HSD High Speed Data interconnection

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HSD

High Speed Data interconnection

Fast, safe and robust

• Very high data bit rate up to 5 Gbit/s

• SSR “smart strain relief”

enables unstressed solder joints

• Excellent resistance against

cross-talk and RF-EMC

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www.imscs.com HSD

High Speed Data interconnection

This newly developed digital HSD interconnection enables excellent data transmission via LVDS (low voltage differential signaling) by preventing interference both from cross-talk and other external sources. Due to its optimized shielding concept the 100 Ohm impedance matched interconnection works at a superior level. The product´s highlight SSR (smart strain relief) offers a uniquely unstressed soldering joint construction, for PCB types. This SSR feature, in combination with the guiding rib gussets on the connector interface, provide outstanding mechanical mating security and robustness.

Product features

• SSR enables unstressed solder joints for PCB types

• Tilt safety

• Very high data bit rate up to 5 Gbit/s

• Excellent resistance against cross-talk and RF-EMC

• Mechanical robustness according to automotive requirements

• THR and THT capable for automated assemblies

• Mechanical and colour coding prevents mismatching

• Primary & secondary locking mechanism ensures highest interconnection security

Applications

• Infotainment systems

• HD-entertainment systems

• Driver assistance systems

• Telematics applications

• LVDS camera systems

• GVIF video transmission

• IEE 1394, USB, ethernet data links

• Further 100 Ohm high speed data links

Characteristics

• Data bit rate: up to 5 Gbit/s*

• Impedance: 100 Ohm

• Near/far end

cross talk: ≤ 33 dB / ≤ 28 dB

• Frequency range: up to 2 GHz

• Return loss: at 1 GHz ≥ 20 dB;

at 2 GHz ≥ 17 dB

• Mating cycles: ≥ 25

• Lock

retention force: ≥ 110 N

• Further details:

Please refer to product data sheets

* refering to PCB mount plugs Protection of plug pins by “guiding rib gussets”

Protection of jack sockets by “guiding slots”

SSR (smart strain relief) feature

Head Office Germany IMS Connector Systems GmbH Obere Hauptstraße 30 D-79843 Löffingen PO Box 1141 D-79840 Löffingen Tel (+49) 76549010 Fax (+49) 7654901199 E-mail [email protected]

Hungary

IMS Connector Systems Kft Ipar körút 27

H-9400 Sopron

Tel (+36) 99 513 528 Fax (+36) 99 513 514 E-mail [email protected]

China

IMS Connector Systems Ltd No 35, Huo Ju Road

SND Science & Technology Park VCR-Suzhou 215011

Tel (+86) 51268081816 Fax (+86) 51268252388 E-mail [email protected]

Further sales contacts at

www.imscs.com/sales-contacts.html 3 guiding slots

SSR feature 3 guiding rib gussets

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page 1 / 6

4936.HSD.1X10.00Z

colored value means:

still under test target value

Value Unit

100 + / - 10% [Ω]

2 GHz [GHz]

Data bit rate 5 Gbit/s [Gbit/s]

Return loss

1 GHz ≥ 20 dB [dB]

2 GHz ≥ 17 dB [dB]

Insertion loss ≤ 0,1 [dB]

≥ 1x 10

³

[MΩ]

Centre contact ≤ 10 [mΩ]

Outer contact ≤ 7,5 [mΩ]

Contact current max. (DC) ≤ 1,5 [A] DC

Operating voltage max. 100 [V] DC

Proof voltage min. 250 [V] eff

RF Leakage ≥ 75 [dB]

≥ 65 [dB]

Nearend crosstalk ≤ 33 [dB]

Farend crosstalk ≤ 28 [dB]

Skew ( between signal contacts) ≤ 20 [psec]

Value Unit

≤ 30 [N]

≥ 5 [N]

≥ 25

≥ 80 [N]

Retention force locked system ≥ 110 [N]

Date: 02.07.2013 Revision: g

Approved: RBg,MF

Coding efficiency Mating cycles

up to 1 GHz

Separating force

up to 2 GHz

Mechanical characteristics:

Design according to: Standard (Norm)

Electrical characteristics:

Part Number:

Operating frequency up to Impedance ( MIL-C- 39012B)

Contact resistance

angle version

Remarks

Description:

Picture

Engagement force

Remarks

Insulation resistance

PRODUCT DATA SHEET

HSD - pcb mount angle plug

Product data sheet

IMS CONNECTOR SYSTEMS GmbH Obere Hauptstrasse 30 D-79843 Löffingen Postfach 1141 D-79840 Löffingen Tel (+49) 7654 901-0 Fax (+49) 7654 901-199 Net: www.imscs.com

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Product data sheet

page 2 / 6

4936.HSD.1X10.00Z

Rev. Date Alteration Signature

Anpassung der Prüfnormen Toleranz +/-10% hinzu Plating

Wave/SMD solderability edit

c 10.12.2012 HSD Interface value MF

d 25.01.2013 Update MK

e 18.06.2013 Update MF

f 25.06.2013 German version added MF

g 26.06.2013 Panel assembling added MF

Rev. 01

Released 17. Aug 07

Date: 02.07.2013 Revision: g

Approved: RBg,MF

Remarks

Mechanical Shock

b 25.09.2012 MF

a 17.02.2012 RBg

Update History:

Temperature and Humidity

Au min. 0,15 µm

-40°C up to +105°C

Notes:

Operating temperature range

High-Temp. Exposure

Zink alloy

Outer contact Brass

Formblatt-Nr.: Form-TK-012b Thermal shock

Plating

DIN IEC 60068-2-14 Test NA Insulator

Environmental influences:

Vibration (Random)

Part Number:

Description:

Material & plating:

PA 10T/X (UL94-HB)

USCAR 2-4 5.6.2 DIN IEC 60068-2-64

Ni 3-6 µm Centre contact

Cu + Ni Other metal parts

Cap

Zink alloy

-

Cu + Ni +Tin plated LCP (UL 94-V0)

Plastic housing

IEC 60068-2-58 Group 3&4

RoHS (2002/95/EC) conform

DIN IEC 60068-2-2 DIN IEC 60068-2-27

Material

Brass

Solder profile:

PRODUCT DATA SHEET

HSD - pcb mount angle plug

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Product data sheet

page 3 / 6

4936.HSD.1X10.00Z

Soldering methode: Wavebath solderability

Recommended wave soldering profile:

Reference

t

soak

T

1

t

1

t

2

T

peak

Date: 02.07.2013 Revision: g

Approved: RBg,MF

Peak temperature 300°C max.

Temperature gradient in cooling 6°C/second max.

Temperature gradient time 5-6 second

Soldering time 10 second max.

Soak time < 30 second

Preheat temperature < 100° (-5/+5)°C

Description:

Parameter Specification

Temperature gradient in preheating 2°C/s max.

Soldering process:

PRODUCT DATA SHEET

Part Number:

HSD - pcb mount angle plug

Temp. / °C

time / sec.

T

_peak

T

₁

t

_soak

t

₁

t

₂

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Product data sheet

page 4 / 6

4936.HSD.1X10.00Z

Soldering methode: THR solderability

Recommended reflow soldering profile:

Reference C°

Date: 02.07.2013 Revision: g

Approved: RBg,MF

Parameter Specification

Max. Temperature (lead free soldering) 260 °

PRODUCT DATA SHEET

Part Number:

Description:

Soldering process:

HSD - pcb mount angle plug

-40 10 60 110 160 210 260

0 50 100 150 200 250 300

T e m p e ra tu re / ° C

time / sec.

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Product data sheet

page 5 / 6

4936.HSD.1X10.00Z

Date: 02.07.2013 Revision: g

Approved: RBg,MF

PRODUCT DATA SHEET

Part Number:

Description:

SSR ( Smart Strain Relief) :

HSD - pcb mount angle plug

pic. 5: funnel position: pulled endpoint pic. 4: funnel position: pressed endpoint

pic. 3: Average funnel position

pic. 1: Start position, side view pic 2a: Start position, front view pic. 2b: Start position, front view 9,1±0,05

10 ± 0,05

Panel 2

Panel 1 Panel 1

9,1±0,05 5 ± 0,05

6,60

contact point

6,40

contact point

6,80 6,60

± 0,2 Panel assembling:

The panel shall be mounted from the top side. The funnel shaped lane, secure a better guiding of the panel. The panel inside of the

guiding groove is averaged between plastic and dycast housing. The distance 6,60 mm ( pic.1) is the value of the average state.

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Product data sheet

page 6 / 6

4936.HSD.1X10.00Z

Date: 02.07.2013 Revision: g

Approved: RBg,MF

PRODUCT DATA SHEET

Part Number:

Description:

SSR ( Smart Strain Relief) :

HSD - pcb mount angle plug

Requirements:

- The panel must not be sharp -edged at the contact point.

- The panelthickness may vary in the area (X+Y) ≤ 1,10mm+0,03, under the presmise, that at a tensile and pressure load of min. 110N on the center axis, do not cause a deformation on the panel bigger than 0,1mm.