Apple iphone 13 Face ID Module

(1)

22 bd Benoni Goullin

44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Apple’s 2 ^nd generation Face ID solution in the iPhone 13 with comparison to the previous system.

SPR21642 - Imaging report by Peter BONANNO and Sylvain HALLEREAU Physical analysis by Youssef EL GMILI

December 2021 – Sample

Apple iPhone 13 Face ID Module

(2)

Versions of the Report

Version Date Updates

V1 7/12/2021 o Version 1

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Executive Summary

The Face ID system introduced in the iPhone X was the first structured light-based system in a smartphone and is considered by some to be Apple’s biggest innovation in recent years. Front-facing 3D smartphone sensing modules are now present in 14.6% of smartphones and consumer 3D imaging modules represent a $3.1B industry. The iPhone X was also an early pioneer of the notch, which allows top-to-bottom displays by using a cut-out for the front-facing camera. The iPhone 11 and 12 largely retained the front camera configuration from the iPhone X, but the iPhone 13 launched with a more compact system that allowed for a ~33% smaller notch.

This full reverse costing study has been conducted to provide insights into technology data, the manufacturing cost and selling price of the Face ID module in the iPhone 13. We divide the system into eight parts: the module assembly, NIR CMOS image sensor, diffractive optical element, dot projector VCSEL, flood illuminator VCSEL, VCSEL driver, and two lens modules. Each part undergoes detailed physical analysis such as optical and electron microscopy, deprocessing, cross-sectional analysis, and energy-dispersive x-ray spectroscopy to determine the technologies and manufacturing processes involved. We then calculate the cost of each manufacturing step and present itemized fabrication and bill-of-material costs. This data is then used to calculate the total cost and estimate the selling price of the Face ID module.

In line with Apple’s usual strategy, the new system keeps many things the same while incrementally advancing some things and totally rethinking others. On the NIR detection side, Apple has retained the global shutter CIS from STMicroelectronics. The two VCSELs from Lumentum are significantly smaller than their predecessors, suggesting either that the previous generation’s VCSELs were over-spec’d or that the newly designed diffractive optical element is more efficient. The two VCSELs now share the same driver and the same optics, reducing both cost and space needs in the phone. The new single-module system has a 6 mm baseline distance between the emission and detection axes, which makes the notch reduction possible. All together, the new design results in a Face ID system that is significantly less costly to Apple.

We will present a technical and cost comparison with the previous generation Face ID system in the iPhone 12.

[1] 3D Imaging and Sensing – Technology and Market Trends 2021, Yole Développement.

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Overview / Introduction

Physical Analysis o Summary o Assembly

o DOE

o NIR CIS Die

o Dot Projector VCSEL o Flood Illum. VCSEL o VCSEL Driver Die

Face ID Module Assembly – Teardown

Opening the module by separating the optics assembly from the HTCC substrate – Optical View

NIR detection lens module

VCSEL lens module VCSEL Driver

Dot Projector VCSEL

NIR CIS (behind the filter)

HTCC substrate

bandpass filter plate

Flood Illuminator VCSEL

separate optics assembly from

substrate leadframe

contact

leadframe

contact

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o DOE

o NIR CIS Die

Face ID Module Assembly Cross-Section

Module Cross Section - Optical and Schematic Views

NIR detection lens module

VCSEL lens module Lens #1

Lens #2 Lens #3 Lens #4

Lens #1 Lens #2

Lens #3 glass plate with bandpass filter

NIR CIS 10-layer HTCC

substrate

metal enclosure

plastic spacer

DOE

Flood Illuminator

VCSEL Dot Projector

VCSEL

3-layer flex metal support

barrel

optics assembly plastic housing

leadframe

AlN substrate

metal stiffener two views of module showing the

position of the cross-sectional plane

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o DOE

o NIR CIS Die

Face ID Module Assembly Cross-section w/ Optical Dimensions – Optical View

Face ID Module Cross-Section – VCSEL Lens Module & DOE Optical Dimensions

two views of module showing the position of the cross-sectional plane

Flood Illuminator VCSEL Dot Projector

VCSEL

The Dot Projector and Flood Illuminator VCSELs have different distances from the rear focal plane of the

optical system (Δ =

mm). It’s likely that the Dot

Projector VCSEL is in the

plane so that the dot pattern

is projected cleanly to the

target range and that the

Flood Illuminator VCSEL is

out of the plane to defocus

the diffracted pattern and

create flood illumination.

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o DOE

o NIR CIS Die

Diffractive Optical Element - Bottom Diffractive Pattern

DOE Cross-section – SEM View

bottom diffractive pattern

Edge of Bottom Diffractive Pattern – Optical View

Top View of DOE Bottom Substrate Showing Top Diffractive Pattern – Optical View

The bottom diffractive pattern is at the top of the

DOE bottom substrate. It’s made by depositing 1.5

µm of high-purity SiO

₂

and then etching a ~1 µm

deep pattern with periodicity of µm.

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o DOE

o NIR CIS Die

NIR Global Shutter CIS Die - Delayering - Pixels

Delayered NIR CIS Die taken from iPhone X – Pixels – SEM View

Pixel Area

• The photodiode is smaller than the pixel area.

• Pixel Area:

• Photodiode Area:

• Fill Factor:

Photodiode

Delayered NIR CIS Die Overview

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o DOE

o NIR CIS Die

Dot Projector VCSEL Die - Cavity Cross-Section

VCSEL Die Cross-Section – SEM View

VCSEL Die Cross-Sectional Plane

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o DOE

o NIR CIS Die

Flood Illuminator VCSEL Die - Cavity Dimensions

Figure Lumentun Patent US20170353012A1

VCSEL after partial gold delayering – Optical view

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Physical Analysis

Manufacturing Process Flow o Global Overview

o DOE Wafer Process Flow &

Fabrication Unit

o NIR Sensor Die Front-End Process & Fabrication Unit o VCSEL Process Flow &

Fabrication Unit

o VCSEL Driver Die Front-End Process & Fabrication Unit

Cost Analysis

NIR VCSEL Front-End Process Flow 1/2

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Physical Analysis

o Summary of the Cost Analysis o Yields Explanation &

Hypotheses o DOE o NIR CIS

o Dot Proj. VCSEL o Flood Illum. VCSEL o VCSEL Driver o Face ID Module

Yield Hypotheses

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Physical Analysis

Diffractive Optical Element – Front-End Step Costs

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Physical Analysis

33%

6%

25%

33%

3%

Epitaxy Cost Breakdown

wafer - 6" GaAs substrate Clean Room Cost

Equipment Cost Consumable Cost Labor Cost

Dot Projector VCSEL Epitaxy Cost

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Physical Analysis

Completed Face ID Module Cost

Cost Breakdown Cost Breakdown Cost Breakdown

DOE Die $0.190 1.5% $0.181 1.6% $0.174 1.6%

NIR CIS Die $1.564 12.4% $1.469 12.7% $1.384 13.0%

Dot Projector VCSEL Die $0.276 2.2% $0.245 2.1% $0.207 1.9%

Flood Illuminator VCSEL Die $0.182 1.4% $0.163 1.4% $0.138 1.3%

VCSEL Driver Die $0.212 1.7% $0.205 1.8% $0.200 1.9%

CIS Lens Module $1.832 14.5% $1.757 15.2% $1.687 15.9%

VCSEL Lens Module $1.021 8.1% $0.990 8.6% $0.961 9.0%

Bandpas Filter $0.390 3.1% $0.390 3.4% $0.390 3.7%

Housing + Metal + 15 Capacitors + Thermistor $0.199 1.6% $0.199 1.7% $0.199 1.9%

AlN Substrate & Cu Heatsink $0.230 1.8% $0.230 2.0% $0.230 2.2%

HTCC Substrate $0.450 3.6% $0.450 3.9% $0.450 4.2%

Flex & Connector $0.400 3.2% $0.400 3.5% $0.400 3.8%

BOM Cost $6.947 $6.680 $6.419

Assembly onto AlN Substrate Cost to Tong Hsing $0.121 $0.121 $0.121

Tong Hsing Gross Profit $0.021 $0.021 $0.021

Assembly onto AlN Substrate Cost to LG Innotek $0.142 $0.142 $0.142

Assembly onto HTCC Substrate $0.676 $0.676 $0.676

Assembly onto Substrate Cost $0.819 6.5% $0.819 $0.819

Module Assembly Cost $2.318 18.4% $2.318 20.1% $2.318 21.8%

Yield losses Cost $2.521 20.0% $1.732 15.0% $1.062 10.0%

Module Cost $12.605 98% $11.549 91% $10.617 91%

Face ID Module Low Yield Medium Yield High Yield

The Face ID module cost is estimated to be between

according to yield variations.

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Physical Analysis

Completed Face ID Module Selling Price

(18)

Physical Analysis

Technical & Cost Comparison o Front Camera Assembly o Face ID System

o NIR Camera Module o Dot Projector o Flood Illuminator o VCSEL Driver

Feedback

iPhone 13 vs iPhone 12 - Front Notch

3.5 mm

0.75 mm 2.2 mm

0.80 mm

NIR camera module dot projector

+ flood illuminator speaker

grill RGB camera

module

RGB camera module

dot projector proximity

sensor

NIR camera module

speaker grill proximity

sensor + flood illuminator

Smartphones are to scale for comparison.

iPhone 13

iPhone 12

iPhone 13 Front Notch

iPhone 12 Front Notch

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Physical Analysis

Feedback

iPhone 13 vs iPhone 12 - Front Camera Assembly

NIR camera module dot projector

+ flood illuminator RGB camera

module

proximity sensor

RGB camera module

dot projector NIR camera

module

proximity sensor

+ flood illuminator

Assemblies are to scale for comparison.

iPhone 13 Front Camera Assembly

iPhone 12 Front Camera Assembly

superimposed on the x-ray image to fill in the missing top part of the photograph.

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Physical Analysis

Feedback

iPhone 13 vs iPhone 12 - Face ID System Selling Price to Apple

iPhone 13 Face ID Module w/ Cost

iPhone 12 Front Camera Assembly w/ Costs

The new Face ID system is less expensive than the previous generation.

¥

We did not redo the costing simulation for 2020, but we applied updated insights into supply chain and yields.

* Driver + VCSEL + Diffuser + half of the packaging and final test costs.

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Physical Analysis

Feedback

iPhone 13 vs iPhone 12 - Dot Projector - Overview

Dot Projector taken from iPhone X – Perspective View

Portion of the iPhone 13 Face ID module containing the VCSELs – Perspective View

Schematic of the previous generation dot projector

Schematic of the dot projector system in the iPhone 13 Face ID module

Schematics are to scale for comparison.

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Physical Analysis

Feedback

iPhone 13 vs iPhone 12 - Dot Projector - Diffractive Optical Element

1

^st

Generation (2017-2020) iPhone 13 (2021)

Pattern Diameter 2.4 mm 2.3 mm

Safety Circuit ITO resistor ITO Resistor

Material High-purity fused silica High-purity fused silica

Diffractive Pattern

DOEs are to scale for comparison.

2 1

3 4 6

7 8 5

The Diffractive Optical

Elements are similar in size and material, but the

diffractive patterns are based on totally different concepts.

The DOE in the iPhone 13 is in fact very similar to that in the LiDAR module.

8 different thicknesses

2 orthogonal

bar patterns

superimposed

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Physical Analysis

Feedback

iPhone 13 vs iPhone 12 - Flood Illuminator VCSELs are to scale for comparison.

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R E L A T E D

A N A L Y S E S

(25)

Physical Analysis

Feedback

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RELATED TEARDOWN TRACKS RELATED REPORTS

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• Smartphone 3D Sensing Modules Comparison 2020

• STMicroelectronics Proximity Sensor and Flood Illuminator

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By Yole Développement:

• 3D Imaging and Sensing - Technology and Market Trends 2021

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By System Plus Consulting:

• Apple iPhone 13

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• Smartphone Design Win Quarterly Monitor

By Yole Développement:

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Market Monitor

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Our Core Activity : Reverse Costing®

A Structure, Process and Cost Analysis

Reverse Costing® consists of disassembling a device or a system in order

to identify its technology and discern its manufacturing processes and

then using in-house models and tools to determine its cost.

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Apple iphone 13 Face ID Module

22 bd Benoni Goullin

44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Apple’s 2 nd generation Face ID solution in the iPhone 13 with comparison to the previous system.

SPR21642 - Imaging report by Peter BONANNO and Sylvain HALLEREAU Physical analysis by Youssef EL GMILI

December 2021 – Sample

Apple iPhone 13 Face ID Module

Versions of the Report

Table of Contents

Executive Summary

We will present a technical and cost comparison with the previous generation Face ID system in the iPhone 12.

[1] 3D Imaging and Sensing – Technology and Market Trends 2021, Yole Développement.

Face ID Module Assembly – Teardown

Opening the module by separating the optics assembly from the HTCC substrate – Optical View

NIR detection lens module

VCSEL lens module VCSEL Driver

Dot Projector VCSEL

NIR CIS (behind the filter)

HTCC substrate

bandpass filter plate

Flood Illuminator VCSEL

separate optics assembly from

substrate leadframe

contact

leadframe

contact

Face ID Module Assembly Cross-Section

Module Cross Section - Optical and Schematic Views

NIR detection lens module

VCSEL lens module Lens #1

Lens #2 Lens #3 Lens #4

Lens #1 Lens #2

Lens #3 glass plate with bandpass filter

NIR CIS 10-layer HTCC

substrate

metal enclosure

plastic spacer

DOE

Flood Illuminator

VCSEL Dot Projector

VCSEL

3-layer flex metal support

barrel

barrel

optics assembly plastic housing

leadframe

AlN substrate

metal stiffener two views of module showing the

position of the cross-sectional plane

Face ID Module Assembly Cross-section w/ Optical Dimensions – Optical View

Face ID Module Cross-Section – VCSEL Lens Module & DOE Optical Dimensions

two views of module showing the position of the cross-sectional plane

The Dot Projector and Flood Illuminator VCSELs have different distances from the rear focal plane of the

optical system (Δ =

mm). It’s likely that the Dot

Projector VCSEL is in the

plane so that the dot pattern

is projected cleanly to the

target range and that the

Flood Illuminator VCSEL is

out of the plane to defocus

the diffracted pattern and

create flood illumination.

Diffractive Optical Element - Bottom Diffractive Pattern

DOE Cross-section – SEM View

Edge of Bottom Diffractive Pattern – Optical View

Top View of DOE Bottom Substrate Showing Top Diffractive Pattern – Optical View

The bottom diffractive pattern is at the top of the

DOE bottom substrate. It’s made by depositing 1.5

µm of high-purity SiO

and then etching a ~1 µm

deep pattern with periodicity of µm.

NIR Global Shutter CIS Die - Delayering - Pixels

Delayered NIR CIS Die taken from iPhone X – Pixels – SEM View

• The photodiode is smaller than the pixel area.

• Pixel Area:

• Photodiode Area:

• Fill Factor:

Delayered NIR CIS Die Overview

Apple’s 2 ^nd generation Face ID solution in the iPhone 13 with comparison to the previous system.