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copper substrate

Microstructural Investigation of Direct Metal Deposition of H13 Steel on High Strength Copper Substrate

Microstructural Investigation of Direct Metal Deposition of H13 Steel on High Strength Copper Substrate

... solid copper substrate using laser cladding technology, Direct Metal Deposition ...of copper particles and porosity in the laser cladded structure at various ...where copper in rounded form ...

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Unusual Wetting of Liquid Bismuth on a Surface Porous Copper Substrate Fabricated by Oxidation Reduction Process

Unusual Wetting of Liquid Bismuth on a Surface Porous Copper Substrate Fabricated by Oxidation Reduction Process

... solid copper shows good wettability as described ...surface-porous copper substrate prepared in the present work satisfies these conditions for this unusual wetting behavior, as shown in ...the ...

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Copper substrate electrode for efficient top illuminated organic photovoltaics

Copper substrate electrode for efficient top illuminated organic photovoltaics

... environmental sustainability. Many different OPV device architectures have been developed falling into the categories of conventional, inverted, top-illuminated, semi-transparent and multi-junction, each offering ...

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Solder joint strength on copper substrate under thermal aging condition

Solder joint strength on copper substrate under thermal aging condition

... Solder material plays a crucial part to provide the necessary electrical and mechanical interconnection in an electronic assembly (K.-I. Chen et al, 2006). During the soldering process, metallurgical reaction between ...

5

Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder

Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn Ag Eutectic Solder

... the substrate, Cu, Au-coated Cu (described as Au/Cu hereafter), Ag-coated Cu (described as Ag/Cu hereafter), and Pd-coated Cu (described as Pd/Cu hereafter) plates were ...of substrate was 10 30 0:3 mm 3 , ...

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Method for determining the adhesion force between graphene and copper

Method for determining the adhesion force between graphene and copper

... Abstract. The paper presents the technique of qualitative assessment of the strength of graphene layers adhesion to the surface of a copper substrate, where they are formed. The technique uses a complex of ...

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EFFECT OF DIFFERENT COBALT CONCENTRATION ON PROPERTIES OF ELECTRODEPOSITED Fe-Ni-Co THIN FILMS

EFFECT OF DIFFERENT COBALT CONCENTRATION ON PROPERTIES OF ELECTRODEPOSITED Fe-Ni-Co THIN FILMS

... Nano crystalline FeNiCo alloy thin films with different concentration of cobalt are deposited on the copper substrate by electro deposition method. Electro deposited FeNiCo thin films with different ...

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Effect of Pretreatment Process on the Adhesion and Corrosion Resistance of Chromium-Carbon Coatings Deposited on Copper Substrates

Effect of Pretreatment Process on the Adhesion and Corrosion Resistance of Chromium-Carbon Coatings Deposited on Copper Substrates

... polished copper substrate shows it has the lowest corrosion current density of ...polished substrate can be attributed to the crack-free structure within the thin film and its good adhesion on ...

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Electrochemical Characterization of Copper Coatings on Low Carbon Steel from Industrial Waste

Electrochemical Characterization of Copper Coatings on Low Carbon Steel from Industrial Waste

... the copper-based materials during the grinding process and fabrication ...the copper oxides and the spots (fogging) originated during the exposition of the copper to the atmosphere without attacking ...

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EFFECT OF DIFFERENT FERROUS CONCENTRATION ON STRUCTURALAND MECHANICAL PROPERTIES OF ELECTRODEPOSITED FeNiCo THIN FILMS

EFFECT OF DIFFERENT FERROUS CONCENTRATION ON STRUCTURALAND MECHANICAL PROPERTIES OF ELECTRODEPOSITED FeNiCo THIN FILMS

... The surface morphology of the electroplated Fe-Ni-Co thin films with different concentration of Ferrous Sulphate is analysed by SEM pictures and are shown in fig 1.The electroplated thin films are smooth and uniform. The ...

7

Electrochemical Performance of Mn Doped Co3O4 Thin Film Electrodes by Electrodeposition Method

Electrochemical Performance of Mn Doped Co3O4 Thin Film Electrodes by Electrodeposition Method

... this, copper foil is again electrodeposited at ...process copper foil is dipped in the solution composed of ...porous copper substrate by anodic aluminium oxide (AAO) ...

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Preparation of Copper Based Superhydrophobic Surfaces by Jet Electrodeposition

Preparation of Copper Based Superhydrophobic Surfaces by Jet Electrodeposition

... pure copper substrate, copper deposits, and modified copper-based hydrophobic surfaces were separately detected by dripping distilled water onto the sample ...the copper substrate ...

6

Characterization of Copper Coating Electrodeposited on Stainless Steel Substrate

Characterization of Copper Coating Electrodeposited on Stainless Steel Substrate

... of copper coating on various substrate surfaces ...of copper has been studied either on copper substrate [14,15] or numerous other substrates including gold [16], platinum [13,14], ...

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Fabrication of InGaN/GaN MQWs Vertical Blue Light-Emitting Diodes Using Laser Lift-Off Technique

Fabrication of InGaN/GaN MQWs Vertical Blue Light-Emitting Diodes Using Laser Lift-Off Technique

... Fig. 1 shows the photograph of fabricated vertical blue LED on electroplated thick copper substrate. The chip size of vertical blue LED was ~ 1.0 mm x 1.0 mm. Since thermal annealing play important role in ...

5

SYNTHESIS AND STRUCTURAL CHARACTERIZATION OF ELECTRO DEPOSITED NICKEL COBALT BORON ALLOY THIN FILM

SYNTHESIS AND STRUCTURAL CHARACTERIZATION OF ELECTRO DEPOSITED NICKEL COBALT BORON ALLOY THIN FILM

... The surface morphology of the electroplated Ni-Co-B thin films is analyzed by using SEM pictures and are shown in fig 3.The electroplated thin films are smooth, uniform and adherent with substrate. The thin films ...

8

Formation and Growth of Tin Whiskers on Aluminum Tin Alloys

Formation and Growth of Tin Whiskers on Aluminum Tin Alloys

... grains is thought to be the nature of the growth of whiskers. For explaining this process, the authors have proposed the following mechanism based on the study of the formation of whiskers on electroplated films of tin on ...

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Formation of a Self Interconnected Joint using a Low Melting Point Alloy Adhesive

Formation of a Self Interconnected Joint using a Low Melting Point Alloy Adhesive

... the copper line patterns of a glass-epoxy substrate, selective adhesional wetting of the melting alloy, enhanced by the oxygen-reduction capability of resin and capillary phenomena, was the main driving ...

7

Effect of Annealing Temperature and Atmosphere to Surface Solid Phase Reaction of Sapphire Substrates and Spin Coated Copper Nitrate Gel Films

Effect of Annealing Temperature and Atmosphere to Surface Solid Phase Reaction of Sapphire Substrates and Spin Coated Copper Nitrate Gel Films

... Figure 1 shows XRD patterns of the sapphire substrate with spin-coated copper nitrate films annealed at various temperatures (a) in air and (b) under nitrogen flow. For annealing in air at 800˚C or 900˚C, ...

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Characterization of copper cobolt oxide thin film coatings synthesized via sol-gel dip-coating method

Characterization of copper cobolt oxide thin film coatings synthesized via sol-gel dip-coating method

... XL 20. Surface morphology of the thin film was imaged using a PHILLIPS XL 20 scanning electron microscopy (SEM) and field emission scanning electron microscopy (FESEM) (Zeiss Neon 40EsB). For FESEM, the sample was ...

6

Write read 3D patterning with a dual channel nanopipette

Write read 3D patterning with a dual channel nanopipette

... ratio copper pillars, zigzag and -like structures, as well as permitting the subsequent topographical mapping of the patterned features with the same nanopipette probe as used for nanostructure ...

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