Big Data Analytics and Decision
Analysis for Manufacturing
Intelligence to Empower Industry 3.5
Tsinghua Chair Professor Chen-Fu Chien, Ph.D.
Department of IEEM, National Tsing Hua University, Hsinchu 30013, Taiwan Director, NTHU-TSMC Center for Manufacturing Excellence; STEP Consortium
Co-chair: IEEE RAS Technical Committee on Semiconductor Manufacturing Automation
[email protected] 2015/10/17@KAIST
ISMI2015, Oct. 16-18, 2015
KAIST, Daejeon, South Korea
AMP
• R&D, 3D Printing, Big Data, Advanced Robots, Energy Saving
Industry 4.0
Cyber-Physical System, Smart Factory
• Information and Communication Technology, Cloud Computing, Internet of Things and Services
Humans and Robots Coexist
• Mutually-connected Robots, Autonomous Data Accumulatign and Utilizing
ICT, Smart Factories
• Internet of Things, Smart Plant, 3D Printing, Parts and Materials
Higher Value-Added Manufacturing
• Digital Manufacturing, Innovation-driven, Eco-friendly Manufacturing
Manufacturing Strategies of Leading
Nations
Europe 2020 Robotics Revolution Industry Innovation 3.0 Made in China 2025 Manufacturing Renaissance3
Challenges and Opportunities for
US Manufacturing Renaissance
• The US Manufacturing Enhancement Act • A National Strategic Plan for Advanced Manufacturing • "Buy American" Plan • A Five Year Plan to boost U.S. exports • White House AMP Initiatives5
Industry 4.0: German Future Project
Germany is preparing the 4th industrial revolution based on the
Internet of Things, Internet of Services, Big Data Analytics to empower Cyber-physical Production Systems to enhance various industries.
In the next 40 years to the Year 2050
Four stages of
the “Industrial Revolution”
1st: water (end of 18th century)- steam-powered mechanicalmanufacturing facilities
2nd: (start of 20thcentury)- electrically-powered mass production 3rd: (start of 1970s)- electronics and IT to achieve automation 4th : (today)- Cyber-Physical Systems
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*Source: Federal Ministry of Education and Research (2013), "Securing the future of German manufacturing industry recommendation the strategic initiative INDUSTRIE 4.0 final report of the industrie 4.0 working group," National Academy
of Science and Engineering.
Industry 2.0!?
The Second Industrial Revolution, also known as the Technological Revolution,[1] was a phase of the larger Industrial Revolution corresponding
to the latter half of the 19th century, sometime between 1840 and 1860 until World War I. It is considered to have begun around the time of the introduction of Bessemer steelin the 1850s and culminated in early
factory electrification,mass production and theproduction line. (Wikipedia)
Means or Objectives: Industry 4.0 is
different from Lean Production!?
9 • 工業4.0與豐田生產方式都是“後 拉式”生產體系,需要的時候才 按照所需的量生產所需的產品。 • 工業4.0則是“單個生產體系”, 不同生產線連在一起,靈活運用 包 括 感 測 器 ( Sensor ) 、 軟 體 ( Software ) 、 解 決 方 案 服 務 (Solution service),隨時交換大 數據,可按照客戶要求,隨意改 變供應商和生產程序,實現符合 成 本 效 益 的 訂 製 生 產 ( Tailor Made ) 」 , 稱 為 “ 大 規 模 訂 製 (Mass Customization)”。 • 工業4.0主張通過技術的使用,來 實現整個製造業而不僅僅只是工 廠的革新。 10 source:BOSCH
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source:BOSCH
source:SIEMENS
SIEMENS: open cloud platform for
industrial customers
A powerful, secure, and reliable cloud infrastructure enabling external experts to access the data, and merge them with other information
Siemens acts as a data custodian for customers
Easy integration into the Cloud for Industry
Siemens sets standards in terms of connectivity to both Siemens and third-party devices within and outside the plant
Currently in a pilot phase and is gradually planned to be rolled out to further customers from November 2015
Simens: open cloud platform for
industrial customers
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Platform for data-based services such as energy data management Platform for analyzing “big data” from industrial applications
Solution will be based on the SAP HANA®Cloud Platform
Platform as a Service offering for OEMs and application developers
source:SIEMENS
http://www.industry.siemens.com/services/global/en/portfolio/plant-data-services/cloud-for-industry/pages/default.aspx http://www.siemens.com/press/pool/de/pressemitteilungen/2015/digitalfactory/PR2015030152DFEN.pdf
Siemens Plant Analytics Services
Siemens acts as a data custodian
for customers
Value Network and Ecosystem
Increasing adoption of cloud, internet, smart phones, wearabledevices, multimode sensors enabled an unprecedented level of global mobile connectivity
Cloud ecosystem is the complex system of interdependent components that work together to enable cloud services.
15 Competition is now among business
ecosystems, no longer between individual companies
Value chain is restructured as
“network”, supply chain position is changing, & firm boundary become blurred.
Industry 3.5:
Hybrid Strategy of
best practice of
Industry 3.0 and
to-be Industry 4.0 with
disruptive
innovations to
empower
manufacturing
intelligence.
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Modeling, Big Data, and Decision Analysis to
Empower Manufacturing Intelligence
21
22
巨量
變動性
多樣性
真實性
Data Volume & Data Veracity
23 Extreme and missing values are filled in red and blue, respectively.
Data Quality due to
Data Veracity
latency/multi-response metrology-WAT data
25
WAT
(Current, Voltage, Resistance)
Inline
(Thickness, Critical Dimension)
Data Variety: High-dimensional,
Multi-collinear, Imbalanced Big Data
second minute hour day week month Frequency
Aggregated Detail Equipment data WAT data CP data Production data Metrology data Defect data Granularity Backward diagnosis & trouble shooting
For-ward prediction & process control
Time series
Fab Cycle Prediction and Reduction
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Source Drain Critical dimension (CD) -> 20nm > 30 layers 31
Overlay errors
N+1 layer
N layer
1 y 2 y 1 x 2 x 2 2 2 1 2 1 y y d x x d Y y X x Light source Reticle Lens Wafer X d x d Y d y d ) , (dxX dyY X Y 33
Dynamic backups to consider
both quality and productivity
35
x1 y2
x2 y1
Proposed R2R control block diagram
for overlay error compensation
Step1. Overlay process modeling for R2R control Step2. DAPI controller design
Empirical
Study
37 ‐0.07 ‐0.065 ‐0.06 ‐0.055 ‐0.05 ‐0.045 ‐0.04 ‐0.035 ‐0.03 1 4 7 10 13 16 19 22 25 28 31 34 37 40 43 46 49 52 55 58 61 64 67 70 73 76 79 82 85 88 91 94 97 10 0 10 3 10 6 Tx+X inputLot sequense EWMA DAPI
‐0.03 ‐0.02 ‐0.01 0 0.01 0.02 0.03 1 4 7 10 13 16 19 22 25 28 31 34 37 40 43 46 49 52 55 58 61 64 67 70 73 76 79 82 85 88 91 94 97 10 0 10 3 10 6 Tx+X output
Lot sequence EWMA DAPI
无论输出值或投入 值,DAPI的变异均 较小!
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ECD control enhancement Problem
definition
Correlation analysis for identifying influence factors Data collection & integration Data cleaning & pre-inspection
Least square estimation Linear model for modeling etching bias
Dissimilarity measurement Dispatching rule simulation
Performance tracing & discussion Data preparation Implementation Is fitness good enough? Model construction Significant? Parameter estimation
Product & chamber effect extraction Is result acceptable? Dispatching rule development Yes Yes Yes No No No
Problem definition
Data preparation
Model construction
Parameter estimation
Dispatching rule development &
offline validation
Implementation
Advanced Process Control (APC)
for CD control
Metrology
feedforward
feedback
Metrology
feedback
DCD
ECD
Photo
Etching
controller
controller
controller
APC Methodologies: • Run-to-run control
• Fault detection and classification (FDC) • Virtual metrology
Manufacturing intelligence framework
for DCD-ECD variation reduction
Estimate the chamber effects via mining historical data.
Define similarity measurement for etching chambers and
tools, respectively, to match with DCD results of wafers.
Determine tool priority for each process lot to support
real-time tool assignment and production control.
41
Modeling Etch Bias and Estimating
Product/Chamber Effects
Etch bias = ECD – DCD
Linear regression model is used to model Etch bias and
estimate the product and chamber effects
some of considered parameters
42 1 1). or (0 iable binary var are and . ,..., 1 , 1 chamber 1 Prod chamber Prod 1 chamber chamber 1 Prod Prod
C c ic P p ip ic ip i C c ic c P p ip p i x x x x n i x x E c
c
p
c c pchamber
for
effect
chamber
of
error
standard
:
chamber
for
effect
chamber
:
Product
for
effect
Product
:
target)
DCD
target
ECD
ˆ
(idealy,
bias
mean
:
chamber chamber Prod
Chamber dissimilarity
measurement
Chamber effect target
• chamber effect target is that the chamber effect c meeting this
target via the best process chamber for lot i.
Dissimilarity for each etch chamber
• The dissimilarity not only considers the squared distance between
estimated chamber effect and chamber effect target but also the standard error of estimated chamber effect.
• The chamber had the smallest dissimilarity is the best one for lot i.
43
.
,...,
1
,
ˆ
ˆ
ECD_Target
1 Prod Prodn
i
x
DCD
T
P p ip p i chamber i
.
,...,
1
;
,...
1
,
ˆ
ˆ
chamber 2 chamberC
c
n
i
T
d
c chamber i c c i
Validation and Implementation
The Cpk improvement was 20% in
average after implementation in an empirical study for a few months for a field test in Taiwan.
The scaling score is used to monitor
the operational effectiveness of the dispatching rules to trace the
control performance.
Product
Before implementation After implementation
Cpkimprovement Number of lot RMSE Standard deviation Cpk Number of lot RMSE Standard deviation Cpk A 163 0.0075 0.0073 2.34 140 0.0063 0.0061 2.84 21.39% B 100 0.0103 0.0068 2.56 108 0.0101 0.0062 2.82 10.12% C 98 0.0073 0.0073 2.25 136 0.0066 0.0066 2.51 11.28% D 239 0.0084 0.0084 1.61 493 0.0058 0.0058 2.40 48.87% E 105 0.0108 0.0096 1.90 156 0.0080 0.0079 2.49 30.95% F 215 0.0099 0.0083 2.19 274 0.0069 0.0072 2.72 24.30% G 183 0.0091 0.0085 2.22 219 0.0083 0.0085 2.35 5.56% H 224 0.0090 0.0086 2.23 370 0.0076 0.0074 2.80 25.69% 13.03% 3.73% 4.03% 7.85% 7.79% 7.37% 10.26% 11.65% 11.59% 22.69% 0% 5% 10% 15% 20% 25% 10 20 30 40 50 60 70 80 90 100 Fr e q ue nc y Tool score interval Average Cpk: 2.42 Average Cpk: 2.83
Dynamic Decisions for
site-imbalances IC final testing
45
Fundamental Objective Hierarchy
and Means Objective Network
Trade-off among alternatives
47
From Influence Diagram to
Decision Tree
Lot-End
Shut Down For Repair Close Low Yield Site(s) Shut Down? Close Site(s)? Yes No Continue Repair? Yes No No Complete Repair Yes Continue Test 49
Decisions in the Decision Flow
Site ID 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Estimated Load 0 13 13 13 13 13 0 13 13 13 13 13 13 13 13 13 Estimated Pass Real Yield 0.00 12.54 9.70 10.66 11.16 10.11 0.00 12.04 11.13 12.04 11.20 11.13 9.80 10.59 10.88 10.11 Site ID 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Estimated Load 13 13 13 13 13 13 13 13 13 13 13 13 13 12 12 12 Estimated Pass Real Yield 9.58 10.26 10.26 9.58 11.12 10.95 10.26 9.79 10.95 10.95 13.00 10.83 10.18 8.67 9.33 9.76
On-site operator’ decision: Close 14 sites including site 1, 3, 4, 5, 7, 9, 11, 12, 13, 15, 21, 23, 29, and 32.
• Passed Units: 322 units/ Testing Time: 28 time units Proposed optimal decision: Close 2 sites of the site 1 and 7.
• Passed Units: 318.54 units/ Testing Time: 13 time units
• p.s. ART (allowable repair time) = 8.45 minutes and thus should not shut down for repair
Validation of Empirical Study
Apple + IBM to empower business
analytics, optimization & decision
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