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Silicon N-Channel MOS FET

Application

Low frequency power amplifier

Complementary pair with 2SJ160, 2SJ161 and 2SJ162

Features

• Good frequency characteristic • High speed switching

• Wide area of safe operation • Enhancement-mode

• Good complementary characteristics • Equipped with gate protection diodes • Suitable for audio power amplifier

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2

Outline

1 2 3 TO-3P 1. Gate 2. Source (Flange) 3. Drain D G S

Absolute Maximum Ratings (Ta = 25°C)

Item Symbol Ratings Unit

Drain to source voltage 2SK1056 VDSX 120 V

2SK1057 140

2SK1058 160

Gate to source voltage VGSS ±15 V

Drain current ID 7 A

Body to drain diode reverse drain current IDR 7 A

Channel dissipation Pch*1 100 W

Channel temperature Tch 150 °C

Storage temperature Tstg –55 to +150 °C

(3)

Electrical Characteristics (Ta = 25°C)

Item Symbol Min Typ Max Unit Test conditions

Drain to source 2SK1056 V(BR)DSX 120 — — V ID = 10 mA, VGS = –10 V

breakdown voltage 2SK1057 140

2SK1058 160

Gate to source breakdown voltage

V(BR)GSS ±15 — — V IG = ±100 µA, VDS = 0

Gate to source cutoff voltage VGS(off) 0.15 — 1.45 V ID = 100 mA, VDS = 10 V

Drain to source saturation voltage

VDS(sat) — — 12 V ID = 7 A, VGD = 0 *

1

Forward transfer admittance |yfs| 0.7 1.0 1.4 S ID = 3 A, VDS = 10 V *1

Input capacitance Ciss — 600 — pF VGS = –5 V, VDS = 10 V,

Output capacitance Coss — 350 — pF f = 1 MHz

Reverse transfer capacitance Crss — 10 — pF

Turn-on time ton — 180 — ns VDD = 20 V, ID = 4 A,

Turn-off time toff — 60 — ns

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4 50 100 0 Case Temperature TC (°C) 150 50 Channel Dissipation Pch (W)

Power vs. Temperature Derating

100 150

Maximum Safe Operation Area

Drain Current I D (A) 10 20 50 1.0 2 5 100 10 20

Drain to Source Voltage VDS (V)

5 500 0.5 200 0.2 IDmax (Continuous) Ta = 25°C PW = 10 ms 1 shot PW = 100 ms 1 shot PW = 1 s 1 shot DC Operation (T C = 25°C) 2SK1056 2SK1057 2SK1058

Typical Output Characteristics

30

Drain to Source Voltage VDS (V)

40 20 10 50 Drain Current I D (A) 0 2 4 6 8 0 10 VGS = 10 V T C = 25°C 1 2 0 5 6 7 8 9 Pch = 100 W 3 4

Typical Transfer Characteristics

1.2

Gate to Source Voltage VGS (V)

1.6 0.8 0.4 0 2.0 0.2 0.4 0.6 0.8 1.0 0 Drain Current I D (A) TC= –25°C 75 VDS = 10 V 25

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Drain to Source Saturation Voltage vs. Drain Current

1.0 Drain Current ID (A)

2 0.5 0.2 5 1.0 2 5 10 0.1 0.5

Drain to Source Saturation Voltage

VDS (on) (V) 0.2 0.1 10 TC = –25 °C 25°C 75 °C VGD = 0

Drain to Source Voltage vs. Gate to Source Voltage

6

Gate to Source Voltage VGS (V) 8 4 2 0 10 4 6 8 10 0 2

Drain to Source Voltage V

DS (V) ID = 1 A 5A TC = 25°C 2A

Input Capacitance vs. Gate Source Voltage 1000

500

200

100

Input Capacitance Ciss (pF)

0 –2 –4 –10

Gate to Source Voltage VGS (V)

–6 –8 VDS = 10 V

f = 1 MHz

Forward Transfer Admittance vs. Frequency 3.0 1.0 0.3 0.1 0.03 0.01 0.003 10 k 30 k 100 k 300 k 1 M 10 M Frequency f (Hz) 3 M

Forward Transfer Admittance

 yfs  (S) TC = 25°C VDS = 10 V ID = 2 A

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6

Switching Time vs. Drain Current 500 200 100 50 20 10 5 0.1 0.2 0.5 1.0 2 10 Drain Current ID (A)

5

Switching Time ton,toff (ns)

t on t off Output RL= 2 Ω 20 V 50 Ω Input PW = 50µs duty ratio = 1 %

Switching Time Test Circuit

90 % 10 % 90 % 10 % Output Input t on t off Waveforms

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φ3.2 ± 0.2 1.5 0.3 2.8 18.0 ± 0.5 19.9 ± 0.2 0.5 1.0 5.0 ± 0.3 1.6 1.4 Max 2.0 2.0 14.9 ± 0.2

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1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.

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Semiconductor & Integrated Circuits.

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