Embedded Computing Product Guide. Embedded Computing for Business-Critical Continuity

Embedded Computing Product Guide

Embedded Computing for

Table of Contents

4 AdvancedTCA Products 9 Commercial ATCA Products 10 Motherboard & COM Products 14 RapiDex™ Board Customization 15 OpenVPX Products

16 VME Products 18 CompactPCI Products 20 Solution Services

21 Innovation Partnership Program 22 Terms & Conditions

Our customers operate in many diverse markets. What unites them is a need

to work with a company that has an outstanding record as a reliable supplier.

That’s Emerson Network Power. That’s the critical difference.

The Embedded Computing business of Emerson Network Power enables original equipment manufacturers and systems integrators to develop better products quickly, cost effectively and with less risk.

Emerson is a recognized leading provider of embedded computing solutions ranging from application-ready platforms, embedded PCs, enclosures, motherboards, blades and modules to enabling software and professional services.

For nearly 30 years, we have led the ecosystem required to enable new technologies to succeed including defining open specifications and driving industry-wide interoperability. This makes your integration process straightforward and allows you to quickly and easily build systems that meet your application needs.

Emerson’s engineering and technical support is backed by world-class manufacturing that can significantly reduce your time-to-market and help you gain a clear competitive edge. And, as part of Emerson, the Embedded Computing business has strong financial credentials.

Let Emerson help you improve time-to-market and shift your development efforts to the deployment of new, value-add features and services that create competitive advantage and build market share. With Emerson behind you, anything is possible.

“This business has the DNA that includes Motorola’s embedded computing business, Artesyn, Force Computers, Heurikon, Blue Wave Systems, Mizar, Prolog, NetPlane and Spider Software! The combined strength and experience of these companies, fused with pedigrees of quality, innovation and a deep understanding of our customers’ needs, position Emerson Network Power for continued growth and leadership in the embedded computing markets.”

Stephen Dow

President, Embedded Computing Emerson Network Power

Our leadership and

heritage includes

embedded computing

solutions for military,

aerospace, government,

medical, automation,

industrial and

telecommunications

applications.

AdvancedTCA

®

Products

Emerson Network Power AdvancedTCA

®

_{products are designed to address applications requiring high}

performance, high reliability and long life cycles. The telecommunications industry was quick to recognize

the fit with its carrier-grade requirements. Applications include control plane and packet and media

processing infrastructure for wireless networks, IP Multimedia Subsystem (IMS), IPTV, other central office

applications and network data center environments. ATCA

®

_{products have also been deployed in a range}

of military, aerospace and industrial automation applications such as C4ISR and batch processing control.

Emerson offers a comprehensive portfolio of 10G and 40G ATCA products including shelf, switch blade

and payload blade products. Payload blade options include high performance server, flexible I/O, packet

processing and storage blades. Multiple business engagement models are designed to suit almost any

customer – from purchasing ATCA products separately and integrating them yourself, to detailed

integration and custom packaging services from our dedicated Solution Services group.

AdvancedTCA Platform Cores

The Emerson Centellis™ series of ATCA platform cores integrate the ATCA shelf (enclosure, shelf management, cooling and power distribution), switch blades, a complete software operating environment and SpiderWare®_M3 _shelf

management software. This provides an off-the-shelf solution on which you can add your service-related hardware and software. Tested and verified hardware and software components, designed for NEBS, ETSI and other regulatory compliance, help to reduce development costs and accelerate time-to-market. Original equipment manufacturers (OEMs) can focus development resources on critical, differentiating features that provide a competitive advantage.

Centellis 2000 Platform Core

ƒ Release 1: DC power options

ƒ Release 2: AC power options, 10G User Card

ƒ Release 3: Upgraded shelf management, Telco Alarm User Card

Centellis 2625 40GbE Platform Core

ƒRelease 1: AXP640 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4440 40GbE Platform Core

ƒ Release 1: AXP1440 shelf, ATCA-F120 switch blade, integrated software package

ƒ Release 2: AXP1440 shelf, ATCA-F140 switch blade, integrated software package

Centellis 4410 10GbE Platform Core

ƒ Release 1: AXP1410 shelf, ATCA-F120 switch blade, integrated software package

ƒ Release 2: AXP1411 shelf, ATCA-F125 switch blade, integrated software package

Centellis 4620 10GbE Platform Core

ƒ Release 1: AXP1620 shelf, ATCA-F120 switch blade, integrated software package

Centellis™ 2000 – 40G ATCA Shelf

ƒTwo-slot, 3U, 19” form factor

ƒ10G/40G fabric support

ƒAC & DC power input options

ƒSimplex and duplex configurations available

AXP640 – 40G ATCA Shelf

ƒ6-slot, 7U, 19” form factor

ƒ10G/40G fabric support

ƒAC & DC power input options

AXP1440 – 40G ATCA Shelf

ƒ14-slot, 13U, 19” form factor

ƒ10G/40G fabric support

AXP1410/1 – 10G ATCA Shelf

ƒ14-slot, 13U, 19” form factor

ƒ10G fabric support

AXP1620 – 10G ATCA Shelf

ƒ14-slot, 13U, 19” form factor

ƒ10G fabric support

ATCA-F140 40G Switch Blade

ƒPICMG® _{3.0 compliant base interface}

switch

ƒPICMG 3.1, Option 1, 9 fabric interface switch (1G/10G)

ƒ4x 10GBASE-KR fabric interface (40G)

ƒSingle AMC site

ƒOptional SATA HDD

ƒOptional Telecom clocking support

ƒIntegrated software package

ATCA-F125 10G Switch Blade

ƒPICMG 3.0 compliant base interface switch

ƒPICMG 3.1, Option 1, 9 fabric interface switch (1G/10G)

ƒSingle AMC site

ƒOptional SATA HDD

ƒOptional Telecom clocking support

ƒIntegrated software package

ATCA-F120 System Controller and Switching Blade

ƒPICMG 3.0 & 3.1 dual-star support

ƒ1G & 10G fabric support

ƒDual AMC slot support for optional processor and storage

ƒ Copper & optical rear transition module (RTM) options

AMC-8001 Telecom Clocking AMC Module

ƒStratum 3 performance

ƒMultiple modes of operation

ƒRedundant BITS/SSU inputs

ƒRedundant CLK distribution and synchronization

PrAMC-7211 AMC Module

ƒIntel® _{Core™2 Duo processor core}

with 4MB L2 cache, running at 1.5 GHz

ƒ667 MHz frontside bus, connecting processor and Intel® _{3100 chipset}

AdvancedTCA Switch Blades

A variety of switch blades are available with flexible options for processor AMCs, local storage and Telco clocking. Switch blade products include 10G and 40G variants to satisfy different perfor-mance and price points depending on application requirements.

AdvancedTCA Shelves

Emerson offers a complete suite of ATCA shelf products including two-slot, six-slot, 14-slot and 16-slot shelf form factors with both 10G and 40G capable backplanes.

All Emerson ATCA shelf products have superior power and cooling characteristics; 350 Watt/slot power distribution, front-to-rear cooling architecture and CP-TA B.4 compliant cooling performance. Shelf Management functionality is integrated into each ATCA shelf and all, redundant field replaceable units (FRUs) are included.

ATCA-7368 Six-Core Processor Blade

ƒ High performance Intel® _Architecture

processor blade designed to meet cost-sensitive applications

ƒ One 6-core Intel® _Xeon® _processor

L5638 (2.0 GHz)

ƒ Up to 48GB main memory

ƒ One mid-size AMC site supporting offload, storage & I/O

ƒ Cost-effective on-board SATA drive option

ƒ eUSB storage device option

ƒ Additional flash storage device options via SATA module

ƒ Multiple storage and I/O connectivity

ATCA-7367 Six-Core Processor Blade

ƒ One 6-core Intel Xeon processor L5638 (2.0 GHz)

ƒ Up to 48GB main memory

ƒ One mid-size AMC site support network, storage, I/O and Telecom clocking

ƒ Cost-effective on-board SATA drive option

ƒ eUSB storage device

ƒ Additional flash storage device options via SATA module

ƒ Multiple network and storage I/O connectivity

ƒ Additional GbE or Fibre Channel interfac-es via RTM option

ATCA-7365 Dual Six-Core Processor Blade

ƒ Two 6-core Intel Xeon processor L5638 (2.0 GHz)

ƒ Up to 96GB main memory

ƒ eUSB storage device

ƒ Additional flash storage device options via SATA module

ƒ Multiple network and storage I/O connectivity

ATCA-7360 Quad-Core Processor Blade

ƒ Two quad-core Intel Xeon processors L5518 (2.13 GHz)

ƒ Up to 80GB main memory

ƒ eUSB storage device

ƒ Additional flash storage device options via SATA module

ƒ Multiple network and storage I/O connectivity

ƒ Additional GbE or Fibre Channel interfaces via RTM option

AdvancedTCA IA Server Blades

Emerson is committed to closely following the Intel® _Embedded

Roadmap for ATCA server blades. Look for Emerson to deliver best-in-class performance through features like dual Intel® _Xeon®

5600 series processors, and extreme memory capacity with up to twelve DIMM sockets, for demanding applications like subscriber databases and video-on-demand servers. Additional features such as hot-swappable hard drives and telecom clock synchronization are also provided. All of the server blades work with a range of available rear transition modules (RTM) supporting hot-swappable hard disks with flexible choice of storage options and RAID 0/1 functionality. Unless otherwise stated, the ATCA fabric interface on each blade is PICMG 3.1 Option 1, 9 (1/10GbE) compliant.

ATCA-7301 Processor Blade

ƒ Intel® _{Core™2 Duo processor (2.16 GHz)}

ƒ On-board GbE switch

ƒ Two mid-size AdvancedMC™ (AMC) sites

ƒ PICMG 3.1, Option 1, 2 and 9 fabric interface support

ƒ SAS disk option

AdvancedTCA I/O Blades

Through the use of industry standard mezzanines like the Advanced Mezzanine Card (AMC), these blades are designed for flexibility, and can be optimized to meet the needs of your applications.

Common applications include:

ƒ3G RNCs with ATM I/O and signaling interfaces

ƒIP packet gateway interfaces with security and network address translation requirements

ƒ Modular computing applications with processor AMCs for Intel®

Architecture, PowerPC® _{or Cavium OCTEON processing}

Differentiating features of these blades include support for 10Gb/s fabrics; redundant boot banks of flash; reset persistent memory for black box data logging; backplane clock interfaces; and flexible options for on-board storage.

Emerson Network Power provides customers

with a complete suite of ATCA blades including high

performance computing, flexible I/O, packet and

media processing, and storage blades. Most

current blades support 10GbE fabric technology,

but blades supporting 40GbE fabric are imminent.

AdvancedTCA Packet & Media Processing Blades

Emerson packet processing blades are optimized for data plane or signal plane processing in telecommunications or data communications applications. Our family of Cavium OCTEON processing blades is designed for IP packet processing in applications like packet gateways, 4G wireless gateways, deep packet inspection applications, and network security.

Emerson packet processing blades support a wide variety of performance and bandwidth options. On-board Ethernet switches support flexible data paths. Integrated into Emerson 10GbE and 40GbE board and system core products, the Emerson packet processor products offer application-ready platforms for signaling and call control, network gateway and edge functions, deep packet inspection and security processing.

ATCA-8310 DSP Blade

ƒ Up to 30 Texas Instruments TMS320TCI6486 6-core DSPs

ƒ8-core Freescale QorIQ™ P4080 for packet processing and load balancing in the IP I/O path

ƒPre-installed Linux on P4080 with utilities for blade configuration, switch management and DSP setup

ƒRed Hat RHEL certified 2-core Intel®

Core™ i7 processor for control plane application

ƒLocal Ethernet switch connecting all DSPs, CPUs, ATCA networks and I/O

ƒIP RTM supporting 10Gigabit Ethernet

ATCA-9305 Many-Core Processor Blade

ƒTwo Cavium OCTEON 16-core CN5860 processors (800 MHz)

ƒ Freescale MPC8548 PowerQuicc III service processor

ƒHardware acceleration with thread pinning, security, de-/compression, regexp with RLDRAM support, packet queuing and scheduling functions

ƒ 10 GbE Broadcom BCM56802 switch

ƒ 18-port GbE RTM

ƒ 12-port GbE plus 10GbE RTM port

ƒ6-port 10GbE RTM with flash storage

ƒ Wind River PNE based management software including L2 and L3 switch management

ƒ Debian Linux and Wind River PNE Linux support for the Cavium OCTEON+ processors including Cavium SDK support

ƒ 6Wind 6Windgate support

AdvancedTCA Storage Blades

Applications that require persistent data storage will benefit from Emerson's tiered storage strategy. This includes:

ƒ On-board storage – available with most of our ATCA processing blades

ƒ Direct attached storage (DAS) blades provide a set of independent hard drives to server blades via SAS or SATA direct attachment

ƒ Shared storage blades – capable of being accessed by one or more server blades through either FibreChannel or iSCSI SAN interfaces

ƒ External storage arrays – reference sales model via our partnership with EMC, and certified to operate with our ATCA server blades Collectively, these storage solutions are capable of meeting your reliable storage requirements, from hundreds of gigabytes through many terabytes, with various RAID configurations.

ATCA-S201 Storage Blade

ƒ In-shelf ATCA SAN/NAS blade

ƒ Four AMC-based hotswap disks

ƒ Two fixed SFF disks via RTM

ƒ iSCSI target function

ƒ External SAS expansion

ATCA-S120 Storage Blade

ƒ In-shelf ATCA JBOD blade

ƒ Four AMC-based hotswap disks

ƒ Two fixed SFF disks via RTM

ƒ External SAS connection

AMC-S303 AMC Storage Module

ƒ320GB SATA Extended Duty HDD

ƒ Single wide, mid-size

AMC-S321 AMC Storage Module

ƒ 80GB SATA Extended Duty HDD

ƒ Single wide, mid-size

AMC-S402 AMC Storage Module

ƒ 146 GB 10K SAS HDD

ƒ 300 GB 10K SAS HDD

ƒ Single wide, mid-size

AMC-S502 AMC Storage Module

ƒ 32GB SATA SSD

SRstackware Switching and Routing Software

The Emerson SRstackware switching and routing software suite, was developed to fulfill the ever-increasing Layer 2 and Layer 3 networking requirements of telecom and non-telecom network elements. SRstackware supports a wide range of defined standards and protocols and enables easy integration with customer applications. SRstackware is available on all ATCA switch blades and select ATCA payload blade products.

Basic SRstackware software includes all required network functions, switch management and commonly used Layer 2 protocols com-bined into a single product. Enhanced SRstackware is a series of specific protocol modules that can be purchased separately depend-ing on application requirements.

Basic SRstackware features:

Switch Management

ƒ Command Line Interface (CLI)

ƒ Simple Network Management Protocol (SNMPv2) - RFC 1901, 2271

ƒ Simple Network Management Protocol (SNMPv3) - RFC 3414, 3411

ƒ Broadcast storm recovery

ƒ Flow control - IEEE 802.3x

ƒ Application Programming Interface (API) access

Layer 2 Switching

ƒ Spanning Tree Protocol (STP) - IEEE 802.1d

ƒ Rapid Spanning Tree Protocol (RSTP) - IEEE 802.1w

ƒ Multiple Spanning Tree Protocol (MSTP) - IEEE 802.1

ƒ Virtual LAN (VLAN) Tagging - IEEE 802.1q

ƒ Link Aggregation Control Protocol (LACP) - IEEE 802.3ad

ƒ VLAN Classification by Protocol and Port - IEEE 802.1v

ƒ Class of Service (CoS) - IEEE 802.1p

ƒ Link Aggregation Control Protocol (LACP) - IEEE 802.3ad

ƒ Generic Attribute Registration Protocol (GARP) - IEEE 802.1q

ƒ GARP Multicast Registration Protocol (GMRP) - IEEE 802.1q

ƒ GARP VLAN Registration Protocol (GVRP) - IEEE 802.1q

ƒ VLAN Stacking (Q-in-Q) - IEEE 802.1ad

ƒ Static Filtering (ACL)

ƒ Enhanced Load Balancing (by TCP/UDP port)

Enhanced SRstackware features:

Layer 3 Routing

ƒ IPv4 Routing

– Internet Group Management Protocol (IGMP v1) - RFC 1112 – Internet Group Management Protocol (IGMP v2) - RFC 2236 – Internet Group Management Protocol (IGMP v3) - RFC 3376 – IGMP Snooping/Proxy - RFC 4541

– Routing Information Protocol (RIPv2) - RFC 2453 – Open Shortest Path First (OSPFv2) -RFC 2328 – Virtual Router Redundant Protocol (VRRP) - RFC 3768

ƒ IPv6 Routing

– RIP Next generation (RIPng) - RFC 2080

SpiderWare

®

_M

3

_{Platform Management Software}

The control and management of platforms are critical to the efficient and effective use of data and communication networks. SpiderWareM3 _{is an innovative software product that reduces}

development time and lowers operational expenses for users of ATCA systems.

Manage, monitor and maintain multiple ATCA platforms

ƒRemote access from any location

ƒFault and threshold alerts

ƒMonitor chassis and blades operational parameters

Rapid software integration

ƒHPI and XML APIs

ƒVisual representations of hardware parameters ease application software integration

Quick platform set-up

ƒGraphical selection of key IPMI data

ƒEvent reporting facilitates rapid integration of multi-vendor systems

Asset management

ƒAccess FRU records

Commercial ATCA

®

Products

Designed for deployment outside of the telecommunications central office, the Katana

®

_{family of}

Commercial ATCA systems is optimized for applications which value the enhanced reliability, serviceability

and longevity of AdvancedTCA technology, without the need to meet the NEBS requirement of operating

at elevated ambient temperatures (up to 55 °C). In this case, the enhanced cooling of Emerson ATCA

systems can be used to deliver higher levels of performance than traditional AdvancedTCA systems.

Commercial ATCA Bladed Servers and Blades

The first product in this family is the Katana 2000. Based on the Centellis™ 2000 two-slot chassis, this system offers high performance dual Intel® _Xeon® _{server blades, each with dual redundant hot swappable hard drives.}

Both DC and AC powered configurations are supported.

The ATCA-7365-CE, a commercial ATCA blade, host variants of the Intel Xeon 5600 series processors with higher processor speed compared to available NEBS variants and is designed for commercial non-NEBS environment at 35 °C ambient temperature.

ATCA-7365-CE Dual Four/Six-Core Processor Blade

ƒ Two 4- or 6-core Intel Xeon

processors, E5620 or E5645 (2.4 GHz)

ƒ Up to 96GB main memory

ƒ Fully supported by the ATCA- 736X RTM family

ƒ Hot-swappable hard disk with flexible choice of storage options

ƒ RAID 0/1 support

ƒ Multiple network and storage I/O connectivity

ƒ PICMG 3.1 Option 1, 9 (1/10GbE) ATCA fabric interface,

ƒ Designed for Commercial ATCA in a temperature controlled environment

Katana® _{2000 Commercial ATCA}

Bladed Server

ƒ Two-slot, 19”, 3U form factor

ƒSupplied with up to two server blades, each with two quad-core Intel® _Xeon® ₅₅₀₀

series processors

ƒ Certified for Red Hat RHEL5.3,

ƒEMC and VMware

ƒ SpiderWare®_M3 _{ready platform}

ƒ Front-to-rear cooling

ƒ Power saving features for enhanced energy efficiency

Motherboard & COM

Products

Emerson is fast becoming the embedded motherboard and Computer-on-Module (COM) supplier of

choice for a broad range of industries including medical, retail, automation, test and measurement,

transportation and renewable energy. Based on long-life embedded silicon, Emerson’s high quality, stable

motherboards are delivered from outstanding manufacturing facilities and are backed by our global

service presence.

NITX-300 Series Nano-ITX Motherboards

ƒ <7 Watts typical power consumption

ƒ Up to 1.0 GHz Intel® _{Atom™ processor}

E640 series

ƒ Intel® _{EG20T Platform Controller Hub}

ƒ Up to 1GB DDR2 memory, soldered on board

ƒ Gigabit Ethernet, SATA and USB

ƒ PCI Express x1 and PCI Express Mini Card slot

ƒ Dual display support

ƒ Four serial ports

ƒ Slimline design

MITX-430/440 Mini-ITX Motherboards

ƒ Intel Atom D410 or D510 processor

ƒ Up to 4GB DDR2 memory

ƒ Gigabit Ethernet, SATA and USB ports

ƒ PCI Express x1 and PCI Express Mini Card socket

ƒ Dual display support

ƒ Six serial ports

MITX-CORE-800 Series Mini-ITX Motherboards

ƒ PGA socket for 2nd generation Intel® _Core™

processor

ƒ Intel® _{QM67 or HM57 PCH}

ƒ Up to 8GB with 2 DDR3 SO-DIMM sockets

ƒ Dual display support

ƒ PCI Express x1 and PCI Express Mini Card socket

Embedded Motherboards

As a Premier member of the Intel® _{Embedded Alliance, we are able to}

provide innovative embedded motherboards based on new processor platforms as early as possible into the silicon cycle to maximize the market potential of your product.

MATXM-CORE-411-B MicroATX Motherboard

ƒ rPGA989 socket (Socket G) for Intel®

Core™ i7 processor up to 2.6 GHz

ƒ QM57 Express MCH

ƒ Up to 8GB DDR3 memory

ƒ One PCI Express x16 expansion socket and three PCI Express x1 expansions sockets

ƒ Dual simultaneous display

ƒ PCI Express Mini Card socket for WiFi/WiMAX

ƒ Unique midplane allowing easy, cost-effective maintenance

ƒ Management technology for remote diagnostics and repair

MATXM-CORE-411-WR Embedded Development Kit

ƒ MATXM-CORE-411-B, Intel Core i7-620M CPU, 2GB DDR3 RAM

ƒ Wind River LiveUSB evaluation kit demonstrating Hypervisor 1.1, Wind River Linux 3.0.2, Wind River VxWorks 6.8 and Wind River Workbench 3.2

ƒ Start evaluating out-of-the-box in minutes

MATXM-C2-410-B MicroATX Motherboard

ƒ 478-pin micro-FCPGA socket (Socket P) for Intel Core 2 Duo T9400 or Intel®

Celeron® _{575 processors}

ƒGM45 Express GMCH and ICH9M

ƒ Unique midplane allowing easy, cost-effective maintenance

ƒ PoweredUSB ports for connection to POS peripherals

ƒ Up to 8GB DDR3 memory

ƒ LVDS or VGA primary display

ƒ HDMI secondary display

Emerson is quickly becoming the preferred embedded motherboard supplier

to a broad range of industries including medical, retail, automation, test and

measurement, transportation and renewable energy.

COMX-420 Module

ƒ Intel Atom processor N450 at 1.6 GHz

ƒ Type 2 COM Express module

ƒ Up to 2GB DDR2 memory

ƒeUSB flash socket

ƒ Gigabit Ethernet, SATA and PCI Express ports

ƒ LVDS graphics for flat panel displays

ƒ Eight USB 2.0 interfaces

COMX-CORE Series Modules

ƒ Intel® _{Core™ i3, i5 and i7 processors}

ƒ Basic size 125 mm x 95 mm

ƒ Type 6 for improved graphics

ƒUp to 8GB DDR3 memory (ECC and non-ECC available)

ƒ eUSB flash socket

ƒ Gigabit Ethernet, SATA and USB ports

ƒ Dual graphics outputs

ƒ Multiple PCI Express lanes for high speed expansion

COMX-CAR-210 Carrier

ƒ Type 2 carrier board

ƒ MicroATX form factor allows rich I/O and expansion

ƒ Supports COMX-3 and COMX-4 Type 2 modules

COMX-CAR-610 Carrier

ƒ Type 6 carrier board

ƒ MicroATX form factor allows rich I/O and expansion

ƒ Support for COMX-CORE Type 6 modules

Computer-on-Module (COM)

Computer-on-Modules (COMs) are highly integrated single-board computers that provide the core functionality of a system, allowing application-specific features to be designed onto a carrier board creating a semi-custom embedded PC solution. Emerson COM products feature the latest Freescale QorIQ™ and Intel® _{Atom™ and Core™ processors.}

COMX-315 Module

ƒ COM Express® _{Type 2 compatible}

module

ƒ 1.0 GHz Intel® _{Atom™ processor E640}

ƒ Intel® _{Platform Controller Hub EG20T}

ƒ1GB DDR2 soldered memory

ƒ Compact size (95 mm x 95 mm)

ƒ XDP debug header

COMX-430/440 Modules

ƒ Intel Atom processor D410/ D510 @ 1.66 GHz

ƒ Up to 4GB DDR2 memory

ƒ Gigabit Ethernet, SATA and PCI Express

ƒ LVDS graphics for flat panel displays

COMX-P4080 Module

ƒ Freescale QorIQ™ P4080 processor

ƒ Eight e500mc Power Architecture cores running at 1.5 GHz

ƒ Supports two channels of 2GB DDR3-1333 ECC SO-UDIMM (4GB max.)

ƒ 95 mm x 125 mm compact footprint

ƒ 12 configurable SERDES lanes available for maximum flexibility

COMX-P2020 Module

ƒ Freescale QorIQ P2020 processor

ƒ Two e500 Power Architecture cores running at 1.2 GHz

ƒ On-board XGI Z11M graphics processor unit (GPU)

ƒ Supports up to 2GB DDR3 ECC SO-UDIMM

ƒ 95 mm x 95 mm compact footprint

ƒ MicroSD card slot for on-board storage

COMX-P1022 Module

ƒ Freescale QorIQ P1022 processor

ƒ Two e500 Power Architecture cores running at 1.0 GHz

ƒ Supports up to 2GB DDR3 ECC SO-UDIMM

ƒ 95 mm x 95 mm compact footprint

ƒ MicroSD card slot for on-board storage

COMX-CAR-P1 Carrier

ƒ Freescale QorIQ module carrier

ƒ MicroATX form factor allows rich I/O and expansion

RapiDex

TM

Board Customization Service

The ability to specify the exact features and form factor required in an embedded motherboard is within reach

of every product designer with the innovative RapiDex

TM

_{board customization service from Emerson Network}

Power. Designed from the ground up to be fast and affordable, the RapiDex service enables embedded system

designers to consider a custom motherboard for products where custom solutions were previously out of reach.

Our innovations in board design technology and manufacturing processes drastically reduce the front-end

costs for custom boards. Typical customization engagements in the industry today require open-ended,

non-recurring engineering fees and volume production commitments while the RapiDex service has only a

minimal set-up fee and a low minimum order quantity of only 100 units. A simple specification procedure

and new Emerson manufacturing processes enable customers to receive their custom board within eight

weeks of the order.

The Emerson RapiDex service can remove the need to

use a standard product that may not be optimized for

the application, leading to improved cost, space and

power profiles. By putting board customization within

reach, designers extend their control.

With the low barrier-to-entry cost threshold of the

RapiDex service, product designers can specify a

motherboard form factor to exactly correspond with

the features required in their range of products. And

when the product designer wants to selectively

upgrade motherboard features, such as the processor

or I/O on the board, they can exercise complete control

over that specification. No longer is the designer

required to compromise as they search for a best-fit

computing platform.

iVPX7223 ƒ ƒƒ3UƒVITAƒ46ƒVPXƒandƒVITAƒ65ƒOpenVPX ƒ ƒƒVITAƒ48ƒVPXƒREDIƒtwo-levelƒmaintenanceƒ (2LM) ƒ ƒƒ2ndƒgenerationƒIntel®_{ƒCore™ƒi7ƒvPro™ƒ} 2.2ƒGHzƒprocessorƒdual-core ƒ ƒƒIntel®_{ƒQM67ƒPlatformƒControllerƒHub} ƒ ƒƒUpƒtoƒ8GBƒECC-protectedƒDDR3-1333ƒ soldered ƒ ƒƒXMCƒsite ƒ ƒƒPCIƒExpressƒfatƒpipeƒfabric ƒ ƒƒ1000Base-BX/KXƒcontrolƒplane ƒ ƒƒIntegratedƒ2D/3Dƒgraphicsƒwithƒdigitalƒƒ andƒVGAƒoutput ƒ ƒƒOptionalƒrearƒtransitionƒmodule ƒ ƒƒPayloadƒmoduleƒprofile –ƒ MOD3-PAY-2F2U-16.2.3-3 ƒ ƒƒPayloadƒslotƒprofile –ƒ SLT3-PAY-2F2U-14.2.3 –ƒ SLT3-PAY-1F1F2U-14.2.4 ƒ ƒƒAirƒandƒconductionƒcooled ƒ ƒƒ-40ƒ°Cƒtoƒ+85ƒ°Cƒandƒruggedƒvariants

OpenVPX

TM

Products

VPXƒisƒaƒrevolutionaryƒstandardƒfromƒVITAƒforƒnextƒgenerationƒhighƒendƒcommuteƒintensiveƒapplications.ƒƒ

Itƒcombinesƒlatestƒgenerationƒconnectorƒandƒpackagingƒtechnologyƒwithƒhighƒspeedƒfabricƒconnectivityƒinƒƒ

bothƒ3Uƒandƒ6UƒEurocardƒformƒfactors.ƒTheƒOpenVPX™ƒstandardƒdefinesƒtheƒsystem-levelƒinteroperabilityƒforƒƒ

multi-moduleƒsystemƒenvironments.ƒ

EmersonƒOpenVPXƒproductsƒofferƒtheƒlatestƒinƒprocessor,ƒmemory,ƒandƒhighƒspeedƒfabricƒtechnologiesƒwithƒƒ

leading-edgeƒruggedƒandƒcoolingƒcapabilities.ƒTheyƒareƒidealƒforƒhighƒendƒindustrial,ƒcommunicationƒandƒƒ

military/aerospaceƒapplications.

iVPX7220 ƒ ƒƒ6UƒVITAƒ46ƒVPXƒandƒVITAƒ65ƒOpenVPX ƒ ƒƒVITAƒ48ƒVPXƒREDIƒtwo-levelƒmaintenanceƒ (2LM) ƒ ƒƒ2ndƒgenerationƒIntelƒCoreƒi7ƒvProƒƒ processorƒ2.2ƒGHzƒ(dual-ƒorƒquad-core) ƒ ƒƒIntel®_{ƒQM67ƒPlatformƒControllerƒHub} ƒ ƒƒUpƒtoƒ16GBƒECC-protectedƒDDR3-1333ƒ solderedƒ(designedƒforƒ16GB)ƒ ƒ ƒƒDualƒPMC/XMCƒsite ƒ ƒƒPCIƒExpressƒfatƒpipeƒfabric ƒ ƒƒ1000Base-Tƒorƒ1000Base-BXƒcontrolƒplane ƒ ƒƒIntegratedƒ2D/3Dƒgraphicsƒwithƒƒ DVI/DisplayPortƒandƒVGAƒoutput ƒ ƒƒSSDƒKit ƒ ƒƒOptionalƒrearƒtransitionƒmodule ƒ ƒƒPayloadƒmoduleƒprofile –ƒ MOD6-PAY-4F1Q2U2T-12.2.1-3ƒandƒƒ ƒ 12.2.1-4ƒ ƒ ƒƒPayloadƒslotƒprofile –ƒ SLT6-PAY-4F2T-10.2.2 –ƒ SLT6-PAY-4F1Q2U2T-10.2.1 ƒ ƒƒAirƒandƒconductionƒcooled ƒ ƒƒ-40ƒ°Cƒtoƒ+85ƒ°Cƒandƒruggedƒvariants

MVME2500

ƒ 800 MHz or 1.2 GHz Freescale QorIQ™ P2010 and P2020 processors

ƒ 1GB or 2GB DDR3-800, soldered down

ƒ Three on-board Gigabit Ethernet interfaces (one front, one rear, one configurable to front or rear)

ƒ Five serial ports

ƒ One USB 2.0 port

ƒ One PMC/XMC site

ƒ Optional rear transition module

ƒ Hard drive mounting kit available

ƒ Extended temperature (-40 °C to +71 °C) and rugged variants

iVME7210

ƒ Intel® _{Core™ i7 dual-core integrated}

processor (1.06 GHz ULV or 2.0 GHz LV)

ƒ4GB or 8GB ECC-protected DDR3-800/1066 (soldered)

ƒMobile Intel® _{5 Series chipset: Ibex Peak-M}

Platform Controller Hub (PCH)

ƒ256KB non-volatile F-RAM

ƒDVI-I interface

ƒDual Gigabit Ethernet, USB 2.0 and SATA to VXS P0

ƒFour on-board Gigabit Ethernet (GbE) interfaces

ƒFive serial ports

ƒUp to three front USB 2.0 ports

ƒ Up to two PMC/XMC sites

ƒSATA hard drive and mounting kit available

VME Products

A combination of high performance, rugged, modular construction and broad industry support makes Emerson VMEbus products ideal to address the needs of OEMs serving embedded computing markets.

As part of the group of innovative companies that invented the VMEbus nearly 30 years ago, we have consistently

worked to enhance and extend VMEbus technology. This process continues with VXS and 2eSST technologies which boosts the performance and capability of VMEbus technology while maintaining compatibility with existing systems over long product life cycles. Multi-core processors in our latest VME boards and ruggedized, extended temperature boards are just two of the other ways in which we are continuing to push the boundaries of performance and flexibility.

Emerson VME products are supported by our industry alliance members, specialist companies that can tailor VME-based solutions to fit your application. This ecosystem, together with a worldwide sales and support network, helps to rapidly integrate the optimum solutions into customer end applications. For example, special features including extended temperature, conformal coating and ruggedized variants are options for select VME boards from our alliance partners. VMEbus technology is employed around the world in a variety of highly demanding applications.

MVME4100

ƒ System-on-chip Freescale MPC8548E (1.3 GHz) with PowerPC® _e500

processor core

ƒ 2GB of DDR2 ECC memory, 128MB NOR flash and 4GB NAND flash

ƒ 512KB of MRAM non-volatile memory

ƒ 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus

ƒ Four GbE ports; five serial ports

ƒ USB 2.0 controller for integrating cost-effective peripherals

ƒ Dual 33/66/100MHz PMC sites for expansion

ƒ x8 PCI Express expansion connector for PMC/XMC expansion

ƒ Extended temperature -40 °C to +71 °C variant

MVME7100

ƒ System-on-chip Freescale MPC864xD with dual PowerPC e600 processor cores

ƒ Up to 2GB of DDR2 ECC memory, 128MB NOR flash and 4GB or 8GB NAND flash

ƒ USB 2.0 controller for integrating cost-effective peripherals

ƒ 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus

ƒ Dual 33/66/100MHz PMC-X sites for expansion via industry standard modules

ƒ x8 PCI Express expansion connector for PMC-X and XMC expansion using XMCspan

ƒ Extended temperature -40 °C to +71 °C variant

MVME3100

ƒ System-on-chip Freescale MPC8540 with PowerPC e500 processor core

ƒ Two GbE ports plus an additional 10/100BaseTX port

ƒ Up to 512MB of DDR333 ECC memory

ƒ 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus

ƒ USB 2.0 and Serial ATA controllers for integrating cost-effective peripherals

ƒ Dual 33/66/100 MHz PMC-X sites for expansion via industry standard modules

MVME6100

ƒ MPC7457 PowerPC processor running at up to 1.267 GHz

ƒ 128-bit AltiVec coprocessor for parallel processing

ƒ Up to 2GB of on-board DDR ECC memory and 128MB of flash

ƒ 2eSST VMEbus protocol with 320MB/s transfer rate across the VMEbus

ƒ Two 33/66/100 MHz PMC-X sites

ƒ Dual GbE interfaces for high performance networking

MVME5500

ƒMPC7457 PowerPC processor at 1 GHz with 256KB of on-chip L2 cache and 2MB of L3 cache

ƒ AltiVec coprocessor for high-perfor-mance computational applications

ƒ 512MB of on-board 133 MHz SDRAM ECC memory

ƒ 512MB additional memory via memory mezzanine card

ƒ Two banks of soldered flash memory (32MB and 8MB)

ƒ Dual independent 64-bit PCI buses and PMC sites with a bus speed of up to 66 MHz

ƒ GbE interface plus an additional 10/100BaseTX Ethernet interface

ƒ 64-bit PCI expansion mezzanine connector allowing up to four more PMCs

MVME5100/5110

ƒ MPC7410 or MPC750 microprocessor with 32KB/32KB L1 cache and up to 2MB of secondary backside cache

ƒ Up to 512MB of on-board ECC SDRAM – expandable up to 1GB with optional RAM500 memory expansion modules

ƒ 17MB flash memory

ƒ Dual IEEE P1386.1 compatible 32/64-bit PMC expansion slots

ƒ 64-bit PCI expansion mezzanine connector allowing up to four more PMCs

ƒ Dual 16550 compatible async serial ports

ƒ Dual 10BaseT/100BaseTX Ethernet interface

XMCspan

ƒ Dual XMC/PMC expansion card for use with the MVME7100 and MVME4100

ƒ Two x4 PCI Express through XMC sites

CompactPCI

®

Products

CompactPCI

®

_{technology offers the performance and processor independence of the PCI bus in a rugged,}

modular Eurocard form factor, creating a robust embedded computing technology that is ideal for

telecommunications, industrial control and imaging applications.

CompactPCI Platforms

The Emerson CPX8216 family of high availability CompactPCI® _{systems is}

designed for critical telecom infrastructure applications requiring 5NINES availability. This carrier-grade platform features the ability to hot swap boards, route additional high speed sub-buses over the backplane and connect large amounts of I/O from a plug-in board through the backplane and out of the rear of a chassis. Our CompactPCI systems incorporate built-in redundancy of all major subsystems and are well suited for building media gateways, call servers, Voice over IP (VoIP) gateways and Internet edge switches.

CPX8216 CompactPCI High Availability System

ƒ Dual 8-slot backplane (CPX8216 models) or backplane with H.110 bus to all I/O slots (CPX8216T models) for high availability designs

ƒ PowerPC system controller CPU allows simplex or duplex configurations

ƒ Three 400W hot-swappable AC or DC power supply fan units provide N+1 redundancy

ƒ Front access service and installation of CompactPCI boards, drives, fans, and power supplies for easy access to active components

ƒ Rear connection of I/O allows card removal without disconnecting field wiring

ƒ Detection of power, temperature, and fan fail conditions supports remote reporting

ƒ Adherence to PICMG 2.0 rev. 2.1, PICMG 2.1 rev. 1.0, PICMG 2.5 rev. 1.0 CompactPCI industry standard specifications provide worldwide acceptance and conformance

CPCI7203 3U CompactPCI Board

ƒ Intel® _{Core™ i7 processor (1.06 or 2.0 GHz)}

with integrated memory controller

ƒ Intel® _{Ibex Peak host controller}

ƒ 1GB, 2GB, 4GB, 8GB DDR3-800/1066 memory

ƒ Front panel I/O includes two Gigabit Ethernet, two USB 2.0, VGA

ƒ Rear I/O includes SATA, USB 2.0, PCI Express, UART

ƒ 2Mb NVRAM

ƒ 4GB MicroSD memory

ƒ Trusted platform management

ƒ VMware certified

CPCI6200 PICMG 2.0/2.16 Processor Board

ƒ Freescale MPC8572 (1.3 or 1.5 GHz) dual-core integrated processor

ƒ Integrated north bridge in the processor

ƒ 2GB or 4GB ECC-protected DDR3-800 memory

ƒ Four on-board GbE interfaces

ƒ Two serial ports; one USB 2.0 port

ƒ PICMG 2.9 and 2.16 CompactPCI specifica-tion support

ƒ Full PICMG 2.1, R2.0 Hot Swap specification compliance

ƒ Two PCI-X/PMC sites; one XMC (PCI Express x4) capable site

ƒ Optional RTM in PICMG 2.16 and rear I/O variants

ƒ PLX6466 PCI-to-PCI bridge technology

CPCI-6020 Host Slot Processor Board

ƒ MPC7410 PowerPC processor

ƒ High performance L2 cache

ƒ High performance, low-latency SDRAM subsystem

ƒ Up to 2GB of ECC protected capacity

ƒ New DMA capability

ƒ Dual 10/100BaseT Ethernet

ƒ Four optional USB ports (two in the front)

ƒ Two async serial ports, two async/sync serial ports, keyboard and mouse

CompactPCI Boards

Emerson offers processor boards featuring either Intel® _{or PowerPC}®

Global Possibilities

Thanks to our extensive worldwide network of logistics facilities and design centers in the USA, Europe, India and Asia-Pacific region, we can deliver services where you need them. Service programs can be customized and tailored to specific geographic needs depending on the technology deployed, support requirements and product lifecycle. As global product support becomes more complex, we help simplify your service chain to insure success wherever your customers are located.

Seamless Lifecycle Support

The Solution Services portfolio focuses on three service offerings based on typical product development and lifecycles; Design, Deployment and Renewal. Design Services can help you minimize design time and speed your new products to market. Deployment Services can help you to train your technical staff, resolve technical issues as well as integrate and test your products efficiently and cost effectively. Renewal Services provide long-term product and support options and can help you to achieve a smooth transition between generations of products.

Design Services

During your project design and development phase, it’s all about time. Time-to-market and time-to-revenue are the yardsticks you use to measure your success. You need to complete your project in the shortest amount of time with the least number of changes or redesign cycles. Our Design Services range from product concept creation to pre-release customer acceptance.

ƒ Development Consulting

ƒ Development Support

ƒ Application Porting

ƒ Benchmarking

Solution Services

As an embedded computing industry leader, we have a deep knowledge of our customers, their diverse

markets, product applications and environments. Our Solution Services portfolio extends our customers’

reach in today’s demanding markets. This suite of services was designed around our customers’ product

lifecycles and allows Emerson to deliver critical services and support when and where they are needed. We

can also create specialized service offerings for your specific product or industry requirements. Our

engi-neers, technicians and consultants are ready to tackle your toughest challenges, allowing you to focus on

what will really add value to your business.

Deployment Services

Deployment Services are designed to protect your product investment after release to your customers or markets. You need to ensure customer satisfaction while maintaining a predictable support cost model. Even if you have your own services organization, our Deployment offerings can complement and extend your service portfolio.

ƒ Technical Support

ƒ Product Integration

ƒ Warranty Services

ƒ Repair Services

Renewal Services

As your product moves into the mature stage of its lifecycle, you may be faced with challenges that include long-term support for customers not ready to move to newer products, finding ways to increase the current product’s performance and/or functionality, as well as migrating legacy applications and functionality to new platforms. With our Renewal Services, we have solutions for each of these challenges.

ƒ Longevity of Repair

ƒ Longevity of Support

ƒ Product Migration Consultation

ƒ Platform Technology Insertion

Our Solution Services portfolio extends

your reach by enabling you to seamlessly

deliver global services to your customers in

all phases of their product lifecycle.

ƒ Performance Analysis

ƒ System Concept Design

ƒ Regulatory Testing ƒ Engineering Support ƒ On-site Support ƒ Installation Support ƒ Logistics Programs ƒ Revision Management

Innovation Partnership Program

Emerson’s Innovation Partnership Program (IPP) brings together a select community of companies committed to transforming leading-edge embedded technologies into globally available, application-specific business solutions. IPP enables Emerson Network Power to offer complete solutions to customers by building upon the foundations of these important industry standards – ATCA, COM Express, Carrier Grade Linux and the Service Availability Forum. With a diverse array of partners spanning a broad range of technologies and applications, the Innovation Partnership Program ensures customers that they will receive comprehensive, application-specific solutions with guaranteed interoperability from a single source.

Our partners’ capabilities span a broad range of technologies and capabilities. Silicon provider partners help us determine the appropriate product and services roadmaps to meet customers’ requirements for performance and stability. OS partners offer the ability to provide customers a choice of fully integrated, rugged operating systems. Application and protocol partners allow us to offer more complete solutions to layer on top of the OS. And finally, additional partners help us gain time-to-market advantages in specific areas such as modular storage or network I/O. The Innovation Partnership Program is divided into three categories which reflects the depth of the offerings Emerson has with its partners.

Strategic

Deep engagement exists with our Strategic partners. Not only do we validate specific products, but we work closely together to drive alignment around corporate and product strategies. We coordinate roadmaps and constantly look for better ways to serve our joint customers.

Integrated

We have a similar working relationship with our Integrated partners, usually with the goal of supporting a specific customer requirement or specific product.

Emerson Compatible

Compatible partners allow us to confidently extend more choices to customers across specific application areas.

For a complete list of Emerson partners, please refer to our web site at EmersonNetworkPower.com/EmbeddedComputing

The Emerson Network Power company that accepts Buyer’s order for Goods is herein referred to as the “Seller” and the person or entity purchasing goods or services (“Goods”) and/or licensing software and/or firmware which are preloaded, or to be loaded into Goods (“Software”) from Seller is referred to as the “Buyer.” These Terms and Conditions, any price list or schedule, quotation, acknowledgment or invoice from Seller relevant to the sale of the Goods and licensing of Software and all documents incorporated by specific reference herein or therein constitute the complete and exclusive statement of the terms governing the sale of Goods and license of Software by Seller to Buyer. Seller’s acceptance of Buyer’s purchase order is expressly conditional on Buyer’s assent to all of Seller’s terms and conditions of sale, including terms and conditions that are different from or additional to the terms and conditions of Buyer’s purchase order. Buyer’s acceptance of the Goods and/or Software will manifest Buyer’s assent to these Terms and Conditions. Seller reserves the right in its sole discretion to refuse orders. Notwithstanding anything to the contrary, in the event that the provisions of these Terms and Conditions conflict with the provisions of an effective agreement signed by a duly authorized repre-sentative of both parties (“Effective Agreement”) that applies to the transaction(s) contemplated herein, the Effective Agreement shall control.

1. PRICES: Unless otherwise specified in writing by Seller, the price quoted or specified by Seller for the Goods and/or Software shall remain in effect for 30 days after the date of Seller’s quotation or acknowledgment of Buyer’s order for the Goods and/or Software, whichever occurs first, provided an unconditional authorization from Buyer for the shipment of the Goods and/or Software is received and accepted by Seller within such time period. If such authorization is not received by Seller within such 30 day period, Seller shall have the right to change the price for the Goods and/ or Software to Seller’s price for the Goods and/or Software at the time of shipment. All prices and licensee fees are exclusive of taxes, transportation and insurance, which are to be borne by Buyer.

2. TAXES: Any current or future tax or governmental charge (or increase in same) affecting Seller’s costs of production, sale, or shipment, or which Seller is otherwise required to pay or collect in connection with the sale, purchase, delivery, storage, processing, use or consumption of Goods, shall be for Buyer’s account and shall be added to the price or billed to Buyer separately, at Seller’s election.

3. TERMS OF PAYMENT: Unless otherwise specified by Seller, terms are net 30 days from date of Seller’s invoice in U.S. currency. Seller shall have the right, among other remedies, either to terminate this agreement or to suspend further performance under this and/or other agreements with Buyer in the event Buyer fails to make any payment when due, which other agreements Buyer and Seller hereby amend accordingly. Buyer shall be liable for all expenses, including attorneys’ fees, relating to the collection of past due amounts. If any payment owed to Seller is not paid when due, it shall bear interest, at a rate to be determined by Seller, which shall not exceed the maximum rate permitted by law, from the date on which it is due until it is paid. Any payment due to either party under this agreement shall be made in full without any set-off, restriction, condition deduction or withholding for or on account of any counterclaim. Should Buyer’s financial responsibility become unsatisfactory to Seller, cash payments or security satisfactory to Seller may be required by Seller for future deliveries of the Goods and/or Software. If such cash payment or security is not provided, in addition to Seller’s other rights and remedies, Seller may discontinue deliveries.

4. SHIPMENT AND DELIVERY: While Seller will use all reasonable commercial efforts to maintain the delivery date(s) acknowledged or quoted by Seller, all shipping dates are approximate and not guaranteed. Seller reserves the right to make partial shipments. Seller, at its option, shall not be bound to tender delivery of any Goods and/or Software for which Buyer has not provided shipping instructions and other required information. If the shipment of the Goods and/or Software is postponed or delayed by Buyer for any reason, Buyer agrees to reimburse Seller for any and all storage costs and other additional expenses resulting therefrom. Risk of loss and legal title to the Goods shall transfer from Seller to Buyer upon delivery to and receipt by carrier at Seller’s shipping point. Unless otherwise specified by Seller, all shipments are F.C.A. Seller’s shipping point (Incoterms 2000). Any claims for shortages or damages suffered in transit are the responsibility of Buyer and shall be submitted by Buyer directly to the carrier. Shortages or damages must be identified and signed for at the time of delivery.

Buyer shall inspect Goods delivered to it by Seller immediately upon receipt, and, any course of dealing to the contrary notwithstanding, failure of Buyer to give Seller notice of any claim within 10 days after receipt of such Goods shall be an unqualified acceptance of such Goods.

5. LIMITED WARRANTY: Subject to the limitations of Section 6 and unless otherwise specified by Seller in writing, Seller warrants that the Goods manufactured by Seller will be free from defects in material and workmanship and substantially meet Seller’s published specifications at the time of shipment under normal use and regular service and maintenance for (a) the period specified in Seller’s then current product data sheets from the date of manufacture by Seller for standard Embedded Power Goods, (b) 2 years from initial shipment for standard Embedded Computing Goods, and (c) the period specified by Seller in writing for custom Embedded Power Goods and custom Embedded Computing Goods. Unless otherwise stated in a

THE WARRANTIES SET FORTH IN SECTIONS 5 AND 7 ARE THE SOLE AND EXCLUSIVE WARRANTIES GIVEN BY SELLER WITH RESPECT TO THE GOODS AND SOFTWARE AND ARE IN LIEU OF AND EXCLUDE ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, ARISING BY OPERATION OF LAW OR OTHERWISE, INCLUDING WITHOUT LIMITATION, MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE WHETHER OR NOT THE PURPOSE OR USE HAS BEEN DISCLOSED TO SELLER IN SPECIFICATIONS, DRAWINGS OR OTHERWISE, AND WHETHER OR NOT SELLER’S PRODUCTS ARE SPECIFICALLY DESIGNED AND/OR MANUFACTURED BY SELLER FOR BUYER’S USE OR PURPOSE.

These warranties do not extend to any losses or damages due to misuse, accident, abuse, neglect, negligence (other than Seller’s), unauthorized modification or alteration, use beyond rated capacity, unsuitable power sources or environmental conditions, improper installation, repair, handling, maintenance or application or any other cause not the fault of Seller. To the extent that Buyer or its agents have supplied specifications, information, representation of operating conditions or other data to Seller in the selection or design of the Goods and the preparation of Seller’s quotation, and in the event that actual operating conditions or other conditions differ from those represented by Buyer, any warranties or other provisions contained herein that are affected by such conditions shall be null and void.

If within 30 days after Buyer’s discovery of any warranty defects within the warranty period, Buyer notifies Seller thereof in writing, Seller shall, at its option and as Buyer’s exclusive remedy, repair, correct or replace per its return policy, or refund the purchase price for, that portion of the Goods found by Seller to be defective. Failure by Buyer to give such written notice within the applicable time period shall be deemed an absolute and unconditional waiver of Buyer’s claim for such defects. Advance written permission to return Goods must be obtained from Seller. Such Goods must be shipped transportation prepaid to Seller. Returns made without proper written permission will not be accepted by Seller. Seller reserves the right to inspect Goods prior to authorizing return. Goods repaired or replaced during the warranty period shall be covered by the foregoing warranties for the remainder of the original warranty period or 90 days from the date of shipment, whichever is longer. Buyer assumes all other responsibility for any loss, damage, or injury to persons or property arising out of, connected with, or resulting from the use of Goods and/or Software, either alone or in combination with other products/components.

PRE-PRODUCTION (Prototype, Engineering Verification Test, or Design Verification Test) UNITS ARE SOLD “WHERE IS, AS IS, WITH ALL FAULTS” WITHOUT WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR INTENDED PURPOSE.

6. LIMITATION OF REMEDY AND LIABILITY: THE SOLE AND EXCLUSIVE REMEDY FOR BREACH OF ANY WARRANTY HEREUNDER (OTHER THAN THE WARRANTY PROVIDED UNDER SECTION 7) SHALL BE LIMITED TO REPAIR, CORRECTION OR REPLACEMENT, OR REFUND OF THE PURCHASE PRICE UNDER SECTION 5.

SELLER SHALL NOT BE LIABLE FOR DAMAGES CAUSED BY DELAY IN PERFORMANCE AND THE REMEDIES OF BUYER SET FORTH IN THIS AGREEMENT ARE EXCLUSIVE. IN NO EVENT, REGARDLESS OF THE FORM OF THE CLAIM OR CAUSE OF ACTION (WHETHER BASED IN CONTRACT, INFRINGEMENT, NEGLIGENCE, STRICT LIABILITY, OTHER TORT OR OTHERWISE), SHALL SELLER’S LIABILITY TO BUYER AND/OR ITS CUSTOMERS EXCEED THE PRICE PAID BY BUYER FOR THE SPECIFIC GOODS OR SOFTWARE PROVIDED BY SELLER GIVING RISE TO THE CLAIM OR CAUSE OF ACTION. BUYER AGREES THAT IN NO EVENT SHALL SELLER’S LIABILITY TO BUYER AND/OR ITS CUSTOMERS EXTEND TO INCLUDE INCIDENTAL, CONSEQUENTIAL OR PUNITIVE DAMAGES. The term “consequential damages” shall include, but not be limited to, loss of anticipated profits, business interruption, loss of use, revenue, reputation and data, costs incurred, including without limitation, for capital, fuel, power and loss or damage to property or equipment.

It is expressly understood that any technical advice furnished by Seller with respect to the use of the Goods and/or Software is given without charge, and Seller assumes no obligation or liability for the advice given, or results obtained, all such advice being given and accepted at Buyer’s risk.

7. PATENTS AND COPYRIGHTS: Subject to the limitations of the second paragraph of Section 6, Seller warrants that the Goods sold, except as are made specifically for Buyer according to Buyer’s specifications, do not infringe any valid U.S. patent or copyright in existence as of the date of shipment. This warranty is given upon the condition that Buyer promptly notifies Seller of any claim or suit involving Buyer in which such infringement is alleged and cooperates fully with Seller and permits Seller to control completely the defense, settlement or compromise of any such allegation of infringement. Seller’s warranty as to utility patents only applies to infringement arising solely out of the inherent operation according to Seller’s specifications and instructions of such Goods. In the event such Goods are held to infringe such a U.S. patent or copyright in such suit, and the use of such Goods is enjoined, or in the

and expense, to procure for Buyer the right to continue using such Goods, or replace them with non-infringing Goods, or modify same to become non-infringing, or grant Buyer a credit for the depreciated value of such Goods and accept return of them. In the event of the foregoing, Seller may also, at its option, cancel the agreement as to future deliveries of such Goods, without liability.

8. EXCUSE OF PERFORMANCE: Seller shall not be liable for delays in performance or for non-performance due to acts of God; acts of Buyer; war; fire; flood; weather; sabotage; epidemics; strikes or labor disputes; civil disturbances or riots; governmental requests, restrictions, allocations, laws, regulations, orders or actions; unavailability of or delays in transportation; default of suppliers; or unforeseen circumstances or any events or causes beyond Seller’s reasonable control. Deliveries or other performance may be suspended for an appropriate period of time or canceled by Seller upon notice to Buyer in the event of any of the foregoing, but the balance of the agreement shall otherwise remain unaffected as a result of the foregoing.

If Seller determines that its ability to supply the total demand for the Goods, or to obtain material used directly or indirectly in the manufacture of the Goods, is hindered, limited or made impracticable due to causes set forth in the preceding paragraph, Seller may allocate its available supply of the Goods or such material (without obligation to acquire other supplies of any such Goods or material) among its purchasers on such basis as Seller determines to be equitable without liability for any failure of performance which may result therefrom.

9. RESCHEDULE/CANCELLATION: Unless otherwise agreed in writing by Seller, orders under this agreement may not be rescheduled or canceled by Buyer for any reason.

10. CHANGES: Buyer may request changes or additions to the Goods and/ or Software consistent with Seller’s specifications and criteria. In the event such changes or additions are accepted by Seller, Seller may revise the price, license fees and dates of delivery.

Seller reserves the right to change designs and specifications for the Goods and/or Software without prior notice to Buyer, except with respect to Goods and/or Software being made to order for Buyer. Seller shall have no obligation to install or make such change in any Goods and/or Software manufactured prior to the date of such change. 11. NUCLEAR/MEDICAL: GOODS AND SOFTWARE SOLD HEREUNDER ARE NOT FOR USE IN CONNECTION WITH ANY NUCLEAR, MEDICAL, LIFE-SUPPORT AND OTHER HIGH RISK APPLICATIONS WHERE GOODS OR SOFTWARE FAILURE COULD LEAD TO LOSS OF LIFE OR CATASTROPHIC PROPERTY DAMAGE. Buyer accepts Goods and Software with the foregoing understanding, agrees to communicate the same in writing to any subsequent purchasers or users and to defend, indemnify and hold harmless Seller from any claims, losses, suits, judgments and damages, including incidental and conse-quential damages, arising from such use, whether the cause of action be based in tort, contract or otherwise, including allegations that the Seller’s liability is based on negligence or strict liability.

12. ASSIGNMENT: Buyer shall not assign its rights or delegate its duties hereunder or any interest herein without the prior written consent of Seller, and any such assignment, without such consent, shall be void.

13. SOFTWARE: Notwithstanding any other provision herein to the contrary, Seller or applicable third party licensor to Seller shall retain all rights of ownership and title in its respective Software, including without limitation all rights of ownership and title in its respective copies of such Software. Except as otherwise provided herein, Buyer is hereby granted a nonexclusive, non-transferable royalty free license to use the Software incorporated into the Goods solely for purposes of Buyer properly utilizing such Goods purchased from Seller. All other Software shall be furnished to, and used by, Buyer only after execution of Seller’s (or the licensor’s) applicable standard license agreement, the terms of which are incorporated herein by reference. The Software is Seller’s own or Seller’s supplier’s proprietary information, and Buyer and its employees and agents shall not disclose the Software to others without Seller’s prior written consent.

14. TOOLING: Tool, die, and pattern charges, if any, are in addition to the price of the Goods and are due and payable upon completion of the tooling. All such tools, dies and patterns shall be and remain the property of Seller. Charges for tools, dies, and patterns do not convey to Buyer, title, ownership interest in, or rights to possession or removal, or prevent their use by Seller for other purchasers, except as otherwise expressly provided by Seller and Buyer in writing with reference to this provision. 15. INTELLECTUAL PROPERTY: Seller’s intellectual property, including without limitation, all patents, copyrights, trade secrets, trade-dress and any other intellectual property of any kind (including without limitation, that which exists in the underlying

16. BUYER’S COMPLIANCE WITH LAWS: In connection with the transactions contemplated by this agreement, Buyer is familiar with and shall fully comply with all applicable laws, regulations, rules and other requirements of the United States and of any applicable state, foreign and local governmental body in connection with the purchase, license, receipt, use, transfer and disposal of the Goods and/or Software. 17. EXPORT/IMPORT: Buyer agrees that all applicable import and export control laws, regulations, orders and requirements, including without limitation those of the United States and the European Union, and the jurisdictions in which the Seller and Buyer are established or from which Goods and/or Software may be supplied, will apply to their receipt and use. In no event shall Buyer use, transfer, release, import, export, Goods and/or Software in violation of such applicable laws, regulations, orders or requirements.

18. GOVERNMENT CONTRACT CONDITIONS: In the event Buyer supplies Goods or Software to the U.S. Government or to a prime contractor selling to the U.S. Government, the following Federal Acquisition Regulation (FAR) clauses are accepted by Seller and are made part of this agreement applicable to such supply: 52.222-21 Prohibition of Segregated Facilities; 52.222-26 Equal Opportunity; 52.222-35 Equal Opportunity For Special Disabled Veterans, Veterans of Vietnam Era, and Other Eligible Veterans; 52.222-36 Affirmative Action For Workers with Disabilities; and 52.219-8 Utilization of Small Business Concerns. No additional FAR or FAR Supplement clauses are accepted by Seller. In the event Buyer elects to sell Goods or Software to the U.S. Government or any national, state, provincial or local non-U.S. governmental entity or to a prime contractor selling to such entities, Buyer does so solely at its own option and risk, and agrees not to obligate Seller as a sub-contractor or otherwise to the U.S. Government or other governmental entity except as described in this Section 18. Buyer remains solely and exclusively responsible for compliance with all statutes and regulations governing sales to the U.S. Government or any national, state, provincial or local non-U.S. governmental entity. Seller makes no representations, certifications or warranties whatsoever with respect to the ability of its Goods, Software, or prices to satisfy any such statutes and regulations. 19. GENERAL PROVISIONS: These terms and conditions supersede all other communications, negotiations and prior oral or written statements regarding the subject matter of these terms and conditions. No change, modification, rescission, discharge, abandonment, or waiver of these terms and conditions shall be binding upon the Seller unless made in writing and signed on its behalf by a duly authorized representative of Seller. No conditions, usage of trade, course of dealing or performance, understanding or agreement purporting to modify, vary, explain, or supplement these terms and conditions shall be binding unless hereafter made in writing and signed by the party to be bound, and no modification or additional terms shall be applicable to this agreement by Seller’s receipt, acknowledgment, or acceptance of purchase orders, shipping instruction forms, or other documentation containing terms at variance with or in addition to those set forth herein. Any such modifications or additional terms are specifically rejected and deemed a material alteration hereof. If this document shall be deemed an acceptance of a prior offer by Buyer, such acceptance is expressly conditional upon Buyer’s assent to any additional or different terms set forth herein. No waiver by either party with respect to any breach or default or of any right or remedy, and no course of dealing, shall be deemed to constitute a continuing waiver of any other breach or default or of any other right or remedy, unless such waiver be expressed in writing and signed by the party to be bound. All typographical or clerical errors made by Seller in any quotation, acknowledgment or publication are subject to correction. In the event that any provision or portion thereof contained in the Contract is held to be unenforceable, the Contract shall be construed without such provision or portion thereof.

(A) If Seller is a U.S. incorporated entity: This Agreement shall be governed by the laws of the State of Delaware, U.S.A., without reference to its choice or conflict of laws principles. The parties agree to submit to the exclusive jurisdiction of the courts of the State of Delaware for all actions arising in connection herewith.

(B) If Seller is a European incorporated entity: This Agreement shall be governed by the laws of England. Any dispute arising out of or in connection with this Agreement that cannot be resolved through friendly consultation shall be referred to and finally resolved by arbitration in London, England before the London Court of International Arbitration in accordance with its arbitration rules. The arbitral award shall be final and binding on the parties. (C) If Seller is an entity incorporated in the Asia Pacific region: This Agreement shall be governed by the laws of the Hong Kong Special Administrative Region of the People’s Republic of China. Any dispute arising out of or in connection with this Agreement that cannot be resolved through friendly consultation shall be referred to and finally resolved by arbitration in Hong Kong before the Hong Kong International Arbitration Centre in accordance with its arbitration rules. The arbitral award shall be final and binding on the parties.