Ni/sub 3/Sn
IMC Growth of Solid State Reaction between Ni UBM and Sn 3Ag 0 5Cu and Sn 3 5Ag Solder Bump Using Ball Place Bumping Method during Aging
... With progress in high-density, high-speed technologies for semiconductor devices in recent years, high performance and substantial downsizing of electronic equipment have been achieved. These advancements in LSI ...
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Physico-mechanical and Tribological Properties of Fe-Cu-Ni-Sn and Fe-Cu-Ni-Sn-VN Nanocomposites Obtained by Powder Metallurgy Methods
... Fe–Cu–Ni– Sn matrix has been studied very little and is hardly discussed in the ...of 3 wt% of nanocrystalline vanadium nitride (VN) powder and subsequent hot pressing in vacuum reduced the size of ...
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Transmission Electron Microscopy of Interfaces in Joints between Pb Free Solders and Electroless Ni P*
... joint. 3–6) Matsuki, Ibuka and Saka 6) carried out a comprehensive analysis on the micro- structure of Pb–Sn eutectic solder ...electroless Ni–P under bump ...
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Effects of Zn Bearing Flux on Joint Reliability and Microstructure of Sn 3 5Ag Soldering on Electroless Ni Au Surface Finish
... of Sn-3.5Ag and Sn- 3.5Ag-8In soldering on a Ni-P layer, it was also reported that the addition of Zn into the solder apparently suppressed the rate of loss of strength of the aged ...
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Comparison between SAC405 lead free solders and EN(P)EPIG and EN(B)EPIG surface finishes
... insert Ni-based metallization layer between the solder and the Cu conducting ...approach, Ni-based insertion serves as a diffusion barrier, because the Ni-Sn reaction is two orders slower than ...
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BGA Jointing Property of Sn 8 8 mass%Zn and Sn 8 0 mass%Zn 3 0 mass%Bi Solder on Electroless Nickel Phosphorus/Immersion Gold Plated Substrates*
... conventional Sn–Pb solder because Pb induces environmental ...is Sn–Ag–Cu solder. Sn–Ag–Cu solder has been expected to apply as highly reliable Pb-free solder, because of better thermal and ...
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Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
... add Ni to Cu-Sn-based ...with Ni = 35 nm, 70 nm, and 150 nm were electrodeposited sequentially using copper pyrophosphate, tin methanesulfonic, and nickel Watts baths, ...
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Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu cored Lead free Solder Balls
... thick Sn-5 mass%Ag solder coating on Cu balls with a diameter of 70 ...with Ni coating over the Cu core, Ni-10 mass%P coating was performed over the Cu core surface by electroless plating ...the ...
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TEM EDX Observations of the Microstructure of Electrodeposited Ni Sn Alloys
... of Ni-Sn alloy deposited from the chloride solutions was analyzed by ...In Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of ...
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Synthesis and Characterization of Pure Ni and Ni Sn Intermetallic Nanoparticles
... the Ni nanoparticles had a sheet or foam like morphology while the XRD pattern showed a broad diffraction line with three small sub-peaks of lower ...contrast, Sn nanopow- der consisted of spherical ...
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A new type of lithium ion battery based on tin electroplated negative electrodes
... All samples deliver high specific capacity; however, the cycle life is poor. The best performance is offered by cells based on sample “Sn-5” having a porous pillars morphology, see Fig. 2E. Under steady-state ...
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Experimental Research of Anticorrosion Performance of Steel with Ni-Sn-P Coating
... The mechanism of the complex reductant used in present study is to improve reduction efficiency by producing more atomic hydrogen by hydrolysis and inhibiting the alkaline hydrolysis process of hypophosphite[13~15]. In ...
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The Influence of Phosphorus Concentration of Electroless Plated Ni P Film on Interfacial Structures in the Joints between Sn Ag Solder and Ni P Alloy Film
... decreased1. 3) Based on these facts, the diffusion velocity of Ni in the 1st layer is thought to be higher than that of Ni in the 2nd ...of Ni–8.5 mass%P sample are much larger than those of ...
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Formation and Thermal Stability of Ni Based Bulk Metallic Glasses in Ni Zr Nb Al System
... the Ni-Zr-Nb-Al system, the negative mixing enthalpy is 44 kJ/mol for Al-Zr, 18 kJ/mol for Al-Nb and 22 kJ/mol for Al-Ni; 20) The atomic radii of Al is ...the Ni-Zr-Nb system satisfies all the above ...
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Synthesis, Characterization and Gas Sensing Performance of PbMnO<sub>3</sub>, PbMnO<sub>3 </sub>: SiO<sub>2</sub> and PbMnO<sub>3 </sub>: Al<sub>2</sub>O<sub>3</sub>
... A particular sensing material shows highest gas response for a particular gas at a particular temperature. Using this method specific gas may be sensed by setting the temperature. Various gases show different energies ...
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Adding Sn on the Performance of Amorphous Brazing Fillers Applied to Brazing TA2 and Q235
... The results show that, the Ti-Zr-Cu-Ni-Sn brazing foils still possess amorphous structure; the melting point of fillers is reducing with the increase of the Sn content; the joint gap tha[r] ...
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Observation on Isothermal Reactive Diffusion between Solid Ni and Liquid Sn
... molten Sn-base sol- der during soldering, and then the Ni layer is contacted with the ...the Ni layer is directly reacted with the solder during soldering and solid-state energization ...the ...
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Fusion reactions of 58,64Ni+124Sn
... channels plays an important role also in the fusion process of heavier systems. A possible confirmation needs an extension of the experimental data to lower cross sections and a comparison with detailed coupled-channels ...
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Intermetallic evolution for isothermal aging up to 2000Hours on Sn 4Ag 0 5Cu and Sn 37Pb solders with Ni/Au layers
... between Sn-4Ag-0.5Cu solder and Ni/Au surface finish with 3 micrometer nickel ...(Cu, Ni) 6 Sn 5 → (Ni, Cu) 3 Sn 4 → Ni 3 Sn 4 ...
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Revealing microscopic origins of shape coexistence in the Ni isotopic chain
... 7-, 3+, 4+, 2+, 4+ and 3- states at 4089, 2971, 3185, 3229, 3614 and 3687 keV depopulated by the 490-, 1546-, 1760-, 1804-, 2189- and 2262-keV lines, ...the 3- state at 3687 keV, no predictions are ...
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