICS AND CERAMIC MATRIX COMPOSITES

-olis materials used in heat exchangers can be divided into four categories&  polymers, metals, ceramics and carbonaceous materials. 1oubtlessly the most widely adopted material is metal due to its high thermal conductivity. 2nstead of depending upon monolithic materials composite materials can also be employed. 'omposite materials offer  engineers an ability to create a limitless number of new material systems having uniue  properties that cannot be obtained using a single monolithic material. his approach to construction holds tremendous promise for future heat exchanger designs rather than selecting a single material, multiple materials may be selected and then tailored to meet the specific reuirements of the application. 'omposite materials are constructed of two or more materials, commonly referred to as constituents, and have characteristics derived from the individual constituents. he constituent that is continuous and which is often, but not always, present in the greater uantity in the composite istermed the matrix. he second constituent is referred to as the reinforcing phase, or reinforcement, as it enhances or  reinforces the properties of the matrix.

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2.1 CERAMICS

he American -ociety for esting and 4aterials (A-4) definesa ceramic material as "an article [whose] body is produced fromessentially inorganic, non- metallic substances and either is formedfrom a molten mass which solidifies on cooling, or is formed  andsimultaneously or subsequently matured by the action of the heat. 54ost ceramic materials are hard, porous and brittle so the use ofceramics in application often reuires methods for mitigating theproblems associated with these characteristics. 'eramic materialsare usually ionic or covalently bonded and may be

crystalline oramorphous in structure. $ecause of this type of electronic bonding,ceramics tend to fracture before undergoing plastic deformationoften resulting in fairly low tensile strength and generally poormaterial toughness. 4oreover, because these materials tend to beporous, the microscopic pores can act as stress concentratorsfurther decreasing the toughness and strength of ceramics. hesefactors can combine, leading to a catastrophic failure of the materialinstead of the normally more gentle modes of failure associatedwith metals.

2.2 ADVANTAGES OF CERAMICS

he two main advantages for using ceramic materials in heat exchanger construction over more traditional metallic materials are their temperature resistance and corrosion

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resistance. *irst, ceramic materials can withstand operating temperatures (i.e.+6777') that far

exceed those of conventional metallic alloys. *or example, the bul% material temperature of a heat exchanger made of carbon steel should not exceed 687'. -imilarly, the bul% material

temperature of a heat exchanger manufactured from stainless steel t ypically should not exceed 9877'. As a result, the heat exchanger must be protected in some applications. hermal

 protection can be accomplished by means of an environmental barrier coating that overlays the metal which has the effect ofadding a thermal resistance to the transfer of heat thereby reducing the overall performance of the unit. 2n other cases, the unit is operated in the parallel flow mode rather than the counterflow mode to maintain a lower overall material temperature. his mode of operation has the effect of increasing the lifetime of the heat exchanger at the expense of lowering the overall thermal efficiencyof the unit. Another commonly employed techniue is air dilution, where ambient air is added to the hot upstream exhaust gases upstream of the heat exchanger. his techniue also has the effect of lowering the overall efficiency of the heat exchanger.

he second ma#or advantage of ceramic&based heat exchangers is their resistance to corrosion and chemical erosion. 'orrosion which occurs under normal conditions is exacerbated by elevated operating temperatures. 4oreover, corrosion can occur in many different forms in an exhaust gas stream. *or example, an exhaust stream rich in oxygen can actually attac% a metallic surface. 2n this case, the diffusion of oxygen into the material causes scaling.Although this scaling initially forms a protective layer, the intermittentuse of  the heat exchanger and the resulting thermal cycling can cause the scale to fla%e off, exposing the underlying material to further attac%. ther possible gaseous constituents include sulfurand carbon which can also diffuse into the grain boundaries. hemigration of  sulfur into the grain boundaries forms eutectics thatmelt at temperatures significantly lower  than the material meltingtemperature. he diffusion of carbon into the metallic surfaceresults in the formation of carbides which can cause residualstresses and embrittlement to occur.

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2.3

 CERAMIC MATRIX COMPOSITES (CMCs)

Although the impetus behind the use of cera mics in the manufacturing and design of  heat exchangers arises from their excellent corrosive properties, their ability to withstand extremely high operating temperatures, and the economics of their use in heat recovery systems, radiant heating applications, and microreactors, ma#or obstacles facing the incorporation and use ofceramics in these systems remain. hese obstacles include ceramic metallicmechanical sealing, manufacturing costs and methods, and their brittleness in tension. herefore, to help meet the specific reuirements of the application, ceramic matrix composites ('4's) were developed to overcome the intrinsic brittleness and lac% of  reliability of monolithic ceramics.

%eramic matrix composites (%6%s) combine reinforcing ceramic phases within a

ceramic matrix to create materials with improved properties. The desirable

characteristics of %6%s include high-temperature stability, high thermal shoc

resistance, high hardness, high corrosion resistance, non-magnetic and nonconductive

properties, and greater versatility in providing uni9ue engineering solutions. The most

commonly used %6%s are nonoxide %6%s-namely carbon:carbon (%:%),

carbon:silicon carbide (%:'i%), and silicon carbide:silicon carbide ('i%:'i%). or their

merits, ceramics and %6%s are promising thermo structural materials for heat

exchangers (i.e. li9uid li9uid, li9uid gas, gas gas, etc.) used in severe environments such

as rocet and jet engines, gas turbines for power plants, heat shields for space vehicles,

fusion reactor walls, aircraft braes, heat treatmentfurnaces, etc. &n the following

sections, the properties of the most promising ceramic and %6% materials will be

presented along with identified industrial applications and recently improved

manufacturing methods

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MICRO HEAT EXCHANGERS

/eat exchangers are classified the basis of various parameters such as flow arrangement, compactness, construction etc. $ased upon the degree of compactness it is  broadly classified into compact and non&compact heat exchangers. but a more accurate classification differentiates compact heat exchangers as compact, meso and micro heat exchangers based upon the their surface area density or hydraulic diameter [3]. he surface area density factor, is defined as A gas&to&fluid exchanger is referred to as a compact heat exchanger if it incorporates a heat transfer surface having a surface area density greater than about :77 ; or a hydraulic diameter, 1h9mm for operating in a gas stream and 677 ; for 

operating in a liuid or phase&change stream. A laminar flow heat exchanger (also referred to as a meso heat exchanger) has a surface area density greater than about 3777 ; or +77 m 1h +

mm. he term micro heat exchanger is used if the surface area density is greater than about +8,777 ; (or + m 1h +77 m) [3].

A similar classification proposed by 4ehendale et al.[6] classifies flow passages in the dimension ranging from + to +77 as mmicrochannels, +77 to + mm as meso&channels, + to 9 mm as compact passages and above 8mm as conventional passages [6].

%ompared to shell-and-tube exchangers, compact heat exchangers are characterized by a

large heat transfer surface area per unit volume of the exchanger, resulting in reduced

space, weight, support structure and footprint, energy re9uirements and cost, as well as

improved process design and plant layout and processing conditions, together with low

fluid inventory. /f these micro heat exchangers are the most compact. !esides they

weigh less and provide more effective heat transfer. 6icrochannel is a suitable

techni9ue that can be employed to fabricate micro heat exchanger

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MICROCHANNEL HEAT EXCHANGERS

A typical ceramiccounter&flow microchannel heat&exchanger is shown in *ig +. he design has an overall footprint of 87 mm by +77 mm. 0ach flow layer contains +7 microchannels that are approximately 887 microns high and .<mmwide. he channel floors that separate the hot and cold streams are approximately 977 microns thic%. he axial gaps in channel ribs serve three purposes. he first is to enable pressure euali!ation between channels. he axial  pressure drop is approximately inversely proportional to the cube of the channel height, which means that small fabrication variations have a large impact upon flow distribution  between channels. hus, the gaps tend to improve flow distribution. he gaps serve a

secondary purpose by tending to reduce potentially deleterious longitude al wall conduction. 'onduction along the channel floors and ribs (i.e., parallel to the flow direction) is %nown to degrade counter&flowperformance toward the lower performance of coflow heat

exchangers, especially for high&effectiveness

Fig 4.1. Ceramic microchannel heat exchanger Fig 4.2.Exploded iew showing internal  [+] channel structure [+]

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A third beneficial effect of the rib gaps is to cause local entry&length boundary&layer   behavior as the flow enters the microchannel sections, which serves to increase local heat& transfer coefficients.As illustrated in *ig. 6. the hot and cold fluids enter through central holes from the bottom and exit via outboard holes at the top. 0ach of the internal layers is identical, but with alternating layers rotated +<77 relative to the underlying layer. he feed

and exhaust manifolds at the ends of the layers are designed such that there is exact alignment upon layer rotation. =sing identical layers reduces the manufacturing cost. ne of  flow directions can be reversed (i.e., inlet flow through the outboard holes), producing a coflow configuration. he heat exchangers to date have been fabricated with four flow layers (two hot and two cold), but are designed to accommodate more flow layers. he relatively large diameters of the central inlets and the outboard exhausts enable the use of many heat& exchanger layers. he large diameters also enable the staging of several heat exchangers without significant pressure drops in the connecting tubing.

&n order to understand the response and evaluate the performance of a ceramic

microchannel heat exchanger experimental analysis and simulation was carried out. *.+

ee et al."$ The results of experimental testing and simulations of the same are

discussed in the following sections

.

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THREE-DIMENSIONAL SIMULATION

he results of three&dimensional simulationsobtained by .> ?ee et al. [6]that predict  both fluid and solid&body temperatures are illustrated in *ig. 8.+ and 8.. hesesimulations are used to guide tradeoffs between heat transferperformance and reuirements of the fabrication process. 2n additionto fluid flow, the models predict the solid material thermal fields.@ocal thermal gradients cause local strain through thermal expansion,which in turn can lead to failure of the ceramics. he currentdesign is in its fifth generation, with each

generation

improvingperformance and manufacturability. he design is based uponsimulation using three&dimensional computational fluid

dynamics('*1), including the con#ugate heat transfer between fluids and solidmaterials. he '*1 models are implemented in *@=0. emperature&dependent properties are used for 

Fig 5.1 !ertical cut through a three-dimensional simulation, showing gas and solid  temperature fields. [+]

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air and for alumina.he results in *igs. 8.+ and 8. are for balanced air flow (i.e., thesame mass&flowrates through both the hot and cold inlets). he hotair enters at 877 7' and the cold

flow enters at 37 7'. he simulationsare based upon assuming that all external surfaces

areperfectly insulated. he results in *ig. 8.+ are for flow rates of+.8< x+7&3 %g s&+ (<7

standard liters per minute of air, slm) and*ig. 8. is for flow rates of 6.B3 x +7&6 %g s& + (8

slm). $oth airstreams enter from below, flow in opposite directions through themicrochannels, and then exhaust through tubes at the top. *ig. 8.+shows predicted

temperature fields on a vertical cut near theheat&exchanger centerline, in the middle of the first flow channelaway from the heat&exchanger centerline. *ig. 8.shows

temperaturefields at the mid&planes of a hot and a cold layer.he design process is assisted greatly by three&

dimensionalsimulations that are used to predict uantitatively the influence ofmanifold and channel geometry on heat exchanger performance.

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*or example, there are practical tradeoffs between increased heat transfer performance and increased pressure drop. 4anufacturing processes also introduce practical tradeoffs that must be considered.

&t is evident from both igs. 8.# and 8.7 that the axial temperaturevariations are

essentially one-dimensional (i.e., varying primarily inthe axial direction with little

variation across the short dimension).This is a desired result, leading to similar heat

transfer performancewithin all channels. ig. 8.7 shows that the floor layer (i.e.,

between hotand cold flows) is nearly uniform in the vertical direction and essentiallyat

the average temperature between the local mean temperaturesof the hot and cold air.

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Again, this is a desired result, indicatingrelatively little heat-transfer resistance through

the layer floors

.

ANALYSIS

0ven with comprehensive three&dimensional model in hand,analytic models provide great value in understanding performancetradeoffs and interpreting results. f course, the relatively simplermodels rely on significant approximations.2n compact primary&surface heat exchangers, the dominant heattransfer is between the hot and cold flow streams directly acrossthe separating wall, without the influence of extended surfacessuch as fins. he overall conductance =A between hot and cold streams can be represented in terms of contributing thermalresistances as

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where h is the heat&transfer coefficient between fluid and wall, A isthe primary surface area, % is the thermal conductivity of the wall,and t is the wall thic%ness. 2n optimi!ed primary&surface heatexchangers the conductive heat flux across the walls is relativelylow and the conduction distance is small (i.e., the wall thic%ness).'onseuently the thermal resistance of the wall t"%A s

can be smallrelative to the convective resistance even when low&conductivitywall materials are used. 2n contrast to extended&surface heatexchangers designs, which are often fabricated with high&conductivitymaterials (e.g., copper or aluminum), the following analysisshows that compact primary&surface heat exchangers do notnecessarily benefit from the use of high& conductivity materials.As a limiting case, assume steady, fully developed, laminar flowin high& aspect&ratio channels the usselt number is constant (i.e.,independent of eynolds number).

where 1h is the channel hydraulic diameter and % f  is the thermalconductivity of the fluid. 2t is

interesting to compare the relativethermal resistances of the convection and conduction. Assuming airas the fluid and a hydraulic diameter of 1hC 877 Dm, the convectiveheat&transfer 

coefficient is h C 887 E m& &+ Assuming anaverage thermal conductivity of +7 E m&+ &+

(alumina at around 87 o') and a wall thic%ness of t C 877 Dm, the ratio of conductivethermal resistance offered by the wall and the total thermal resistance(i.e., conduction and convection) is

&n other words, even with low-conductivity ceramics, the influenceof conduction across

the wall is very small.Although conduction across the wall (i.e., normal to the

flowdirections) does not contribute significantly to performance, longitudinalheat

conduction (i.e., parallel to the flow directions) can significantlydegrade counter-flow

heat exchanger performance. The effect of longitudinal conduction can be particularly

important in compactheat exchangerswith short distances ; between inlet and outlet

ports.The dimensionless longitudinal conduction parameter can be used to estimate the

effect of longitudinal conduction onperformance. &n this e9uation, A

c

 is the longitudinal

cross-sectionalarea of the wall and %

minC

 < %

 p

 is the minimumcapacity rate ( < isthe

mass-flow rate and %

 p

 is the heat capacity of the fluid)

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PERFORMANCE EVALUATION

.>.?ee et al[6] developed a ceramic microchannel heat exchanger and conducted experimental tests for performance evaluation. he test stand has been developed to measure heat exchanger performance. 4ass flow controllers areused to specify hot and cold inlet air  flow rates. he mass&flow controllers (Alicat -cientific 4'& 877-@F4) have specified accuracy of 7.<G of reading plus 7.G of full scale, corresponding to approximately . standard liters per minute at +87 standard liters per minute(slm) . ype&? thermocouples are used to measuretemperatures of the inlet and outlet air. he thermocouples (7mega?4H--& 79=&9) have specified accuracy to within .o' or 7.:8Gof measured temperature,

corresponding to about 8.9o' at :87o'./ot&side air is heated by passing room&temperature

air throughmultiple small tubes that are positioned within a large hightemperaturefurnace. he hot inlet temperature is varied bychanging the electrical input to the tube furnace. he settling timeassociated with changing inlet temperature by 87o' is approximately+8 minI

data is ta%en after waiting 37 min. nce the steadyinlet temperatures are achieved, the standard deviation temperaturevariation is less than 7.8o'. he mass&flow

controllers andthe furnace, as well as data collection, are

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ceramic heat exchangerbody. he graphite is compressed using molybdenum  bolts.4olybdenum is chosen because it has low thermal expansion, thustending to retain compression at high temperature. hermocouplesare positioned at the centerline of the inlet and outlet tubes, #ustupstream and downstream of the heat exchanger itself. Frior totesting, thic% fiberglass insulation is pac%ed around the assembly(heat exchanger and manifold). Although heat loss through theinsulation is not directly measured, the heat transfer from the hotflow is always measured to be within a few percent of the heattransferred to the cold stream.2n addition to reporting inlet and outlet temperatures, the netheat transferred and heat& exchanger effectiveness are also evaluated.he maximum heat that can possibly be transferred is given as where is the minimum capacity rate and and arethe hot and cold inlet temperatures, respectively. he capacity ratesare evaluated as ' C J ' p, where J is the mass&flow rate and ' p

is the heat capacity of the fluid. he heat exchanger effectivenessis defined as where H is the actual heat transferred. he actual heat transferred isevaluated in terms of the enthalpy change  between inlet and outlet flows.

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1. Inlet temperature

*ig. illustrates measured heat exchanger   performance asa function of hot& side inlet

temperature with hot& and cold&sideflow rates fixed at +.B: +7&3%gs&+ (+77 slm). 2n all cases the

coldsideinlet temperature is approximately 67 7'.

As the hot& side inlettemperature increases, heat transfer within the metal manifoldscan increase the cold&side inlet temperature by a few degrees. Atthe highest inlet temperature of :877', the net

heat transferred isapproximately :87 E and the effectiveness is nearly constant atapproximately 88G. he outlet temperatures and net heat transferred are nearly linear functions of the hot inlet temperature.

2. FlowRates

ig. =.3illustrates measured performance as a function ofbalanced inlet flow rates, with

the hot- and cold- side inlettemperatures fixed at 8>>

7

%

- 42 7 4 l c 3 9 7 3 33+ 2& 2 2 f $alanced now, +.B:x+7J s+f'old inlet, :C67 K' C!"#

$n"%&-Fig. easured heat exchanger performance as a function of inlet flow rates [6]

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and 677', respectively. At low flowrates, the

differences between inlet and outlet temperatures arehigh. As the flow rates increase, the hot&side outlet temperatureincreases, the cold&side outlet temperature decreases, and there isa net increase in heat transferred. he effectiveness decreases

fromapproximately :7G at low flow rates of 6.B3 x +7&6 %g s&+ (8 slm)to approximately 87G at the

highest flow rates of +87 slm.

3. Unbalanced Flow

*ig. :.6illustrates performance with unbalanced flow. 2n thiscase, the hot inlet flow is fixed at :77o' and +.8< x +7&3 %g s&+ (<7 slm), while the cold inlet flow rate varies from+.+<

x+7&3 %g s&+ to +.B: x +7&3 %g s&+ (97&+77 slm). $oth the hotandcold& side outlet temperatures

decrease as the cold&side flowrate increases. According to heat exchanger theory,

theeffectiveness is minimum when the ratio of inlet capacity rates is unity. 2nthe experiments shown in *ig. <, the mass&flow rates arecontrolled by mass&flow controllers. /owever, because the specificheat of air varies with temperature (for air at :77 7','

 pC++67 > %g&+ ? &+I at 877',

' pC+77< > %g&+ ? &+) and the averagetemperatures are different on the two sides, the capacity

rates arenot eual when the mass&flow rates are eual.

Mas* flow rale xlO-' (kg s ')

Fig. 7.3. easured performance as a function of cold-side inlet   flow rate with hot-side inlet temperature and flow rate fixed.

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4. Pressure Drop

*ig. :.8shows measured pressure drop under room&temperatureconditions and pressure drop predicted by the three&dimensional'*1 model. =p to about  x+7&3%g s& + (+77 slm), the

model andmeasurements are in excellent agreement. At higher flow ratesthere may be transition to turbulent flow, which is possibly thecause of some disagreement between model and measurement.he current experiment is not configured to measure pressuredrop during high& temperature operation. /owever, the

 pressuredrop scales with fluid viscosity, which, according to %inetic theory,scales approximately as 7.98. Liven good agreement for roomtemperatureoperation, the '*1

model, which considers temperature&dependent properties, is expected to provide accurate  pressurepredictions for high&temperature operation.Lenerally spea%ing, all other   performance measures beingeual, pressure drop should be as low as possible.

2mportantly,however, 5high5 and 5low5 pressure drop must be understood ina relative context. he ratio of heat&transfer&to&friction loss is oftenan important performance  parameter. 4icrochannel heatexchangers are designed to achieve excellent heat transfer   performancerelative to pressure drop. Fressure drop can be reduced, but only at theexpense

of ma%ing the heat exchanger significantly larger. he design by .> ?ee et al., which is ideally si!ed for mass&flow rates below3 x+7&6 %g s&+ (7 slm),

incorporates a relatively large heattransfersurface area into a small volume. At these flow rates, theeffectiveness is high and the pressure drop is uite low for the =sdelivered. 2ndeed, achieving these attributes is a primary ob#ectiveof compact heat exchangers.

: ollowing an analysis introduced by ays and ;ondon "#$ the ?friction power per unit

of surface area? can be represented a

s

Fig. easured and predicted pressure drop as a  function of room-temperature air flow rate. [6]

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Ehere is the pressure drop, is the heat transfer area, is the mean fluid velocity, and is the channel cross&sectional area. he pumping power is

J ,where J is the volumetric flow rate. *or a rectangular channel with height / and widthE, the heat&transfer surface area is C E@ (i.e., the floor area between the

hot and cold fluids). he heat&transfer  coefficient h, which can be interpreted as the 5heat transfer power per unit of surface area for onedegree of temperature difference,5 can be evaluated from the  usselt number as

Assuming a channel width of E C

8 mm and properties of air at  C 977 ?, *ig. :.9 shows the ratio 0"h as a function of  Fig. 7.  #atio of friction loss E and heat transfer h as a  function of #eynolds number for three rectangular channel 

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eynolds number for three channel heights. $oth the heat transfer and the pumping losses increase greatly as functions of increasing eynolds number. At low eynolds number, the

heat transfer dominates (i.e., 1:h #). 0owever, at high *eynolds number the pumping

losses can greatly exceed the heat transfer (i.e., 1:h #)

.

FA'RICATION METHODS

arious methods used for the fabrication of microchannels include 4icro& 4achining, 1iffusion $onding, 'hemical 0tching, -tereolithography, @2LA and F@2-. esearchers have found the best method for fabrication of ceramic microchannels as F@2-.

he Fressure @aminated 2ntegrated -tructures (F@2-) fabrication begins by mixing ceramic powders with appropriate binders. 2n  production, the green (i.e., unfired) layersthat incorporate manifold and channel geometry are formed usingcustom dies and high&pressure hydraulic presses. /owever, toavoid the expense of fabricating production dies, prototype designsare machined from pressed green& state  bloc%s. 2n preparation forlaminating together in a hydraulic press, green layers are orientedand assembled as shown in *ig. <.+. After laminating the layers ina press, the assembled part is fired. As

Fig !.1 $canning electron microscope images  showing channel structures, with high

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illustrated by the scanningelectron microscope (-04) images shown aside the fired part  becomesa single polycrystalline ceramic piece with essentially no evidenceof the bond lines  between initially laminated layers.

he F@2- manufacturing process depends upon relativelycomplex interactions among ceramic powders and binders, layerformation pressures, and layer 

"

$

lamination pressures. or example,excessive pressures during lamination can damage or

crushchannel ribs, while insufficient pressure can cause poor bondingbetween layers.

2uring development, a careful design of experimentsprocess was used to determine best

material combinationsand processing conditions. The above fig.is microscopic image

that shows essentially perfectpolycrystalline joining between layers. &n fact, the layers

are not?bonded? together. *ather, after sintering the resulting part isa single

polycrystalline ceramic. @rior to heat-exchanger testing,the finished parts are lea tested

to an internal pressure of 3 atm,assuring no external leas between layers or to the

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.

CONCLUSION

'urrent research on microchannels may represent only the tip of the iceberg of future  possibilities for their expanded use. apid advancements in micro&machining and micro&

deformation techniues are reducing the cost of fabrication while improving the reliability of microchannel systems, thus minimi!ing one of the main limitations of microchannels.

'eramic materials enable applications at hightemperature and in harsh chemical environments that may be difficult to achieve with metal heat exchangers. 2n addition to expanding operating space with ceramics, the

F@2- process has the potential to reduce manufacturing costs relative to a comparable metal heat exchanger. 'ompared to approaches in which layers are fabricated by diffusion  bonding multiple thin metal shims, the F@2- approach reuires fabricating and handling far fewer parts. -caling from the current %ilowatt&scale systems to much larger capacities  presents some significant challenges. he manifold design enables layering up with

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negligible effect on pressure drop. /owever, further scaling probably reuires serial staging of multiple units. -erial staging of thermally isolated small units in a counter&flow configuration can improve overall effectiveness. /owever, because the microchannel flow length is increased, serial staging also increases pressure drop.

4icro heat exchangers are becoming an important area of interest in many fields of  developing technology that reuire compact high heat energy removal solutions. *ields such as 4icro 0lectro 4echanical -ystems (404-), microelectronics, biomedical, fuel  processing, and aerospace are all pushing the limits of thermal control and are finding ways to ma%e smaller devices with higher heat flux potential & reuiring more efficient smaller heat exchangers tocool their %ey wor%ing components.

REFERENCES

"#$ A.-ommers , H. Eang , M. /an , .>oen, N.Far%, A. >acobi '0A42'- A1 '0A42' 4A2M '4F-20- * /0A 0M'/AL0- 2 A1A'01 /04A@ -N-N04- A 020E

Applied hermal 0ngineering xxx (7+7) +e+8

(25)

 0M L00A2 42''/A0@ /0A 0M'/AL0-[-F2L0 F=$@2-/0-]

"3$ amesh ?, -hah, 1usan F -e%ulic. *=1A40A@- * /0A 0M'/AL0  10-2L [E2@0N]

"$ obert >. ?ee ,, $er%eley $. Almand , >usti 4. $lasi , $en#amin @. osen ,

4arco /artmann eal F. -ullivan ,/uayang Ohu , Anthony . 4 anerbin, -ophie 4en!er  , E. Lrover 'oors , >erry @. 4artin /0 10-2L, *A$2'A2, A1 0A@=A2 * A '0A42' '=0& *@E 42'&'/A0@ /0A 0M'/AL0 Applied hermal 0ngineering 3+ (7++) 776e7+

"8$ -atish L ?andli%ar, -rinivasLarimella, 1onging @i, -tJphane 'olin, 4icheal . ?ing

(26)

References

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