[PDF] Top 20 Effect of Ni or Co Addition to Sn Ag Solder on Microstructure and Joint Strength at Interface

... metallurgical joint. However, the IMC thickness of the interface between the solder and substrate is very important for the reliability of the solder ...the interface and the ... See full document

... eutectic Sn-Pb solder, which is commonly used, is environ- mentally harmful and can potentially affect human ...eutectic Sn-Pb solder are the Sn-Ag based ...eutectic Sn-Pb ... See full document

... the Sn-Ag-Cu alloy also influences the formation of interfacial reaction layer with Ni ...a solder can affect the interfacial reaction and interface ...lead-free solder with a ... See full document

... Cu-core solder balls exhibited shear strength comparable to those using previously alloyed solder ever, fractures began to occur at the joint interface for SB-SA joints due to thermal ... See full document

... the solder joint was carried ...The microstructure of the solder joints were observed using scanning electron microscopy ...bonded interface. To observe the microstructure of the ... See full document

... Currently, Sn-Ag-Cu solders such as ...industry. Sn-Ag-Cu solders are generally harder and less ductile than lead-containing solders like ...of Sn-Ag-Cu solders is their high ... See full document

... of Sn–4.0Ag–0.5Cu solder ball joints, the comparison of intermetallic microstructure was made by SEM ...the solder, finally leaving the interfacial intermetallic ...the addition of Cu ... See full document

... in solder to brittle fracture (i) at the interface between solder and intermetallic compound, (ii) within the intermetallic compound and (iii) between two intermetallic compound ...a solder ... See full document

... shear strength and failure behaviors of the Sn-2.3 mass%Ag flip-chip solder joints before and after corrosion test were ...shear strength, corrosion amount, and fracture mode are ... See full document

... interfacial microstructure and the strength of the solder ...common solder joint failure mode in electronic ...sized solder balls and solder ball bonding pads that are now ... See full document

... the Ni/Au-plated Cu pad, the reaction layers do not uniformly form at the joint interfaces in all the ...the joint interfaces are relatively smaller than those of the joint using the Cu ...SA ... See full document

... the solder and lower frequency of crack formation in the IMC layer, the as-reflow SA joint showed higher impact shear strength than the SAC ...SA joint degraded to the level similar to those of ... See full document

... The specimens were prepared by polishing the end surfaces of the Cu wires using a series of SiC sandpapers (culminating with a final grit size of no. 1200) and then cleaning the wires in a 5 vol%HCl solution. A thin layer ... See full document

... molten solder during soldering. In addition, because of the limited amount of Au concentration, in the solder and solder/pad in- terface, Au or Au–Sn intermetallics may not be ...of ... See full document

... a microstructure of solder joint of Sn–Ag/Ni–P to UBM, at a low magnification, and concentration profiles of Sn, Ni, Ag and P, obtained at points 1–9 by EDX ... See full document

... the Sn-Bi thickness on the shear strength. The electroplated solder balls were placed on the substrate, and were air-reflowed at 473, 493, and 523 ...the solder balls used were 300 mm, and 500 ... See full document

... of Ni-P and Au of 5 mm and ...of Ni-P and Au and a thickness of Pd of ...the solder ball is aligned on the metal pad using an align mask, and then reflow is performed using a reflow machine at a peak ... See full document

... lead-free solder alloys and the constants A and m were measured for the mode I crack propagation, no reports on the mode II crack ...lead-free solder alloy 8) was used in the present ... See full document

... of Si substrate. The solder composition is Sn–3.0Ag–0.5Cu. The diameter of the bumps is 100 mm and the pitch size is 200 mm. As the bonding mate, three different types of film on Si substrate were used. The ... See full document

... Sn­Pb solder to lead-free solder was common goal for the electronic packing and the solder ...lead-free solder materials, the Sn-based solder alloys (Sn­Ag, Sn­Zn, Sn­Cu, ... See full document